公开(公告)号：US10410962B2

公开(公告)日：2019-09-10

申请号：US15108861

申请日：2015-01-06

Applicant: MC10, Inc.

Inventor： Nicholas McMahon ,  Xianyan Wang ,  Brian Elolampi ,  Bryan D. Keen ,  David G. Garlock

IPC: H01H13/86 ,  H01L21/02 ,  H01L21/48 ,  H01L21/56 ,  H01L21/66 ,  H01L23/00 ,  H01L23/29 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538

Abstract: Encapsulated conformal electronic devices, encapsulated conformal integrated circuit (IC) sensor systems, and methods of making and using encapsulated conformal electronic devices are presented herein. A conformal integrated circuit device is disclosed which includes a flexible substrate with electronic circuitry attached to the flexible substrate. A flexible encapsulation layer is attached to the flexible substrate. The flexible encapsulation layer encases the electronic circuitry between the flexible substrate and the encapsulation layer. For some configurations, the encapsulation layer and flexible substrate arc fabricated from stretchable and bendable non-conductive polymers. The electronic circuitry may comprise an integrated circuit sensor system with multiple device islands that are electrically and physically connected via a plurality of stretchable electrical interconnects.

公开(公告)号：US20170223846A1

公开(公告)日：2017-08-03

申请号：US15119559

申请日：2015-03-04

Applicant: MC10, INC.

Inventor： Brian Elolampi ,  David G. Garlock ,  Harold Gaudette ,  Steven Fastert ,  Adam Standley ,  Yung-Yu Hsu

IPC: H05K5/00 ,  H05K5/06 ,  H05K3/32 ,  H05K1/18

CPC classification number: H05K5/0034 ,  H05K1/181 ,  H05K1/189 ,  H05K3/284 ,  H05K3/32 ,  H05K5/0056 ,  H05K5/006 ,  H05K5/065 ,  H05K2201/09063 ,  H05K2201/09872 ,  H05K2201/10151 ,  H05K2203/1311 ,  H05K2203/1316

Abstract: Encapsulated conformal electronic devices, encapsulated conformal integrated circuit (IC) systems, and methods of making and using encapsulated conformal electronic devices are presented herein. A conformal IC device is disclosed which includes a flexible substrate, electronic circuitry attached to the flexible substrate, and a flexible multi-part encapsulation housing encasing therein the electronic circuitry and flexible substrate. The multi-part housing includes first and second encapsulation housing components. The first encapsulation housing component has recessed regions for seating therein the electronic circuitry, while the second encapsulation housing component has recessed regions for seating therein the flexible substrate. First encapsulation housing component optionally includes a recessed region for seating therein the flexible substrate. Either housing component may include one or more projections that pass through holes in the substrate to engage complementary depressions in the other housing component to thereby align and interlock the encapsulation housing components with the flexible substrate and electronic circuitry.

公开(公告)号：US20160361015A1

公开(公告)日：2016-12-15

申请号：US15183513

申请日：2016-06-15

Applicant: MC10, Inc.

Inventor： Xianyan Wang ,  Roozbeh Ghaffari ,  Pinghung Wei ,  Ji Hyung Suzy Hong ,  Hakan Mutlu ,  Brian Murphy ,  David G. Garlock

IPC: A61B5/00 ,  B32B3/16 ,  B32B27/10 ,  B32B27/18 ,  B32B27/08 ,  B32B7/12 ,  B32B27/26

CPC classification number: A61B5/68335 ,  A61B5/01 ,  A61B5/0402 ,  A61B5/0476 ,  A61B5/0488 ,  A61B5/0531 ,  A61B5/0533 ,  A61B5/0816 ,  A61B5/11 ,  A61B5/4875 ,  A61B5/6832 ,  B32B3/16 ,  B32B3/266 ,  B32B5/022 ,  B32B5/024 ,  B32B5/026 ,  B32B5/18 ,  B32B7/12 ,  B32B25/08 ,  B32B25/12 ,  B32B25/14 ,  B32B25/20 ,  B32B27/08 ,  B32B27/10 ,  B32B27/18 ,  B32B27/26 ,  B32B27/308 ,  B32B27/40 ,  B32B29/00 ,  B32B2262/0253 ,  B32B2262/0261 ,  B32B2262/0276 ,  B32B2262/12 ,  B32B2262/14 ,  B32B2264/108 ,  B32B2307/546 ,  B32B2307/702 ,  B32B2307/726 ,  B32B2307/732 ,  B32B2457/00 ,  B32B2535/00 ,  B32B2556/00 ,  C09J7/29 ,  C09J2201/128

Abstract: The present invention describes breathable multilayered adhesive structures that can be used as adhesives to mount devices onto the skin. The breathable multilayered adhesive structures can comprise moisture-wicking layers adhered to the skin by a porous adhesion layer. The pores allow moisture released from the skin to be transferred away through the moisture-wicking layer. The adhesive structures permit the devices to be skin-mounted for an extended period of time (e.g., a few hours or days) without causing moisture-associated skin injuries such as erythema, maceration, and irritation or inflammation.

