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    Pressure Sensors Having Low Cost, Small, Universal Packaging
    1.
    发明申请
    Pressure Sensors Having Low Cost, Small, Universal Packaging 有权
    低成本，小型通用包装的压力传感器

    公开(公告)号：US20150369684A1

    公开(公告)日：2015-12-24

    申请号：US14310881

    申请日：2014-06-20

    Applicant: Microlux Technology, Inc.

    Inventor： Tom T. Nguyen ,  Cuong D. Nguyen

    IPC: G01L19/00

    CPC classification number: G01L19/0084 ,  G01L19/142

    Abstract: Pressure sensor package that includes: a pressure sensor support attached to an interconnect housing which is attached to a compensation support; wherein: (a) a pressure sensor device is attached to the pressure sensor support and is electrically connected to pads disposed on the pressure sensor support; (b) compensation circuitry is attached to the compensation support and is electrically connected to pads disposed on the compensation support; (c) connectors disposed in through holes in a wall of the interconnect housing are electrically connected to the pads on the pressure sensor support and to the pads on the compensation support; and (d) a pressure port is disposed in the pressure sensor support.

    Abstract translation: 压力传感器封装，其包括：附接到连接到补偿支撑件的互连壳体的压力传感器支架; 其中：（a）压力传感器装置附接到所述压力传感器支撑件并且电连接到设置在所述压力传感器支撑件上的焊盘; （b）补偿电路连接到补偿支撑件，并且电连接到设置在补偿支撑件上的焊盘; （c）设置在互连壳体的壁中的通孔中的连接器电连接到压力传感器支撑件上的焊盘和补偿支撑件上的焊盘; 和（d）压力端口设置在压力传感器支架中。

    Pressure sensors and methods of making the same
    2.
    发明授权
    Pressure sensors and methods of making the same 有权
    压力传感器及其制作方法

    公开(公告)号：US09212054B1

    公开(公告)日：2015-12-15

    申请号：US14515480

    申请日：2014-10-15

    Applicant: Microlux Technology

    Inventor： Tom Kwa

    IPC: H01L21/50 ,  G01L9/06 ,  B81C1/00 ,  G01L9/00

    CPC classification number: B81C1/00674 ,  B81B2201/0264 ,  B81C1/00047 ,  B81C1/00158 ,  B81C1/00277 ,  B81C1/00357 ,  B81C1/00373 ,  B81C1/00396 ,  B81C2201/0132 ,  G01L9/0045 ,  G01L19/0618

    Abstract: A pressure sensor assembly comprising: three stacked silicon wafers which form a support, a sensor and a cover wherein the sensor includes a cavity extending from the bottom of the sensor up towards the top of the sensor to form a cavity bottom and a diaphragm; a dielectric layer covering the bottom of the sensor and the cavity and wherein the support is coupled to the dielectric layer along the bottom of the sensor; a plurality of ports located on a top of the support within an area defined by the cavity, the plurality of ports extending through the support to its bottom and wherein the cover is coupled to the top of the sensor covering the diaphragm; and, a second cavity cut into a bottom of the cover wherein the second cavity is sized and positioned to surround the diaphragm.

    Abstract translation: 一种压力传感器组件，包括：三个堆叠的硅晶片，其形成支撑件，传感器和盖，其中所述传感器包括从所述传感器的底部向上朝向所述传感器的顶部延伸的空腔，以形成空腔底部和隔膜; 覆盖传感器底部和空腔的电介质层，并且其中所述支撑件沿着所述传感器的底部耦合到所述电介质层; 多个端口，其位于由所述空腔限定的区域内的所述支撑件的顶部上，所述多个端口通过所述支撑件延伸到其底部，并且其中所述盖联接到覆盖所述隔膜的所述传感器的顶部; 以及切割到所述盖的底部中的第二腔，其中所述第二腔的尺寸设置成围绕所述隔膜。

