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公开(公告)号：US20190337291A1
公开(公告)日：2019-11-07
申请号：US16400949
申请日：2019-05-01
Applicant: MEMJET TECHNOLOGY LIMITED
Inventor： Elmer Dimaculangan Perez , Angus North , Graeme Lowe , See-Huat Tan , Christopher Barton
Abstract: A MEMS chip assembly including: a support structure having a chip mounting surface; a MEMS chip mounted on the chip mounting surface, each MEMS chip having an active surface including one or more MEMS devices and a plurality of bond pads disposed alongside a connection edge of the MEMS chip; electrical connectors connected to the bond pads; and an encapsulant material covering the electrical connectors. The MEMS chip has encapsulant-retaining trenches defined in the active surface extending alongside the connection edge, each encapsulant-retaining trench being disposed between the bond pads and the MEMS devices.
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Patent Agency Ranking
公开(公告)号：US11951736B2
公开(公告)日：2024-04-09
申请号：US17847048
申请日：2022-06-22
Applicant: Memjet Technology Limited
Inventor： Michael Hudson , David Burke , Qing Chen , Graeme Lowe , Jason Mark Thelander , Ellaine Munton
CPC classification number: B41J2/04531 , B41J2/145 , B41J2/175
Abstract: An inkjet printing system includes: (a) an inkjet printhead having a rigid elongate manifold with first and second parallel ink supply channels extending along a length of the manifold between respective ink ports positioned at opposite ends thereof; and a plurality of printhead chips mounted to a lower surface of the manifold, the ink supply channels supplying ink to the printhead chips via ink outlets defined in the lower surface. One end of the manifold has a first ink inlet port for the first ink supply channel and an ink outlet port for the second ink supply channel. The other end of the manifold has a first ink outlet port for the first ink supply channel and a second ink inlet port for the second ink supply channel. An ink delivery system is configured to flow ink along the first and second channels in opposite directions.
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公开(公告)号：US12059898B2
公开(公告)日：2024-08-13
申请号：US17096892
申请日：2020-11-12
Applicant: MEMJET TECHNOLOGY LIMITED
Inventor： Elmer Dimaculangan Perez , Angus North , Graeme Lowe , See-Huat Tan , Christopher Barton
CPC classification number: B41J2/145 , B41J2/04541 , B41J2/14024 , B41J2/14072 , B41J2/1601 , B81B7/0032 , B41J2202/15 , B81B2201/052
Abstract: A MEMS chip assembly includes: a support structure having a chip mounting surface; a MEMS chip mounted on the chip mounting surface, the MEMS chip having an active surface including one or more rows of MEMS devices and a row of bond pads disposed alongside a connection edge of the MEMS chip and parallel with the rows of MEMS devices; electrical connectors connected to the bond pads; and an encapsulant material covering the electrical connectors. The MEMS chip has a plurality of trenches defined in the active surface, the trenches extending parallel with the rows of MEMS devices and disposed between the bond pads and the MEMS devices. The encapsulant material does not encroach past the trenches towards the MEMS devices.
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公开(公告)号：US20190337292A1
公开(公告)日：2019-11-07
申请号：US16400958
申请日：2019-05-01
Applicant: MEMJET TECHNOLOGY LIMITED
Inventor： Elmer Dimaculangan Perez , Angus North , Graeme Lowe , See-Huat Tan , Christopher Barton
IPC: B41J2/145
Abstract: An inkjet printhead includes: an elongate support having a printhead mounting surface; a plurality of butting printhead chips mounted on the printhead mounting surface, each printhead chip having an ink ejection surface including one or more nozzle rows; and a grout material disposed between butting edges of each butting pair of printhead chips. Each printhead chip has a grouting trench defined in the ink ejection surface, the grouting trench extending alongside at least one butting edge and the grouting trench being disposed between an endmost nozzle of each nozzle row and the butting edge.
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公开(公告)号：US20210061467A1
公开(公告)日：2021-03-04
申请号：US17096892
申请日：2020-11-12
Applicant: MEMJET TECHNOLOGY LIMITED
Inventor： Elmer Dimaculangan Perez , Angus North , Graeme Lowe , See-Huat Tan , Christopher Barton
Abstract: A MEMS chip assembly includes: a support structure having a chip mounting surface; a MEMS chip mounted on the chip mounting surface, the MEMS chip having an active surface including one or more rows of MEMS devices and a row of bond pads disposed alongside a connection edge of the MEMS chip and parallel with the rows of MEMS devices; electrical connectors connected to the bond pads; and an encapsulant material covering the electrical connectors. The MEMS chip has a plurality of trenches defined in the active surface, the trenches extending parallel with the rows of MEMS devices and disposed between the bond pads and the MEMS devices. The encapsulant material does not encroach past the trenches towards the MEMS devices.
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公开(公告)号：US10850517B2
公开(公告)日：2020-12-01
申请号：US16400958
申请日：2019-05-01
Applicant: MEMJET TECHNOLOGY LIMITED
Inventor： Elmer Dimaculangan Perez , Angus North , Graeme Lowe , See-Huat Tan , Christopher Barton
Abstract: An inkjet printhead includes: an elongate support having a printhead mounting surface; a plurality of butting printhead chips mounted on the printhead mounting surface, each printhead chip having an ink ejection surface including one or more nozzle rows; and a grout material disposed between butting edges of each butting pair of printhead chips. Each printhead chip has a grouting trench defined in the ink ejection surface, the grouting trench extending alongside at least one butting edge and the grouting trench being disposed between an endmost nozzle of each nozzle row and the butting edge.
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