公开(公告)号：US20130235535A1

公开(公告)日：2013-09-12

申请号：US13870199

申请日：2013-04-25

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Kazuhiro ISEBO

IPC: H05K1/03 ,  H05K3/00

CPC classification number: H05K1/0306 ,  H05K1/11 ,  H05K3/0044 ,  H05K3/28 ,  H05K3/284 ,  H05K3/4007 ,  H05K3/4629 ,  H05K3/4688 ,  H05K2201/0367 ,  H05K2201/0376 ,  H05K2201/09527 ,  H05K2201/098 ,  Y10T29/4916

Abstract: A composite substrate includes a ceramic substrate including, on at least one surface, a circuit wire on which an electronic component is to be mounted, a plurality of external connection terminals provided on one surface of the ceramic substrate, and a resin layer provided on the one surface of the ceramic substrate. The external connection terminals have a cross sectional area that decreases with increasing distance from the one surface of the ceramic substrate, and end surfaces of the external connection terminals opposite to end surfaces connected to the ceramic substrate are partially or entirely exposed from the resin layer.

Abstract translation: 复合基板包括陶瓷基板，该陶瓷基板在至少一个表面上包括将要安装电子部件的电路线，设置在陶瓷基板的一个表面上的多个外部连接端子和设置在该陶瓷基板上的树脂层 陶瓷基板的一个表面。 外部连接端子的横截面积随陶瓷基板的一个表面的距离的增加而减小，与陶瓷基板连接的端面相对的外部连接端子的端面部分或全部从树脂层露出。