公开(公告)号：US20180013024A1

公开(公告)日：2018-01-11

申请号：US15539430

申请日：2015-12-17

Applicant: Material Concept, Inc.

Inventor： Junichi KOIKE ,  Yuji SUTOU ,  Daisuke ANDO ,  Makoto WADA

IPC: H01L31/048 ,  H01L31/0216 ,  H01L31/0224 ,  H01L31/18

CPC classification number: H01L31/02167 ,  H01L31/02168 ,  H01L31/022466 ,  H01L31/048 ,  H01L31/0481 ,  H01L31/0488 ,  H01L31/1876 ,  Y02E10/50

Abstract: A solar cell module capable of preventing the occurrence of a PID failure in a solar photovoltaic power generation system with a MW capacity, said system being used in a high-temperature high-humidity environment; and a method for manufacturing this solar cell module. A solar cell module which comprises a protection glass material and a sealing material on a light receiving surface side of a substrate, and which also comprises an oxide layer between the substrate and the protection glass material, said oxide layer containing a metal element and silicon. It is preferable that the oxide layer contains at least one metal element selected from the group consisting of magnesium, aluminum, titanium, vanadium, chromium, manganese, zirconium, niobium and molybdenum. It is also preferable that the oxide layer has a refractive index of from 1.5 to 2.3 (inclusive) with respect to incident light having a wavelength of 587 nm.

公开(公告)号：US20170135221A1

公开(公告)日：2017-05-11

申请号：US15319549

申请日：2015-06-02

Applicant: Material Concept, Inc.

Inventor： Junichi KOIKE ,  Yuji SUTOU ,  Daisuke ANDO

IPC: H05K3/12 ,  H01B1/22 ,  B22F3/10 ,  B05D3/04 ,  B05D3/02

CPC classification number: H05K3/1291 ,  B05D3/02 ,  B05D3/04 ,  B22F1/0048 ,  B22F3/10 ,  B22F3/1007 ,  B22F3/1017 ,  B22F2001/0066 ,  B22F2998/10 ,  B22F2999/00 ,  H01B1/00 ,  H01B1/22 ,  H01B5/02 ,  H01B5/14 ,  H01B13/00 ,  H01L21/4867 ,  H05K2203/1157 ,  H05K2203/1476 ,  B22F9/08 ,  B22F2009/0828 ,  B22F2201/02 ,  B22F2201/03 ,  B22F2201/01 ,  B22F2201/013

Abstract: To provide a method for firing a copper paste, which improves sinterability of copper particles for the purpose of forming a copper wiring line that is decreased in the electrical conductivity. A method for firing a copper paste, which comprises: an application step wherein a copper paste is applied over a substrate; a first heating step wherein the substrate is heated in a nitrogen gas atmosphere containing from 500 ppm to 2,000 ppm (inclusive) of an oxidizing gas in terms of volume ratio after the application step, thereby oxidizing and sintering copper particles in the copper paste; and a second heating step wherein the substrate is heated in a nitrogen gas atmosphere containing 1% or more of a reducing gas in terms of volume ratio after the first heating step, thereby reducing the oxidized and sintered copper oxide.

公开(公告)号：US20160329444A1

公开(公告)日：2016-11-10

申请号：US15106963

申请日：2014-12-22

Applicant: Material Concept, Inc.

Inventor： Junichi KOIKE ,  Yuji SUTOU ,  Daisuke ANDO ,  Tri Hai HOANG

IPC: H01L31/0224 ,  H01L31/068 ,  H01L31/18 ,  H01L31/0216

CPC classification number: H01L31/022466 ,  H01L31/02168 ,  H01L31/022425 ,  H01L31/068 ,  H01L31/1884 ,  Y02E10/547

Abstract: The present invention is provided with an interface layer that minimizes interdiffusion between a silicon substrate and copper electrode wiring that are used as a solar cell, that improves the adhesive properties of copper wiring, and that is used to obtain ohmic contact characteristics. This silicon solar cell comprises a silicon substrate and is provided with a metal oxide layer that is formed on the silicon substrate and wiring that is formed on the metal oxide layer and that comprises mainly copper. The metal oxide layer contains (a) one of either titanium or manganese, (b) one of vanadium, niobium, tantalum, or silicon, and (c) at least one of copper and nickel. In addition, the metal oxide layer comprises copper or nickel as metal particles that are diffused in the interior of the metal oxide layer.

Abstract translation: 本发明提供了一种界面层，其最小化用作太阳能电池的硅基板和铜电极布线之间的相互扩散，其改善了铜布线的粘合性能，并且用于获得欧姆接触特性。 该硅太阳能电池包括硅基板，并且设置有形成在硅基板上的金属氧化物层和形成在金属氧化物层上并且主要包括铜的布线。 金属氧化物层包含（a）钛或锰中的一种，（b）钒，铌，钽或硅中的一种，和（c）铜和镍中的至少一种。 此外，金属氧化物层包含铜或镍作为在金属氧化物层的内部扩散的金属颗粒。

公开(公告)号：US20180097128A1

公开(公告)日：2018-04-05

申请号：US15559258

申请日：2016-03-07

Applicant: Material Concept, Inc.

Inventor： Junichi KOIKE ,  Makoto WADA ,  Yuji SUTOU ,  Daisuke ANDO

IPC: H01L31/0224 ,  H01L31/05

CPC classification number: H01L31/022425 ,  H01L31/0512 ,  H01L31/068 ,  Y02E10/547

Abstract: Provided is a solar cell device wherein: a Cu-containing metal layer exhibits good adhesion strength with respect to an Si substrate and a tab wire; and diffusion of Cu into the substrate and an Ag finger wiring line is suppressed. Provided is a solar cell device which comprises a silicon semiconductor substrate, a Cu-containing metal layer, an Ag-containing finger wiring line, and an interface layer containing an oxide or an organic compound. The Ag-containing finger wiring line is formed on the light receiving surface of the silicon semiconductor substrate; the interface layer is formed on the light receiving surface of the silicon semiconductor substrate; and the Cu-containing metal layer is formed on the interface layer and is arranged at a distance from the Ag-containing finger wiring line.