公开(公告)号：US20180177011A1

公开(公告)日：2018-06-21

申请号：US15846704

申请日：2017-12-19

Applicant: MELEXIS TECHNOLOGIES NV

Inventor： Jian CHEN ,  Thomas FREITAG ,  Michael BENDER

IPC: H05B33/08 ,  F21V15/01 ,  F21V23/00

CPC classification number: H05B33/0842 ,  F21V15/01 ,  F21V23/003 ,  H01L25/0753 ,  H01L25/167 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: The present invention relates to an integrated-LED device having a housing, whereby the housing comprises a multi-LED device comprising a transparent substrate and a plurality of light emitting diodes, LEDs, arranged for emitting light and disposed on said transparent substrate, an integrated circuit in connection with said LEDs and arranged for controlling said LEDs, a base comprising one or more base extensions, on which at least said multi-LED device is mounted, with said one or more base extensions so arranged or so shaped that a first opening is created to let pass LED light emitted through said transparent substrate by said plurality of LEDs.

公开(公告)号：US20200075466A1

公开(公告)日：2020-03-05

申请号：US16557224

申请日：2019-08-30

Applicant: Melexis Technologies NV

Inventor： Jian CHEN ,  Appolonius Jacobus VAN DER WIEL ,  Laurent OTTE

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/00 ,  H01L23/13 ,  G01L9/00 ,  G01L19/00

Abstract: A method of manufacturing a sensor device (100) comprises providing (200) a package (102) having a first die-receiving subframe volume (104) separated from a second die-receiving subframe volume (106) by a partition wall (116). An elongate sensor element (120) is disposed (202) within the package (102) so as to bridge the first and second subframe volumes (104, 106) and to overlie the partition wall (116). The elongate sensor element (120) resides substantially in the first subframe volume (104) and partially in the second subframe volume (106). The elongate sensor element (120) is electrically connected within the second subframe volume (106).

公开(公告)号：US20170247250A1

公开(公告)日：2017-08-31

申请号：US15445096

申请日：2017-02-28

Applicant: MELEXIS TECHNOLOGIES NV

Inventor： Laurent OTTE ,  Jian CHEN ,  Appolonius Jacobus VAN DER WIEL

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0058 ,  B81B2201/0264 ,  B81B2207/012 ,  B81B2207/07 ,  B81B2207/098 ,  B81B2207/115 ,  B81C1/0023 ,  B81C2203/0792 ,  G01L9/0054 ,  G01L19/0645 ,  G01L19/147 ,  G01L23/24 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/00014

Abstract: A semiconductor pressure sensor assembly for measuring a pressure of an exhaust gas which contains corrosive components, comprising: a first cavity, a pressure sensor comprising first bondpads for electrical interconnection, a CMOS chip comprising second bondpads for electrical interconnection with the pressure sensor, an interconnection module having electrically conductive paths connected via bonding wires to the pressure sensor and to the CMOS chip; the interconnection module being a substrate with corrosion-resistant metal tracks, wherein the CMOS chip and part of the interconnection module are encapsulated by a plastic package.

公开(公告)号：US20170194512A1

公开(公告)日：2017-07-06

申请号：US15463180

申请日：2017-03-20

Applicant: MELEXIS TECHNOLOGIES NV

Inventor： Carl VAN BUGGENHOUT ,  Jian CHEN

IPC: H01L31/0203 ,  H01L31/0216 ,  H01L27/146

CPC classification number: H01L31/0203 ,  H01L27/14618 ,  H01L27/14623 ,  H01L27/14649 ,  H01L27/14685 ,  H01L31/02164

Abstract: Method of encapsulating a semiconductor structure comprising providing a semiconductor structure comprising an opto-electric element located in a cavity formed between a substrate and a cap layer, the cap layer being made of a material transparent to light, and having a flat upper surface; forming at least one protrusion on the cap layer; bringing the at least one protrusion of the cap layer in contact with a tool having a flat surface region, and applying a opaque material to the semiconductor structure where it is not in contact with the tool; and removing the tool thereby providing an encapsulated optical semiconductor device having a transparent window integrally formed with the cap layer.

