公开(公告)号：US09212054B1

公开(公告)日：2015-12-15

申请号：US14515480

申请日：2014-10-15

Applicant: Microlux Technology

Inventor： Tom Kwa

IPC: H01L21/50 ,  G01L9/06 ,  B81C1/00 ,  G01L9/00

CPC classification number: B81C1/00674 ,  B81B2201/0264 ,  B81C1/00047 ,  B81C1/00158 ,  B81C1/00277 ,  B81C1/00357 ,  B81C1/00373 ,  B81C1/00396 ,  B81C2201/0132 ,  G01L9/0045 ,  G01L19/0618

Abstract: A pressure sensor assembly comprising: three stacked silicon wafers which form a support, a sensor and a cover wherein the sensor includes a cavity extending from the bottom of the sensor up towards the top of the sensor to form a cavity bottom and a diaphragm; a dielectric layer covering the bottom of the sensor and the cavity and wherein the support is coupled to the dielectric layer along the bottom of the sensor; a plurality of ports located on a top of the support within an area defined by the cavity, the plurality of ports extending through the support to its bottom and wherein the cover is coupled to the top of the sensor covering the diaphragm; and, a second cavity cut into a bottom of the cover wherein the second cavity is sized and positioned to surround the diaphragm.

Abstract translation: 一种压力传感器组件，包括：三个堆叠的硅晶片，其形成支撑件，传感器和盖，其中所述传感器包括从所述传感器的底部向上朝向所述传感器的顶部延伸的空腔，以形成空腔底部和隔膜; 覆盖传感器底部和空腔的电介质层，并且其中所述支撑件沿着所述传感器的底部耦合到所述电介质层; 多个端口，其位于由所述空腔限定的区域内的所述支撑件的顶部上，所述多个端口通过所述支撑件延伸到其底部，并且其中所述盖联接到覆盖所述隔膜的所述传感器的顶部; 以及切割到所述盖的底部中的第二腔，其中所述第二腔的尺寸设置成围绕所述隔膜。

公开(公告)号：US09506827B2

公开(公告)日：2016-11-29

申请号：US14515470

申请日：2014-10-15

Applicant: Microlux Technology

Inventor： Tom Kwa

IPC: G01L9/00 ,  G01L19/06 ,  G01L19/14

CPC classification number: G01L9/0042 ,  G01L9/0016 ,  G01L19/0609 ,  G01L19/0618 ,  G01L19/147

Abstract: A pressure sensor assembly comprising: three stacked silicon wafers which form a support, a sensor and a cover wherein the sensor includes a cavity extending from the bottom of the sensor up towards the top of the sensor to form a cavity bottom and a diaphragm; a dielectric layer covering the bottom of the sensor and the cavity and wherein the support is coupled to the dielectric layer along the bottom of the sensor; a plurality of ports located on a top of the support within an area defined by the cavity, the plurality of ports extending through the support to its bottom and wherein the cover is coupled to the top of the sensor covering the diaphragm; and, a second cavity cut into a bottom of the cover wherein the second cavity is sized and positioned to surround the diaphragm.