公开(公告)号：US20040236201A1

公开(公告)日：2004-11-25

申请号：US10881955

申请日：2004-06-29

Applicant: MEDTRONIC MINIMED, INC.

Inventor： Ronald J. Lebel ,  Rajiv Shah ,  Yanan Zhang ,  Edward Chernoff ,  Rudolph A. Montalvo

IPC: A61B005/00

CPC classification number: A61N1/05 ,  A61B5/145 ,  A61B5/14532 ,  A61B5/1473 ,  A61B5/14865 ,  Y10T29/49204

Abstract: A sensing apparatus with a connector, a sensor lead and a sensor module with a spacer placed over electrodes that have been deposited on a substrate. The spacer may have a space for receiving an enzyme. End portions of the sensor module may be encapsulated, such as with molded beads. A sensor lead may attach to the sensor module and may have an outer tubing that passes over the module and attaches to the beads at the end of the sensor module. The sensor lead may also attach to the connector such that the sensing apparatus may be electrically coupled to a pump, electronics or other devices. The sensing apparatus may be implanted into a vein or artery.

Abstract translation: 具有连接器，传感器引线和传感器模块的感测装置，其具有放置在已经沉积在基板上的电极上的隔离物。 间隔物可以具有用于接受酶的空间。 传感器模块的端部可以被封装，例如用模制的珠子。 传感器引线可以附接到传感器模块，并且可以具有穿过模块并且附接到传感器模块的端部处的珠的外管。 传感器引线还可以附接到连接器，使得感测装置可以电耦合到泵，电子设备或其他装置。 感测装置可以植入静脉或动脉。

公开(公告)号：US20040223875A1

公开(公告)日：2004-11-11

申请号：US10861976

申请日：2004-06-04

Applicant: Medtronic MiniMed, Inc.

Inventor： Shaun Pendo ,  Rajiv Shah ,  Edward Chernoff

IPC: G01N021/00

CPC classification number: H05K3/28 ,  A61B5/0006 ,  H05K1/0306 ,  H05K3/4061 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0317 ,  H05K2201/09472 ,  H05K2203/082 ,  H05K2203/085 ,  H05K2203/1147 ,  H05K2203/1476 ,  H05K2203/1572 ,  H05K2203/308

Abstract: A substrate with hermetically sealed vias extending from one side of the substrate to another and a method for fabricating same. The vias may be filled with a conductive material such as, for example, a fritless ink. The conductive path formed by the conductive material aids in sealing one side of the substrate from another. One side of the substrate may include a sensing element and another side of the substrate may include sensing electronics.

Abstract translation: 具有从衬底的一侧延伸到另一侧的气密密封通孔的衬底及其制造方法。 通孔可以填充有导电材料，例如无油墨。 由导电材料形成的导电路径有助于将基板的一侧与另一侧密封。 衬底的一侧可以包括感测元件，并且衬底的另一侧可以包括感测电子器件。