公开(公告)号：US20240210262A1

公开(公告)日：2024-06-27

申请号：US18541593

申请日：2023-12-15

Applicant: Melexis Technologies NV

Inventor： Ben MAES ,  Jian CHEN ,  Jeroen DIDDEN ,  Appo VAN DER WIEL ,  Cathleen ROOMAN

IPC: G01L19/06

CPC classification number: G01L19/0618

Abstract: A sensor package comprises an active element with a first region and an opposite second region. The first region includes a sensing structure. The second region comprises at least one contact pad. A moulding compound encapsulates the second region and not the first region. The active element comprises at least one conductive line for routing signals from the sensing structure to the contact pad. The projection of the conductive line over the active element corresponds to a portion of the external surface of the active element. The active element comprises at least one dummy track providing a protrusion thereby raising a portion of the surface of the active element to at least the same height as the portion corresponding to the conductive line. These protrusions can receive mechanical pressure from a moulding insert applied during manufacture, relieving pressure over the portion of the surface including the conductive lines.

公开(公告)号：US20200072692A1

公开(公告)日：2020-03-05

申请号：US16557213

申请日：2019-08-30

Applicant: Melexis Technologies NV

Inventor： Laurent OTTE ,  Appolonius Jacobus VAN DER WIEL ,  Jian CHEN

IPC: G01L9/00 ,  G01L19/06

Abstract: A pressure sensor device comprises a device package (110) arranged to define a cavity (116) having an opening for fluid communication with an internal volume thereof. The cavity (116) comprises a side wall (114, 115). An elongate pressure sensor element (100) is provided and has a proximal end (120) and a distal end (122). The side wall (114, 115) is arranged to hold fixedly the proximal end (120) of the pressure sensor element (100) therein so that the pressure sensor element (100) is cantilever-suspended from the side wall (114, 115) within the cavity (116).

公开(公告)号：US20240369415A1

公开(公告)日：2024-11-07

申请号：US18634459

申请日：2024-04-12

Applicant: Melexis Technologies NV

Inventor： Jian CHEN ,  Carl VAN BUGGENHOUT ,  Anastasios PETROPOULOS

IPC: G01J5/20 ,  G01J5/12 ,  H10N19/00

Abstract: A thermal sensor device (100) comprises an integrated circuit die (104) having a first mating side (126) and an external side (128) opposite the mating side (126). A sensor-containing die (102) is disposed in spaced relation with the integrated circuit die (104) so that the first mating side (126) faces a second mating side (114), a portion (144) of the sensor-containing die (102) overhanging the integrated circuit die (104). An electrically conductive circuit path (132, 146, 120, 122) extends from a first opposing surface (134) of the first mating side (126) to a second opposing surface of the second mating side (114) and extends further to the overhanging portion (144) so that a portion of the electrically conductive circuit path (132, 146, 120, 122) also overhangs the integrated circuit die (104). An electrical linkage portion (148) electrically couples to the electrically conductive circuit path (132, 146, 120, 122) at the overhanging portion (144) and extends beyond the external side (128) of the integrated circuit die (104).

公开(公告)号：US20170363492A1

公开(公告)日：2017-12-21

申请号：US15628758

申请日：2017-06-21

Applicant: MELEXIS TECHNOLOGIES NV

Inventor： Jian CHEN ,  Laurent OTTE

IPC: G01L9/00 ,  G01L19/06 ,  G01L19/00 ,  H01L29/84 ,  G01L19/14

CPC classification number: G01L9/0055 ,  G01L9/0042 ,  G01L19/0069 ,  G01L19/0084 ,  G01L19/06 ,  G01L19/0627 ,  G01L19/143 ,  H01L29/84 ,  H01L2224/05554 ,  H01L2224/06 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A semiconductor sensor assembly for use in a corrosive environment comprises a processing device comprising at least one first bondpad of a material which may be corroded by a corrosive component in a corrosive environment; a sensor device comprising at least one second bondpad consisting of and/or being covered by a first corrosion resistant material; at least one bonding wire for making a signal connection between the at least one first bondpad of the processing device and the second bondpad of the sensor device. The processing device is partially overmoulded by a second corrosion resistant material, and is partially exposed to a cavity in the corrosion resistant material, with the sensor device being present in the cavity. A redistribution layer is provided to enable signal connection between the processing device and the sensor device is physically made in the cavity while the second corrosion resistant material covers the first bondpad.