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Patent Agency Ranking
公开(公告)号：US20230059740A1
公开(公告)日：2023-02-23
申请号：US17888500
申请日：2022-08-16
Applicant: MPI CORPORATION
Inventor： STOJAN KANEV , MEI-TING LU , SEBASTIAN GIESSMANN
Abstract: A probe system and a machine apparatus thereof are provided. The machine apparatus can be configured for optionally carrying at least one probe assembly. The machine apparatus includes a temperature control carrier module, a machine frame structure and a temperature shielding structure. The temperature control carrier module can be configured for carrying at least one predetermined object. The machine frame structure can be configured for partially covering the temperature control carrier module, and the machine frame structure has a frame opening for exposing the temperature control carrier module. The temperature shielding structure can be disposed on the machine frame structure for partially covering the frame opening, and the temperature shielding structure has a detection opening for exposing the at least one predetermined object. The temperature shielding structure has a gas guiding channel formed thereinside for allowing a predetermined gas in the gas guiding channel.
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公开(公告)号：US20250147067A1
公开(公告)日：2025-05-08
申请号：US18938623
申请日：2024-11-06
Applicant: MPI CORPORATION
Inventor： PO-YI TING , YU-HSUN HSU , TING-AN YEN , SEBASTIAN GIESSMANN
IPC: G01R1/04 , G01R31/28 , G01R31/308
Abstract: A probe system for double side probing includes a chuck having a through hole for a substrate including a DUT to be disposed on the chuck and defined with an edge part supported by the chuck and a central part located correspondingly to the through hole, upper and lower probe devices, including electrical and optical probe devices, disposed above and below the through hole respectively for testing the DUT on top and bottom sides of the substrate, and a support device disposed on the side of the chuck opposite to the electrical probe device. When an electrical probe of the electrical probe device contacts the top or bottom side of the substrate, a supporter of the support device contacts the other side and is located adjacent to the electrical probe with the substrate located therebetween to resist the force from the electrical probe to avoid substrate deformation.
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公开(公告)号：US20250102539A1
公开(公告)日：2025-03-27
申请号：US18973444
申请日：2024-12-09
Applicant: MPI CORPORATION
Inventor： STOJAN KANEV , MEI-TING LU , SEBASTIAN GIESSMANN
Abstract: A probe system and a machine apparatus thereof are provided. The machine apparatus can be configured for optionally carrying at least one probe assembly. The machine apparatus includes a temperature control carrier module, a machine frame structure and a temperature shielding structure. The temperature control carrier module can be configured for carrying at least one predetermined object. The machine frame structure can be configured for partially covering the temperature control carrier module, and the machine frame structure has a frame opening for exposing the temperature control carrier module. The temperature shielding structure can be disposed on the machine frame structure for partially covering the frame opening, and the temperature shielding structure has a detection opening for exposing the at least one predetermined object. The temperature shielding structure has a gas guiding channel formed thereinside for allowing a predetermined gas in the gas guiding channel.
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4.发明公开公开(公告)号：US20230147804A1
公开(公告)日：2023-05-11
申请号：US17979748
申请日：2022-11-02
Applicant: MPI CORPORATION
Inventor： PO-YI TING , TING-AN YEN , YU-HSUN HSU , SEBASTIAN GIESSMANN
CPC classification number: G01N15/0205 , G11B7/135 , H01S5/005
Abstract: An optical path correction subassembly, an optical detection assembly, and an optical detection system are provided. The optical path correction subassembly can be optionally configured to be applied to a light detector. The optical path correction subassembly includes a holder structure and an optical path correction structure carried by the holder structure, and the optical path correction structure has a light beam guiding surface arranged as a reverse inclination inclined relative to a vertical line. The light beam guiding surface of the optical path correction structure can be configured to effectively or accurately guide a predetermined light beam to a light receiving surface of the light detector so as to facilitate collection of the predetermined light beam. The light beam guiding surface of the optical path correction structure can be arranged at an acute angle relative to the light receiving surface of the light detector.
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公开(公告)号：US20230058964A1
公开(公告)日：2023-02-23
申请号：US17871978
申请日：2022-07-24
Applicant: MPI CORPORATION
Inventor： SEBASTIAN GIESSMANN , PO-YI TING
Abstract: An optical detection system and an alignment method for a predetermined target object are provided. The optical detection system includes a chuck stage, an optical detection module, a vision inspection module and a control module. The chuck stage includes a chuck configured for carrying a plurality of predetermined objects to be tested. The optical detection module includes an optical probe device, and the optical probe device is configured to be disposed above the chuck for optically detecting the predetermined object. The vision inspection module includes an image capturing device and an image display device. The image capturing device is configured for capturing a real-time image of the predetermined object in real time, and the image display device is configured for displaying the real-time image of the predetermined object in real time. The control module is configured to execute the alignment method for the predetermined target object.
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