Abstract:
Described embodiments provide an electromechanical transducer including a mechanically compliant, elastically deformable array of dielectric shells. A first electrically conductive electrode is disposed on a first surface of the array. A second electrically conductive electrode is disposed on a second surface of the array, where the second surface opposes the first surface. The array is configured to be mechanically compliant and elastically deformable in response to one or more incident forces applied to the electromechanical transducer.
Abstract:
A heavy metal capture composition, devices including the composition, and a method of reducing heavy metal contamination in the environment is described.
Abstract:
The disclosed embodiments provide sensitive pixel arrays formed using solvent-assisted or unassisted release processes. Exemplary devices include detectors arrays, tunable optical instruments, deflectable mirrors, digital micro-mirrors, digital light processing chips, tunable optical micro-cavity resonators, acoustic sensors, acoustic actuators, acoustic transducer devices and capacitive zipper actuators to name a few.
Abstract:
The embodiments disclosed herein are directed to optoelectronic devices based, on ultra-thin, lightweight and in-situ deposited parylene substrates, as well as methods of manufacture. Using a bottom-up approach, a readily releasable parylene thin film can be used for fabricating thin film electronic and optoelectronic systems on the thin and light substrates having thicknesses in the nanometer to low micron range. The disclosed method enables the integration of forming a parylene substrate with, the fabrication of a complete photovoltaic device under a fully contained, controlled environment.
Abstract:
The disclosure relates to a method for depositing films on a substrate which may form part of an LED or other types of display. In one embodiment, the disclosure relates to an apparatus for depositing ink on a substrate. The apparatus includes a chamber for receiving ink; a discharge nozzle having an inlet port and an outlet port, the discharge nozzle receiving a quantity of ink from the chamber at the inlet port and dispensing the quantity of ink from the outlet port; and a dispenser for metering the quantity of ink from the chamber to the inlet port of the discharge nozzle; wherein the chamber receives ink in liquid form having a plurality of suspended particles and the quantity of ink is pulsatingly metered from the chamber to the discharge nozzle; and the discharge nozzle evaporates the carrier liquid and deposits the solid particles on the substrate.
Abstract:
An example methodology implementing the disclosed techniques includes receiving a plurality of measured semiconductor properties of one or more partially completed semiconductor devices, determining a measure of short circuit current density (JSC) of each of the one or more partially completed semiconductor devices, the JSC, measure based on a measure of semiconductor diffusion length (LD) and a measure of thickness, and determining a current voltage relationship of each of the one or more partially completed semiconductor devices. The method also includes calculating a current voltage (JV) curve based on the JSC, measure and the current voltage relationship of each of the one or more partially completed semiconductor devices, wherein the JV curve provides an indication of maximum achievable power point (Pmax) and open circuit voltage (Voc) of a semiconductor device completed from the one or more partially completed semiconductor devices, and determining a predicted performance characteristic of the semiconductor device.
Abstract:
A flow through valve can satisfy the manufacturing constraints encountered when handling materials at high temperatures and low pressures, for example during semiconductor thin-film manufacturing using techniques such as vapor transport deposition.
Abstract:
An electro-optical device can include a plurality of semiconductor nanocrystals. In some circumstances, the device can omit an electron transporting layer.
Abstract:
The disclosure relates to method and apparatus for micro-contact printing of micro-electromechanical systems (“MEMS”) in a solvent-free environment. The disclosed embodiments enable forming a composite membrane over a parylene layer and transferring the composite structure to a receiving structure to form one or more microcavities covered by the composite membrane. The parylene film may have a thickness in the range of about 100 nm-2 microns; 100 nm-1 micron, 200-300 nm, 300-500 nm, 500 nm to 1 micron and 1-30 microns. Next, one or more secondary layers are formed over the parylene to create a composite membrane. The composite membrane may have a thickness of about 100 nm to 700 nm to several microns. The composite membrane's deflection in response to external forces can be measured to provide a contact-less detector. Conversely, the composite membrane may be actuated using an external bias to cause deflection commensurate with the applied bias. Applications of the disclosed embodiments include tunable lasers, microphones, microspeakers, remotely-activated contact-less pressure sensors and the like.
Abstract:
The disclosure relates to a method for depositing films on a substrate which may form part of an LED or other types of display. In one embodiment, the disclosure relates to an apparatus for depositing ink on a substrate. The apparatus includes a chamber for receiving ink; a discharge nozzle having an inlet port and an outlet port, the discharge nozzle receiving a quantity of ink from the chamber at the inlet port and dispensing the quantity of ink from the outlet port; and a dispenser for metering the quantity of ink from the chamber to the inlet port of the discharge nozzle; wherein the chamber receives ink in liquid form having a plurality of suspended particles and the quantity of ink is pulsatingly metered from the chamber to the discharge nozzle; and the discharge nozzle evaporates the carrier liquid and deposits the solid particles on the substrate.