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公开(公告)号：US20170242290A1
公开(公告)日：2017-08-24
申请号：US15051062
申请日：2016-02-23
Applicant: Microsoft Technology Licensing, LLC
Inventor： Kurt Allen Jenkins , Lincoln Matthew Ghioni
IPC: G02F1/1333 , F21V8/00
CPC classification number: G02F1/133385 , G02B6/0023 , G02B6/0036 , G02B6/0051 , G02B6/0068 , G02F1/133308 , G02F1/13338 , G02F2001/133314 , G02F2001/133317 , G02F2201/503 , G02F2202/28
Abstract: A dissipation or rigid support layer for a display device (such as a touch screen display device) is provided herein. The display device may include a display unit (e.g., a LCD unit and backlight unit), an internal electronics component, and a dissipation layer disposed between the display unit and the internal electronics component. The dissipation layer may be affixed to a surface of the display unit, and the dissipation layer may be configured to at least partially disperse a mechanical force applied by the internal electronics component on the display unit when an input force moves the dissipation layer into contact with the internal electronics component. In some examples, the dissipation layer is affixed to the surface of the display unit via an adhesive layer (e.g., an optically clear adhesive layer).
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公开(公告)号：US09416916B2
公开(公告)日：2016-08-16
申请号：US14877491
申请日：2015-10-07
Applicant: Microsoft Technology Licensing, LLC
Inventor： Kurt Allen Jenkins , Brett Andrew Tomky , Timothy Jerome Coomes
CPC classification number: F16M13/005 , G06F1/1616 , G06F1/1637 , G06F1/166 , G06F1/1681 , Y10T29/49826 , Y10T156/10
Abstract: A support component for an apparatus is described. In at least some implementations, a support component is attached to an apparatus (e.g., a computing device) via a hinge mechanism. The support component can serve as a “kickstand” that can be positioned via the hinge mechanism to support the apparatus in a variety of orientations relative to an adjacent surface. In at least some embodiments, a support component includes hinge mounts via which the support component is attached to hinges of an associated apparatus. The support component and associated hinge mounts, for instance, can be manufactured separately and/or via different manufacturing processes, and attached during a production process.
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公开(公告)号：US20160169444A1
公开(公告)日：2016-06-16
申请号：US14877491
申请日：2015-10-07
Applicant: Microsoft Technology Licensing, LLC
Inventor： Kurt Allen Jenkins , Brett Andrew Tomky , Timothy Jerome Coomes
CPC classification number: F16M13/005 , G06F1/1616 , G06F1/1637 , G06F1/166 , G06F1/1681 , Y10T29/49826 , Y10T156/10
Abstract: A support component for an apparatus is described. In at least some implementations, a support component is attached to an apparatus (e.g., a computing device) via a hinge mechanism. The support component can serve as a “kickstand” that can be positioned via the hinge mechanism to support the apparatus in a variety of orientations relative to an adjacent surface. In at least some embodiments, a support component includes hinge mounts via which the support component is attached to hinges of an associated apparatus. The support component and associated hinge mounts, for instance, can be manufactured separately and/or via different manufacturing processes, and attached during a production process.
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公开(公告)号：US10451356B2
公开(公告)日：2019-10-22
申请号：US15373332
申请日：2016-12-08
Applicant: Microsoft Technology Licensing, LLC
IPC: F28F7/00 , F28D15/04 , C25D1/00 , H05K7/20 , B22C9/02 , C25D1/02 , C25D5/02 , G06F1/20 , B22C9/04 , B22D19/02 , C25D5/10
Abstract: A lost wax cast vapor chamber device is provided. Once a mesh is produced, a meltable core is formed from a meltable core material with the mesh positioned at least partially inside the core. Over the meltable core a metallic layer is formed, at least partially surrounding the meltable core. A chamber formed by the metallic layer is exposed by melting the meltable core to cause it to be removed from an internal void of the chamber, the internal void encapsulating the mesh. The melted material from the meltable core flows out an opening on at least one surface of the chamber. Subsequently, the internal void is filled at least partially with a working fluid and the opening is closed. The mesh supports the surfaces of the chamber against deformation under the vacuum of the internal void. Movement of working fluid by capillary action is facilitated by the mesh.
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Patent Agency Ranking
公开(公告)号：US20190254200A1
公开(公告)日：2019-08-15
申请号：US16386947
申请日：2019-04-17
Applicant: Microsoft Technology Licensing, LLC
Inventor： Kurt Allen Jenkins , Gary Russell McClary , Lincoln Matthew Ghioni
CPC classification number: H05K9/0032 , B29C64/10 , B33Y10/00 , B33Y80/00 , H01L23/552 , H01L2224/16227 , H01L2224/32225 , H01L2224/81815 , H01L2224/83815 , H01L2924/14 , H01L2924/15192 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/3025 , H05K1/0203 , H05K1/0206 , H05K1/0218 , H05K1/111 , H05K1/115 , H05K1/16 , H05K1/181 , H05K3/10 , H05K9/0024 , H05K2201/10098 , H05K2201/10128 , H05K2201/10371 , H05K2201/2018 , H05K2203/107
Abstract: Printed circuit boards include conductive metallic paths, such as vias, traces, and pads on the printed circuit board. One or more metal additive structures are additively manufactured onto the printed circuit boards in a manner that forms a continuous weld with at least one of the conductive metallic paths. As a result, the metal additive structures are continuous with the printed circuit board and do not require separate attachment mechanisms (e.g., soldering or mechanical fastening). The metal additive structures may include shield cans, frames, antennas, or heat sinks for the printed circuit board, for example.