Abstract translation: 本发明描述了可用作粘合剂以将装置安装到皮肤上的透气多层粘合剂结构。 透气多层粘合剂结构可以包括通过多孔粘合层粘附到皮肤的吸湿层。 毛孔允许从皮肤释放的水分通过吸湿层转移出去。 粘合剂结构允许装置长时间（例如几小时或几天）皮肤安装，而不会引起与湿气相关的皮肤损伤如红斑，浸渍，刺激或炎症。

公开(公告)号：US20160086909A1

公开(公告)日：2016-03-24

申请号：US14859680

申请日：2015-09-21

Applicant: MC10, Inc.

Inventor： David G. Garlock ,  Xia Li ,  Sanjay Gupta ,  Mitul Dalal

IPC: H01L23/00 ,  H01L23/498

CPC classification number: H01L24/48 ,  G06K19/07779 ,  H01L24/45 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/45118 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/4516 ,  H01L2224/45164 ,  H01L2224/45166 ,  H01L2224/45169 ,  H01L2224/45171 ,  H01L2224/4809 ,  H01L2224/48092 ,  H01L2224/48137 ,  H01L2224/48463 ,  H01L2224/48511 ,  H01L2224/78252 ,  H01L2224/78301 ,  H01L2224/78349 ,  H01L2224/78611 ,  H01L2224/85207 ,  H01L2224/85947 ,  H01L2924/00014 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A capillary tool for use in feeding, bending, and attaching a bonding wire between a pair of bond pads includes a body and a heating element. The body has an internal tube that extends from a first surface of the capillary tool to a second surface of the capillary tool. In some implementations, the internal tube has a portion with a generally helical shape that includes at least a portion of one complete revolution about a central axis of the body. The heating element is coupled to the body to provide a heat affected zone along a portion of the internal tube that heats the bonding wire as the bonding wire is fed through the internal tube.

Abstract translation: 用于在一对接合焊盘之间馈送，弯曲和连接接合线的毛细管工具包括主体和加热元件。 主体具有从毛细管工具的第一表面延伸到毛细管工具的第二表面的内管。 在一些实施方案中，内管具有大致螺旋形状的部分，其包括围绕主体的中心轴的一整圈的至少一部分。 加热元件联接到主体，以沿着内管的一部分提供热影响区域，该内部管道在接合线通过内管进给时加热接合线。

公开(公告)号：US10485118B2

公开(公告)日：2019-11-19

申请号：US15119559

申请日：2015-03-04

Applicant: MC10, Inc.

Inventor： Brian Elolampi ,  David G. Garlock ,  Harold Gaudette ,  Steven Fastert ,  Adam Standley ,  Yung-Yu Hsu

IPC: H05K5/00 ,  H05K1/18 ,  H05K3/28 ,  H05K3/32 ,  H05K5/06

Abstract: Encapsulated conformal electronic devices, encapsulated conformal integrated circuit (IC) systems, and methods of making and using encapsulated conformal electronic devices are presented herein. A conformal IC device is disclosed which includes a flexible substrate, electronic circuitry attached to the flexible substrate, and a flexible multi-part encapsulation housing encasing therein the electronic circuitry and flexible substrate. The multi-part housing includes first and second encapsulation housing components. The first encapsulation housing component has recessed regions for seating therein the electronic circuitry, while the second encapsulation housing component has recessed regions for seating therein the flexible substrate. First encapsulation housing component optionally includes a recessed region for seating therein the flexible substrate. Either housing component may include one or more projections that pass through holes in the substrate to engage complementary depressions in the other housing component to thereby align and interlock the encapsulation housing components with the flexible substrate and electronic circuitry.

公开(公告)号：US20180111353A1

公开(公告)日：2018-04-26

申请号：US15850523

申请日：2017-12-21

Applicant: MC10, Inc.

Inventor： Gilbert Lee Huppert ,  Xianyan Wang ,  Roozbeh Ghaffari ,  Pinghung Wei ,  Ji Hyung Suzy Hong ,  Hakan Mutlu ,  Brian Murphy ,  David G. Garlock

IPC: B32B7/12 ,  B32B27/40 ,  B32B5/02 ,  B32B5/18 ,  B32B25/12 ,  B32B27/30

CPC classification number: B32B7/12 ,  B32B5/022 ,  B32B5/024 ,  B32B5/18 ,  B32B25/12 ,  B32B27/308 ,  B32B27/40 ,  B32B2262/0253 ,  B32B2307/702 ,  B32B2535/00 ,  B32B2556/00

Abstract: The present invention describes multilayered adhesive structures that can be used as adhesives to mount wearable devices onto the skin. The multilayered adhesive structures can comprise a buffer layer sandwiched between two adhesive layers, a first adhesive layer adhering the multilayered adhesive structure to the wearable device and a second adhesive layer adhering the buffer layer to the skin. The buffer layer separates or isolates the wearable device from the skin. By mechanically buffering the wearable device from the skin, the multilayered adhesive structures permit the devices to be skin-mounted for an extended period of time (e.g., a few hours or days) without causing moisture-associated skin injuries such as erythema, maceration, and irritation or inflammation.