    Pressure sensors and methods of making the same
    3.
    发明授权
    Pressure sensors and methods of making the same 有权

    公开(公告)号：US09506827B2

    公开(公告)日：2016-11-29

    申请号：US14515470

    申请日：2014-10-15

    Applicant: Microlux Technology

    Inventor： Tom Kwa

    IPC: G01L9/00 ,  G01L19/06 ,  G01L19/14

    CPC classification number: G01L9/0042 ,  G01L9/0016 ,  G01L19/0609 ,  G01L19/0618 ,  G01L19/147

    Abstract: A pressure sensor assembly comprising: three stacked silicon wafers which form a support, a sensor and a cover wherein the sensor includes a cavity extending from the bottom of the sensor up towards the top of the sensor to form a cavity bottom and a diaphragm; a dielectric layer covering the bottom of the sensor and the cavity and wherein the support is coupled to the dielectric layer along the bottom of the sensor; a plurality of ports located on a top of the support within an area defined by the cavity, the plurality of ports extending through the support to its bottom and wherein the cover is coupled to the top of the sensor covering the diaphragm; and, a second cavity cut into a bottom of the cover wherein the second cavity is sized and positioned to surround the diaphragm.

    PRESSURE SENSORS AND METHODS OF MAKING THE SAME
    5.
    发明申请
    PRESSURE SENSORS AND METHODS OF MAKING THE SAME 有权
    压力传感器及其制造方法

    公开(公告)号：US20160109314A1

    公开(公告)日：2016-04-21

    申请号：US14515470

    申请日：2014-10-15

    Applicant: Microlux Technology

    Inventor： TOM KWA

    IPC: G01L9/00 ,  B81B3/00

    CPC classification number: G01L9/0042 ,  G01L9/0016 ,  G01L19/0609 ,  G01L19/0618 ,  G01L19/147

    Abstract: A pressure sensor assembly comprising: three stacked silicon wafers which form a support, a sensor and a cover wherein the sensor includes a cavity extending from the bottom of the sensor up towards the top of the sensor to form a cavity bottom and a diaphragm; a dielectric layer covering the bottom of the sensor and the cavity and wherein the support is coupled to the dielectric layer along the bottom of the sensor; a plurality of ports located on a top of the support within an area defined by the cavity, the plurality of ports extending through the support to its bottom and wherein the cover is coupled to the top of the sensor covering the diaphragm; and, a second cavity cut into a bottom of the cover wherein the second cavity is sized and positioned to surround the diaphragm.

    Abstract translation: 一种压力传感器组件，包括：三个堆叠的硅晶片，其形成支撑件，传感器和盖，其中所述传感器包括从所述传感器的底部向上朝向所述传感器的顶部延伸的空腔，以形成空腔底部和隔膜; 覆盖传感器底部和空腔的电介质层，并且其中所述支撑件沿着所述传感器的底部耦合到所述电介质层; 多个端口，其位于由所述空腔限定的区域内的所述支撑件的顶部上，所述多个端口通过所述支撑件延伸到其底部，并且其中所述盖联接到覆盖所述隔膜的所述传感器的顶部; 以及切割到所述盖的底部中的第二腔，其中所述第二腔的尺寸设置成围绕所述隔膜。

    Apparatus Having a Hermetic Seal
    6.
    发明申请
    Apparatus Having a Hermetic Seal 有权
    具有密封的装置

    公开(公告)号：US20150219517A1

    公开(公告)日：2015-08-06

    申请号：US14170387

    申请日：2014-01-31

    Applicant: Microlux Technology, Inc.

    Inventor： Tom T. Nguyen

    IPC: G01L19/14

    CPC classification number: G01L19/143 ,  G01L19/142 ,  G01L19/145

    Abstract: Apparatus having a hermetic seal that seals a portion of the apparatus, for example and without limitation, a portion having a MEMS sensor.

    Abstract translation: 具有密封装置的一部分（例如但不限于）具有MEMS传感器的部分的密封件的装置。

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