公开(公告)号：US20150014046A1

公开(公告)日：2015-01-15

申请号：US14332269

申请日：2014-07-15

Applicant: MPI CORPORATION

Inventor： Wei-Cheng KU ,  Jun-Liang LAI ,  Chun-Chung HUANG ,  Jing-Zhi HUNG ,  Yung Nan WU ,  Chih-Hao HO

IPC: H05K1/11

CPC classification number: H05K1/116 ,  H05K1/0298 ,  H05K3/429 ,  H05K2201/09845

Abstract: A multilayer circuit board includes a plurality of stacked substrates, a plurality of first conductive lands, and a plurality of second conductive lands. A surface at a side of each of the substrates has an exposed portion which is not covered by the neighboring substrate, wherein each of the first conductive lands is respectively provided on each of the exposed portions. Each of the second conductive lands is provided on the exposed portion of the outermost substrate, wherein each of the substrates has a conductor pattern to be electrically connected to one of the first conductive lands and to one of the second conductive lands.

Abstract translation: 多层电路板包括多个堆叠的衬底，多个第一导电焊盘和多个第二导电焊盘。 每个基板的一侧的表面具有未被相邻基板覆盖的暴露部分，其中每个第一导电焊盘分别设置在每个暴露部分上。 每个第二导电焊盘设置在最外基板的暴露部分上，其中每个基板具有导电图案，以将其电连接到第一导电焊盘之一和第二导电焊盘之一。