公开(公告)号：US20220187021A1

公开(公告)日：2022-06-16

申请号：US17546497

申请日：2021-12-09

Applicant: Mattson Technology, Inc. ,  Beijing E-Town Semiconductor Technology Co., Ltd.

Inventor： Manuel Sohn ,  Alex Wansidler ,  Dieter Hezler ,  Joseph Cibere ,  Rolf Bremensdorfer ,  Martin Zucker ,  Pete Lembesis ,  Michael Yang

IPC: F27D3/16 ,  F27D21/00 ,  F27D1/00 ,  F27D21/02

Abstract: A processing apparatus for a thermal treatment of a workpiece is presented. The processing apparatus includes a processing chamber, a workpiece support disposed within the processing chamber, a rotation system configured to rotate the workpiece support, a gas delivery system configured to flow one or more process gases into the processing chamber from the a first side of the processing chamber, one or more gas exhaust ports for removing gas from the processing chamber such that a vacuum pressure can be maintained, one or more radiative heating sources disposed on the second side of the processing chamber, one or more dielectric windows disposed between the workpiece support and the one or more radiative heating sources, and a workpiece temperature measurement system configured at a temperature measurement wavelength range to obtain a measurement indicative of a temperature of a back side of the workpiece.

公开(公告)号：US20200243305A1

公开(公告)日：2020-07-30

申请号：US16744244

申请日：2020-01-16

Applicant: Mattson Technology, Inc. ,  Beijing E-Town Semiconductor Technology, Co., LTD

Inventor： Weimin Zeng ,  Chun Yan ,  Dixit V. Desai ,  Hua Chung ,  Michael X. Yang ,  Peter Lembesis ,  Ryan M. Pakulski ,  Martin Zucker

IPC: H01J37/32

Abstract: A plasma process apparatus is provided. The plasma processing apparatus includes a plasma chamber and a processing chamber. The processing chamber includes a substrate holder operable to support a substrate. The plasma processing apparatus further includes a separation grid separating the plasma chamber from the processing chamber. The separation grid includes a gas delivery system. The gas delivery system defines a channel, an inlet and a plurality of outlets in fluid communication with the inlet via the channel. The gas delivery system is configured to reduce non-uniformities associated with a treatment process performed on the substrate.

公开(公告)号：US10049858B2

公开(公告)日：2018-08-14

申请号：US14771525

申请日：2014-05-09

Applicant: Mattson Technology, Inc.

Inventor： Vladimir Nagorny ,  Steven Parks ,  Martin Zucker

IPC: H01J37/32

Abstract: Systems and methods for protecting vacuum seals in a plasma processing system are provided. The processing system can include a vacuum chamber defining a sidewall and an inductive coil wrapped around at least a portion of the sidewall. A vacuum seal can be positioned between the sidewall of the vacuum chamber and a heat sink. A thermally conductive bridge can be coupled between the sidewall and heat sink. Further, the thermally conductive bridge can be positioned relative to the vacuum seal such that the thermally conductive bridge redirects a conductive heat path from the sidewall or any heat source to the heat sink so that the heat path bypasses the vacuum seal.

公开(公告)号：US20160013025A1

公开(公告)日：2016-01-14

申请号：US14771525

申请日：2014-05-09

Applicant: MATTSON TECHNOLOGY, INC.

Inventor： Vladimir Nagorny ,  Steven Parks ,  Martin Zucker

IPC: H01J37/32

CPC classification number: H01J37/32513 ,  H01J37/321 ,  H01J37/32522 ,  H01J2237/166

Abstract: Systems and methods for protecting vacuum seals in a plasma processing system are provided. The processing system can include a vacuum chamber defining a sidewall and an inductive coil wrapped around at least a portion of the sidewall. A vacuum seal can be positioned between the sidewall of the vacuum chamber and a heat sink. A thermally conductive bridge can be coupled between the sidewall and heat sink. Further, the thermally conductive bridge can be positioned relative to the vacuum seal such that the thermally conductive bridge redirects a conductive heat path from the sidewall or any heat source to the heat sink so that the heat path bypasses the vacuum seal.

Abstract translation: 提供了一种在等离子体处理系统中保护真空密封的系统和方法。 处理系统可以包括限定侧壁的真空室和缠绕在侧壁的至少一部分上的感应线圈。 真空密封件可以位于真空室的侧壁和散热器之间。 导热桥可以耦合在侧壁和散热器之间。 此外，导热桥可以相对于真空密封件定位，使得导热桥将导向热路径从侧壁或任何热源重定向到散热器，使得热路径绕过真空密封。