公开(公告)号：US20040137547A1

公开(公告)日：2004-07-15

申请号：US10715143

申请日：2003-11-17

Applicant: Medtronic MiniMed, Inc.

Inventor： Rajiv Shah ,  Bahar Reghabi

IPC: C12Q001/54 ,  C07H021/04 ,  C12N001/16 ,  C12N001/18 ,  C12N009/02

CPC classification number: C12N9/0006

Abstract: A method for formulating a glucose oxidase enzyme with peroxide resistant properties and a glucose oxidase enzyme formulated by the method. The enzyme formulation method results in a glucose oxidase enzyme with improve resistance to peroxide, and therefore, with improved resistance to oxidative inactivation. The method employs directed evolution techniques to evolve glucose oxidase to achieve the desirable properties. A peroxide resistant glucose oxidase may improve the longevity of, for example, glucose biosensors in which a peroxide resistant glucose oxidase may be placed.

Abstract translation: 一种配制具有过氧化物抗性的葡萄糖氧化酶的方法和通过该方法配制的葡萄糖氧化酶。 酶制剂方法导致葡萄糖氧化酶具有改善的对过氧化物的耐受性，因此具有改善的对氧化失活的抗性。 该方法采用定向进化技术来发展葡萄糖氧化酶以达到理想的性质。 过氧化物葡萄糖氧化酶可以改善例如可以放置过氧化物葡萄糖氧化酶的葡萄糖生物传感器的寿命。

公开(公告)号：US20040064156A1

公开(公告)日：2004-04-01

申请号：US10335574

申请日：2002-12-31

Applicant: MEDTRONIC MINIMED, INC.

Inventor： Rajiv Shah ,  Yanan Zhang ,  Rebecca Gottlieb ,  Bahar Reghabi ,  Michael E. Miller

IPC: A61N001/18

CPC classification number: A61B5/14532 ,  A61B5/14865 ,  A61B5/686 ,  A61B2562/02 ,  G01N33/5438 ,  Y10T29/49002 ,  Y10T29/49007 ,  Y10T29/49128 ,  Y10T29/49155

Abstract: A method and apparatus for enhancing the integrity of an implantable sensor. Voids formed between an outer tubing and a sensor substrate or spacing element may be back-filled with a curable, implantable material, minimizing the extent to which unwanted fluids diffuse within the sensor. An enzyme or protein matrix pellet below the sensor window may be pre-treated with a reducing agent to enhance its bond stability, and to reduce undesired swelling that may cause the sensor window to detach or leak. The bonding between the enzyme pellet and a hydrogel layer may be reinforced by application of an intervening bonding layer of a protein material, such as human serum albumin (HSA). The size of the window may be minimized by minimizing the size of an underlying electrode, providing reduced flux and lengthening sensor. A coating may be deposited on the surface of the sensor leads, providing stiffening and lubrication.

Abstract translation: 一种用于增强可植入传感器的完整性的方法和装置。 形成在外管和传感器基底或间隔元件之间的空隙可以用可固化的可植入材料反填充，从而最小化不希望的流体在传感器内扩散的程度。 传感器窗口下面的酶或蛋白质基质颗粒可以用还原剂进行预处理，以增强其粘合稳定性，并减少可能导致传感器窗口分离或泄漏的不期望的膨胀。 可以通过使用诸如人血清白蛋白（HSA）的蛋白质材料的介入粘合层来增强酶颗粒与水凝胶层之间的结合。 通过最小化底层电极的尺寸，提供减小的通量和延长传感器，可以使窗口的尺寸最小化。 涂层可沉积在传感器引线的表面上，提供加强和润滑。

公开(公告)号：US20040223875A1

公开(公告)日：2004-11-11

申请号：US10861976

申请日：2004-06-04

Applicant: Medtronic MiniMed, Inc.

Inventor： Shaun Pendo ,  Rajiv Shah ,  Edward Chernoff

IPC: G01N021/00

CPC classification number: H05K3/28 ,  A61B5/0006 ,  H05K1/0306 ,  H05K3/4061 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0317 ,  H05K2201/09472 ,  H05K2203/082 ,  H05K2203/085 ,  H05K2203/1147 ,  H05K2203/1476 ,  H05K2203/1572 ,  H05K2203/308

Abstract: A substrate with hermetically sealed vias extending from one side of the substrate to another and a method for fabricating same. The vias may be filled with a conductive material such as, for example, a fritless ink. The conductive path formed by the conductive material aids in sealing one side of the substrate from another. One side of the substrate may include a sensing element and another side of the substrate may include sensing electronics.

