Stress-sensitive micro-electromechanical device and use thereof
    3.
    发明授权
    Stress-sensitive micro-electromechanical device and use thereof 有权
    应力敏感微机电装置及其应用

    公开(公告)号:US08916944B2

    公开(公告)日:2014-12-23

    申请号:US13583392

    申请日:2011-03-15

    CPC classification number: B81B3/0072 B81B2201/0257 B81B2201/0264

    Abstract: The micro-electromechanical device has a substrate. Integrated into the substrate is a micromechanical component that has a bending element which can be bent reversibly and which has a first end connected to the substrate and extends from the first end over a free space. The bending element has at least one web having two side edges, the course of which is defined by depressions introduced into the bending element and adjacent to the side edges. In order to form a homogenization region located within the web, in which mechanical stresses occurring during bending of the bending element are substantially equal, the mutual spacing of the side edges of the web decreases, as viewed from the first end of the bending element. The device further comprises at least one microelectronic component that is sensitive to mechanical stresses and embedded in the web in the homogenization region of the latter.

    Abstract translation: 微机电装置具有基板。 集成到衬底中的是一种微机械部件,其具有可逆地弯曲的弯曲元件,并且其具有连接到衬底的第一端并且在第一端部在自由空间上延伸。 弯曲元件具有至少一个腹板,该腹板具有两个侧边缘,其边缘由通过弯曲元件并靠近侧边缘的凹陷限定。 为了形成位于纤维网内的均质化区域,其中在弯曲元件的弯曲期间发生的机械应力基本上相等,从弯曲元件的第一端看,幅材的侧边缘的相互间隔减小。 该装置还包括至少一个对机械应力敏感的微电子部件,并且嵌入在后者的均匀化区域中的网中。

    MICROELECTROMECHANICAL COMPONENT AND METHOD FOR TESTING A MICROELECTROMECHANICAL COMPONENT
    4.
    发明申请
    MICROELECTROMECHANICAL COMPONENT AND METHOD FOR TESTING A MICROELECTROMECHANICAL COMPONENT 有权
    微电子元件和微电子元件测试方法

    公开(公告)号:US20130305804A1

    公开(公告)日:2013-11-21

    申请号:US13981506

    申请日:2012-01-27

    Abstract: The microelectromechanical component has a semiconductor substrate (1), which has a cavity (2a) formed in the semiconductor substrate. The cavity is covered by a reversibly deformable membrane (2). A sensor (17) for detecting a deformation of the membrane (2) is formed within the region of the membrane (2). A test actuator (28, 29, 30) for deforming the membrane (2) for testing purposes is also arranged within the region of the membrane (2). Finally, the microelectromechanical component has an evaluation and activation unit (41) connected to the sensor (17) and the test actuator (28, 29, 30) for activating the test actuator (28, 29, 30) in order to deform the membrane (2) as a test and for evaluating a measurement signal of the sensor (17) as a sensor detection of a deformation of the membrane (2) as a result of the activation of the test actuator (28, 29, 30).

    Abstract translation: 微电子部件具有半导体基板(1),该半导体基板具有在半导体基板中形成的空腔(2a)。 空腔被可逆变形的膜(2)覆盖。 用于检测膜(2)的变形的传感器(17)形成在膜(2)的区域内。 用于使膜(2)变形以用于测试目的的测试致动器(28,29,30)也布置在膜(2)的区域内。 最后,微电子部件具有连接到传感器(17)的评估和激活单元(41)和用于启动测试致动器(28,29,30)的测试致动器(28,29,30),以使膜变形 (2)作为测试,并且用于作为由于测试致动器(28,29,30)的激活而导致的膜(2)的变形的传感器检测来评估传感器(17)的测量信号。

    MICRO-ELECTROMECHANICAL DEVICE AND USE THEREOF
    6.
    发明申请
    MICRO-ELECTROMECHANICAL DEVICE AND USE THEREOF 有权
    微机电设备及其应用

    公开(公告)号:US20130193535A1

    公开(公告)日:2013-08-01

    申请号:US13583392

    申请日:2011-03-15

    CPC classification number: B81B3/0072 B81B2201/0257 B81B2201/0264

    Abstract: The micro-electromechanical device has a substrate. Integrated into the substrate is a micromechanical component that has a bending element which can be bent reversibly and which has a first end connected to the substrate and extends from the first end over a free space. The bending element has at least one web having two side edges, the course of which is defined by depressions introduced into the bending element and adjacent to the side edges. In order to form a homogenization region located within the web, in which mechanical stresses occurring during bending of the bending element are substantially equal, the mutual spacing of the side edges of the web decreases, as viewed from the first end of the bending element. The device further comprises at least one microelectronic component that is sensitive to mechanical stresses and embedded in the web in the homogenization region of the latter.

    Abstract translation: 微机电装置具有基板。 集成到衬底中的是具有可逆地弯曲的弯曲元件的微机械部件,其具有连接到衬底的第一端并且在第一端部上延伸自由空间。 弯曲元件具有至少一个腹板,该腹板具有两个侧边缘,其边缘由通过弯曲元件并靠近侧边缘的凹陷限定。 为了形成位于纤维网内的均质化区域,其中在弯曲元件的弯曲期间发生的机械应力基本上相等,从弯曲元件的第一端看,幅材的侧边缘的相互间隔减小。 该装置还包括至少一个对机械应力敏感的微电子部件,并且嵌入在后者的均匀化区域中的网中。

    Microelectromechanical component and method for testing a microelectromechanical component
    8.
    发明授权
    Microelectromechanical component and method for testing a microelectromechanical component 有权
    微机电元件和微机电元件测试方法

    公开(公告)号:US09399572B2

    公开(公告)日:2016-07-26

    申请号:US13981506

    申请日:2012-01-27

    Abstract: The microelectromechanical component has a semiconductor substrate (1), which has a cavity (2a) formed in the semiconductor substrate. The cavity is covered by a reversibly deformable membrane (2). A sensor (17) for detecting a deformation of the membrane (2) is formed within the region of the membrane (2). A test actuator (28, 29, 30) for deforming the membrane (2) for testing purposes is also arranged within the region of the membrane (2). Finally, the microelectromechanical component has an evaluation and activation unit (41) connected to the sensor (17) and the test actuator (28, 29, 30) for activating the test actuator (28, 29, 30) in order to deform the membrane (2) as a test and for evaluating a measurement signal of the sensor (17) as a sensor detection of a deformation of the membrane (2) as a result of the activation of the test actuator (28, 29, 30).

    Abstract translation: 微电子部件具有半导体基板(1),该半导体基板具有在半导体基板中形成的空腔(2a)。 空腔被可逆变形的膜(2)覆盖。 用于检测膜(2)的变形的传感器(17)形成在膜(2)的区域内。 用于使膜(2)变形以用于测试目的的测试致动器(28,29,30)也布置在膜(2)的区域内。 最后,微电子部件具有连接到传感器(17)的评估和激活单元(41)和用于启动测试致动器(28,29,30)的测试致动器(28,29,30),以使膜变形 (2)作为测试,并且用于作为由于测试致动器(28,29,30)的激活而导致的膜(2)的变形的传感器检测来评估传感器(17)的测量信号。

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