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公开(公告)号：US20180156545A1
公开(公告)日：2018-06-07
申请号：US15369724
申请日：2016-12-05
Applicant: Microsoft Technology Licensing, LLC
Abstract: A three-dimensional printed vapor chamber device is provided. A chamber from a first surface and a second surface at least partially enclosing a volume includes a spanning structure extending from the first surface to the second surface throughout a region within the volume. A defined gap between the first surface and second surface is maintained by the spanning structure, which also defines a plurality of flow passages. Evaporated working fluid flows from an evaporation region proximate a heat source through looped flow passages to a condensation region at a distal end of the chamber before returning as condensate by way of capillary action to the evaporation region.
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公开(公告)号：US20180184550A1
公开(公告)日：2018-06-28
申请号：US15392934
申请日：2016-12-28
Applicant: Microsoft Technology Licensing, LLC
Inventor： Kurt Allen Jenkins , Gary Russell McClary , Lincoln Matthew Ghioni
CPC classification number: H05K9/0032 , B29C64/10 , B33Y10/00 , B33Y80/00 , H01L23/552 , H01L2224/16227 , H01L2224/32225 , H01L2224/81815 , H01L2224/83815 , H01L2924/14 , H01L2924/15192 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/3025 , H05K1/0203 , H05K1/0206 , H05K1/0218 , H05K1/111 , H05K1/115 , H05K1/16 , H05K1/181 , H05K3/10 , H05K9/0024 , H05K2201/10098 , H05K2201/10128 , H05K2201/10371 , H05K2201/2018 , H05K2203/107
Abstract: Printed circuit boards include conductive metallic paths, such as vias, traces, and pads on the printed circuit board. One or more metal additive structures are additively manufactured onto the printed circuit boards in a manner that forms a continuous weld with at least one of the conductive metallic paths. As a result, the metal additive structures are continuous with the printed circuit board and do not require separate attachment mechanisms (e.g., soldering or mechanical fastening). The metal additive structures may include shield cans, frames, antennas, or heat sinks for the printed circuit board, for example.
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公开(公告)号：US20180164042A1
公开(公告)日：2018-06-14
申请号：US15373332
申请日：2016-12-08
Applicant: Microsoft Technology Licensing, LLC
CPC classification number: F28D15/046 , B22C9/02 , B22C9/043 , B22D19/02 , C25D1/00 , C25D1/02 , C25D5/02 , C25D5/10 , G06F1/203 , G06F2200/201 , H05K7/20309 , H05K7/20318 , H05K7/20336 , H05K7/20409
Abstract: A lost wax cast vapor chamber device is provided. Once a mesh is produced, a meltable core is formed from a meltable core material with the mesh positioned at least partially inside the core. Over the meltable core a metallic layer is formed, at least partially surrounding the meltable core. A chamber formed by the metallic layer is exposed by melting the meltable core to cause it to be removed from an internal void of the chamber, the internal void encapsulating the mesh. The melted material from the meltable core flows out an opening on at least one surface of the chamber. Subsequently, the internal void is filled at least partially with a working fluid and the opening is closed. The mesh supports the surfaces of the chamber against deformation under the vacuum of the internal void. Movement of working fluid by capillary action is facilitated by the mesh.
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公开(公告)号：US09964793B2
公开(公告)日：2018-05-08
申请号：US15051062
申请日：2016-02-23
Applicant: Microsoft Technology Licensing, LLC
Inventor： Kurt Allen Jenkins , Lincoln Matthew Ghioni
IPC: G02F1/1333 , F21V8/00
CPC classification number: G02F1/133385 , G02B6/0023 , G02B6/0036 , G02B6/0051 , G02B6/0068 , G02F1/133308 , G02F1/13338 , G02F2001/133314 , G02F2001/133317 , G02F2201/503 , G02F2202/28
Abstract: A dissipation or rigid support layer for a display device (such as a touch screen display device) is provided herein. The display device may include a display unit (e.g., a LCD unit and backlight unit), an internal electronics component, and a dissipation layer disposed between the display unit and the internal electronics component. The dissipation layer may be affixed to a surface of the display unit, and the dissipation layer may be configured to at least partially disperse a mechanical force applied by the internal electronics component on the display unit when an input force moves the dissipation layer into contact with the internal electronics component. In some examples, the dissipation layer is affixed to the surface of the display unit via an adhesive layer (e.g., an optically clear adhesive layer).
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