Abstract:
A pressure sensor may measure gas or liquid pressure. A chamber may have an inlet that receives the gas or liquid. A flexible diaphragm may be within the chamber that has a surface exposed to the gas or liquid after it flows through the inlet. A pressure sensor system may sense changes in the flexible diaphragm caused by changes in the pressure of the gas or liquid. A pressure-insensitive sensor system may sense changes in the flexible diaphragm that are not caused by changes in the pressure of the gas or liquid. The pressure-insensitive sensor system may be insensitive to changes in the flexible diaphragm caused by changes in the pressure of the gas or liquid.
Abstract:
A pressure sensor may measure gas or liquid pressure. A chamber may have an inlet that receives the gas or liquid. A flexible diaphragm may be within the chamber that has a surface exposed to the gas or liquid after it flows through the inlet. A pressure sensor system may sense changes in the flexible diaphragm caused by changes in the pressure of the gas or liquid. A pressure-insensitive sensor system may sense changes in the flexible diaphragm that are not caused by changes in the pressure of the gas or liquid. The pressure-insensitive sensor system may be insensitive to changes in the flexible diaphragm caused by changes in the pressure of the gas or liquid.
Abstract:
Stress relief structures and methods that can be applied to MEMS sensors requiring a hermetic seal and that can be simply manufactured are disclosed. The system includes a sensor having a first surface and a second surface, the second surface being disposed away from the first surface, the second surface also being disposed away from a package surface and located between the first surface and the package surface, a number of support members, each support member extending from the second surface to the package surface, the support members being disposed on and operatively connected to only a portion of the second surface. The support member are configured to reduce stress produced by package-sensor interaction.
Abstract:
A pressure sensor system may sense the pressure of a gas or liquid. The system may include a housing that has an entry port for the gas or liquid; a pressure sensor within the housing; and a baffle positioned between the entry port and the pressure sensor. The baffle may have one or more inlets oriented to receive gas or liquid that enters the entry port; one or more outlets oriented to deliver the received gas or liquid to the pressure sensor; and one or more sealed flow channels that prevent the gas or liquid from escaping from the baffle, other than through the one or more outlets. At least one of the outlets may be located within no more than one millimeter of a location on the pressure sensor. The pressure sensor and baffle may be made at the same time during a process of depositing, pattering, etching, wafer bonding, and/or wafer thinning a series of layers using microelectromechanical systems (MEMS) technology.
Abstract:
A pressure sensor may measure gas or liquid pressure. A chamber may have an inlet that receives the gas or liquid. A flexible diaphragm may be within the chamber that has a surface exposed to the gas or liquid after it flows through the inlet. A pressure sensor system may sense changes in the flexible diaphragm caused by changes in the pressure of the gas or liquid. A pressure-insensitive sensor system may sense changes in the flexible diaphragm that are not caused by changes in the pressure of the gas or liquid. The pressure-insensitive sensor system may be insensitive to changes in the flexible diaphragm caused by changes in the pressure of the gas or liquid.
Abstract:
A pressure sensor system may sense the pressure of a gas or liquid. The system may include a housing that has an entry port for the gas or liquid; a pressure sensor within the housing; and a baffle positioned between the entry port and the pressure sensor. The baffle may have one or more inlets oriented to receive gas or liquid that enters the entry port; one or more outlets oriented to deliver the received gas or liquid to the pressure sensor; and one or more sealed flow channels that prevent the gas or liquid from escaping from the baffle, other than through the one or more outlets. At least one of the outlets may be located within no more than one millimeter of a location on the pressure sensor. The pressure sensor and baffle may be made at the same time during a process of depositing, pattering, etching, wafer bonding, and/or wafer thinning a series of layers using microelectromechanical systems (MEMS) technology.
Abstract:
Stress relief structures and methods that can be applied to MEMS sensors requiring a hermetic seal and that can be simply manufactured are disclosed. The system includes a sensor having a first surface and a second surface, the second surface being disposed away from the first surface, the second surface also being disposed away from a package surface and located between the first surface and the package surface, a number of support members, each support member extending from the second surface to the package surface, the support members being disposed on and operatively connected to only a portion of the second surface. The support member are configured to reduce stress produced by package-sensor interaction.
Abstract:
A pressure sensor may measure gas or liquid pressure. A chamber may have an inlet that receives the gas or liquid. A flexible diaphragm may be within the chamber that has a surface exposed to the gas or liquid after it flows through the inlet. A pressure sensor system may sense changes in the flexible diaphragm caused by changes in the pressure of the gas or liquid. A pressure-insensitive sensor system may sense changes in the flexible diaphragm that are not caused by changes in the pressure of the gas or liquid. The pressure-insensitive sensor system may be insensitive to changes in the flexible diaphragm caused by changes in the pressure of the gas or liquid.
Abstract:
Stress relief structures and methods that can be applied to MEMS sensors requiring a hermetic seal and that can be simply manufactured are disclosed. The system includes a sensor having a first surface and a second surface, the second surface being disposed away from the first surface, the second surface also being disposed away from a package surface and located between the first surface and the package surface, a number of support members, each support member extending from the second surface to the package surface, the support members being disposed on and operatively connected to only a portion of the second surface. The support member are configured to reduce stress produced by package-sensor interaction.
Abstract:
Stress relief structures and methods that can be applied to MEMS sensors requiring a hermetic seal and that can be simply manufactured are disclosed. The system includes a sensor having a first surface and a second surface, the second surface being disposed away from the first surface, the second surface also being disposed away from a package surface and located between the first surface and the package surface, a number of support members, each support member extending from the second surface to the package surface, the support members being disposed on and operatively connected to only a portion of the second surface. The support member are configured to reduce stress produced by package-sensor interaction.