Abstract translation: 具有从衬底的一侧延伸到另一侧的气密密封通孔的衬底及其制造方法。 通孔可以填充有导电材料，例如无油墨。 由导电材料形成的导电路径有助于将基板的一侧与另一侧密封。 衬底的一侧可以包括感测元件，并且衬底的另一侧可以包括感测电子器件。

公开(公告)号：US20040212076A1

公开(公告)日：2004-10-28

申请号：US10845002

申请日：2004-05-12

Applicant: Medtronic MiniMed, Inc.

Inventor： Rajiv Shah ,  Shaun Pendo ,  Edward G. Babiracki

IPC: H01L023/48

CPC classification number: H01L21/4857 ,  H01L2924/0002 ,  H05K1/092 ,  H05K3/4061 ,  H05K3/4647 ,  H05K3/4667 ,  H05K3/467 ,  H05K2201/0179 ,  H05K2203/0278 ,  H01L2924/00

Abstract: A multilayer substrate device formed from a base substrate and alternating metalization layers and dielectric layers. Each layer is formed without firing. Vias may extend through one of the dielectric layers such that two metalization layers surrounding the dielectric layers make. contact with each other. The vias may be formed by placing pillars on top of a metalization layer, forming a dielectric layer on top of the metalization layer and surrounding the pillars, and removing the pillars. Dielectric layers may be followed by other dielectric layers and metalization layers may be followed by other metalization layers. Vias in the substrate may be filled by forming an assembly around the substrate, the assembly including printing sheets containing a conductive ink and pressure plates for applying pressure. A vacuum may be applied to remove air in the ink. Pressure may then be applied to the printing sheets through the pressure plates. The conductive ink in the printing sheets is pushed through the vias when pressure is applied by the pressure plates.

Abstract translation: 由基底基板和交替的金属化层和电介质层形成的多层衬底器件。 每层形成而不烧制。 通孔可以延伸穿过介电层之一，使得包围电介质层的两个金属化层形成。 互相接触。 可以通过将金属化层顶部放置柱子形成通孔，在金属化层的顶部上形成电介质层并围绕柱子，并移除支柱。 电介质层之后可以是其它电介质层，金属化层之后可以是其它金属化层。 可以通过在基板周围形成组件来填充基板中的通孔，该组件包括含有导电油墨的印刷纸和用于施加压力的压力板。 可以施加真空以除去油墨中的空气。 然后可以通过压力板将压力施加到印刷纸上。 当通过压力板施加压力时，打印纸中的导电油墨被推过通孔。

公开(公告)号：US20040236201A1

公开(公告)日：2004-11-25

申请号：US10881955

申请日：2004-06-29

Applicant: MEDTRONIC MINIMED, INC.

Inventor： Ronald J. Lebel ,  Rajiv Shah ,  Yanan Zhang ,  Edward Chernoff ,  Rudolph A. Montalvo

IPC: A61B005/00

CPC classification number: A61N1/05 ,  A61B5/145 ,  A61B5/14532 ,  A61B5/1473 ,  A61B5/14865 ,  Y10T29/49204

Abstract: A sensing apparatus with a connector, a sensor lead and a sensor module with a spacer placed over electrodes that have been deposited on a substrate. The spacer may have a space for receiving an enzyme. End portions of the sensor module may be encapsulated, such as with molded beads. A sensor lead may attach to the sensor module and may have an outer tubing that passes over the module and attaches to the beads at the end of the sensor module. The sensor lead may also attach to the connector such that the sensing apparatus may be electrically coupled to a pump, electronics or other devices. The sensing apparatus may be implanted into a vein or artery.

Abstract translation: 具有连接器，传感器引线和传感器模块的感测装置，其具有放置在已经沉积在基板上的电极上的隔离物。 间隔物可以具有用于接受酶的空间。 传感器模块的端部可以被封装，例如用模制的珠子。 传感器引线可以附接到传感器模块，并且可以具有穿过模块并且附接到传感器模块的端部处的珠的外管。 传感器引线还可以附接到连接器，使得感测装置可以电耦合到泵，电子设备或其他装置。 感测装置可以植入静脉或动脉。

公开(公告)号：US20040143173A1

公开(公告)日：2004-07-22

申请号：US10452521

申请日：2003-06-02

Applicant: MEDTRONIC MINIMED, INC.

Inventor： Bahar Reghabi ,  Rajiv Shah ,  Eunjoo Jin ,  Rebecca Gottlieb ,  Michael E. Miller ,  Nannette M. Van Antwerp ,  Bradley J. Enegren ,  William P. Van Antwerp ,  John J. Mastrototaro

IPC: A61B005/00 ,  A61M031/00

CPC classification number: A61B5/14532 ,  A61B5/076 ,  A61B5/14503 ,  A61B5/14546 ,  A61B5/1459 ,  A61B5/14865 ,  A61M39/0208

Abstract: A reusable analyte sensor site for use with a replaceable analyte sensor for determining a level of an analyte includes a site housing and a resealable insertion site coupled to one end of the site housing. Preferably, the site housing is formed to have an interior cavity, and includes an outer membrane made of a material selected to promote vascularization and having a first pore size, and an inner membrane made of a material selected to be free of tissue ingress. Also, the site housing permits the analyte to pass through the site housing to the interior cavity to permit measurement by the replaceable analyte sensor. The resealable insertion site is provided for inserting the replaceable analyte sensor into the interior cavity of the site housing.

Abstract translation: 与用于确定分析物水平的可更换分析物传感器一起使用的可重复使用的分析物传感器位点包括与站点外壳的一端连接的现场外壳和可重新密封的插入位置。 优选地，所述部位壳体形成为具有内部空腔，并且包括由选择用于促进血管形成并具有第一孔径的材料制成的外膜和由选择为不具有组织进入的材料制成的内膜。 此外，现场外壳允许分析物通过现场外壳进入内腔，以允许通过可更换的分析物传感器进行测量。 可重新密封的插入位置用于将可更换的分析物传感器插入到现场外壳的内部空腔中。

公开(公告)号：US20040061232A1

公开(公告)日：2004-04-01

申请号：US10331186

申请日：2002-12-26

Applicant: MEDTRONIC MINIMED, INC.

Inventor： Rajiv Shah ,  Shaun Pendo ,  Edward G. Babiracki

IPC: H01L021/4763

CPC classification number: H01L21/4857 ,  H01L2924/0002 ,  H05K1/092 ,  H05K3/4061 ,  H05K3/4647 ,  H05K3/4667 ,  H05K3/467 ,  H05K2201/0179 ,  H05K2203/0278 ,  H01L2924/00

Abstract: A multilayer substrate device formed from a base substrate and alternating metalization layers and dielectric layers. Each layer is formed without firing. Vias may extend through one of the dielectric layers such that two metalization layers surrounding the dielectric layers make contact with each other. The vias may be formed by placing pillars on top of a metalization layer, forming a dielectric layer on top of the metalization layer and surrounding the pillars, and removing the pillars. Dielectric layers may be followed by other dielectric layers and metalization layers may be followed by other metalization layers. Vias in the substrate may be filled by forming an assembly around the substrate, the assembly including printing sheets containing a conductive ink and pressure plates for applying pressure. A vacuum may be applied to remove air in the ink. Pressure may then be applied to the printing sheets through the pressure plates. The conductive ink in the printing sheets is pushed through the vias when pressure is applied by the pressure plates.

Abstract translation: 由基底基板和交替的金属化层和电介质层形成的多层衬底器件。 每层形成而不烧制。 通孔可以延伸穿过介电层之一，使得围绕电介质层的两个金属化层彼此接触。 可以通过将金属化层顶部放置柱子形成通孔，在金属化层的顶部上形成电介质层并围绕柱子，并移除支柱。 电介质层之后可以是其它电介质层，金属化层之后可以是其它金属化层。 可以通过在基板周围形成组件来填充基板中的通孔，该组件包括含有导电油墨的印刷纸和用于施加压力的压力板。 可以施加真空以除去油墨中的空气。 然后可以通过压力板将压力施加到印刷纸上。 当通过压力板施加压力时，打印纸中的导电油墨被推过通孔。

公开(公告)号：US20040220517A1

公开(公告)日：2004-11-04

申请号：US10850637

申请日：2004-05-20

Applicant: Medtronic MiniMed, Inc.

Inventor： Timothy J. Starkweather ,  Ronald J. Lebel ,  Rajiv Shah ,  Michael E. Miller

IPC: A61M031/00

CPC classification number: A61M5/1723 ,  A61M5/172 ,  A61M2005/14208 ,  A61M2230/201 ,  G06F19/00 ,  G06F19/3468 ,  G16H50/30

Abstract: A system and method for providing closed loop infusion formulation delivery which accurately calculates a delivery amount based on a sensed biological state by adjusting an algorithm's programmable control parameters. The algorithm calculates a delivery amount having proportional, derivative, and basal rate components. The control parameters may be adjusted in real time to compensate for changes in a sensed biological state that may result from daily events. Safety limits on the delivery amount may be included in the algorithm. The algorithm may be executed by a computing element within a process controller for controlling closed loop infusion formulation delivery. The biological state is sensed by a sensing device which provides a signal to the controller. The controller calculates an infusion formulation delivery amount based on the signal and sends commands to an infusion formulation delivery device which delivers an amount of infusion formulation determined by the commands.

公开(公告)号：US20040061234A1

公开(公告)日：2004-04-01

申请号：US10671996

申请日：2003-09-26

Applicant: MEDTRONIC MINIMED, INC.

Inventor： Rajiv Shah ,  Shaun Pendo

IPC: H01L023/48

CPC classification number: H05K3/467 ,  H01L21/4857 ,  H01L21/4867 ,  H01L2924/0002 ,  H01L2924/19107 ,  H05K1/162 ,  H05K3/048 ,  H05K3/4053 ,  H05K3/4061 ,  H05K3/4664 ,  H05K2201/0179 ,  H05K2203/0278 ,  H05K2203/085 ,  H05K2203/1476 ,  H05K2203/308 ,  H01L2924/00

Abstract: A multilayer circuit substrate for multi-chip modules or hybrid circuits includes a dielectric base substrate, conductors formed on the base substrate and a vacuum deposited dielectric thin film formed over the conductors and the base substrate. The vacuum deposited dielectric thin film is patterned using sacrificial structures formed by shadow mask techniques. Substrates formed in this manner enable significant increases in interconnect density and significant reduction of over-all substrate thickness.

Abstract translation: 用于多芯片模块或混合电路的多层电路衬底包括介质基底，形成在基底衬底上的导体和形成在导体和基底衬底上的真空沉积的电介质薄膜。 使用由荫罩技术形成的牺牲结构对真空沉积的电介质薄膜进行图案化。 以这种方式形成的基板能够显着增加互连密度并显着降低总体衬底厚度。

公开(公告)号：US20030220552A1

公开(公告)日：2003-11-27

申请号：US10365279

申请日：2003-02-12

Applicant: MEDTRONIC MINIMED, INC.

Inventor： Bahar Reghabi ,  Rajiv Shah ,  Eunjoo Jin ,  Rebecca Gottlieb ,  Michael E. Miller ,  Nannette M. Van Antwerp ,  Bradley J. Enegren ,  William P. Van Antwerp ,  John J. Mastrototaro

IPC: A61B005/00

CPC classification number: A61B5/14532 ,  A61B5/076 ,  A61B5/14503 ,  A61B5/14546 ,  A61B5/1459 ,  A61B5/14865 ,  A61M39/0208

Abstract: A reusable analyte sensor site for use with a replaceable analyte sensor for determining a level of an analyte includes a site housing material and a resealable insertion site coupled to one end of the site housing material. Preferably, the site housing material is formed to have an interior cavity with an opening. The site housing material is selected to promote tissue ingrowth and vascularization, and yet be free of tissue ingress. Also, the site housing material permits the analyte to pass through the site housing material to the interior cavity to permit measurement by the replaceable analyte sensor. The resealable insertion site provides a for inserting the replaceable analyte sensor into the interior cavity of the site housing material.

Abstract translation: 与用于确定分析物水平的可更换分析物传感器一起使用的可重复使用的分析物传感器位点包括与场地外壳材料的一端连接的部位外壳材料和可重新密封的插入位置。 优选地，所述场地外壳材料形成为具有带有开口的内部空腔。 选择场地外壳材料以促进组织向内生长和血管形成，并且没有组织进入。 此外，现场外壳材料允许分析物通过现场外壳材料通过内部空腔，以允许通过可更换的分析物传感器进行测量。 可重新密封的插入位置提供用于将可更换的分析物传感器插入到场地外壳材料的内部空腔中。