公开(公告)号：US10064292B2

公开(公告)日：2018-08-28

申请号：US15094372

申请日：2016-04-08

Applicant: Multek Technologies Limited

Inventor： Kwan Pen

IPC: H05K3/46 ,  H05K1/11 ,  H05K3/06 ,  H05K1/02 ,  H05K3/42

CPC classification number: H05K3/4611 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/185 ,  H05K3/06 ,  H05K3/42 ,  H05K3/429 ,  H05K3/462 ,  H05K3/4697 ,  H05K2201/09036

Abstract: A PCB has multiple stacked layers laminated together, the laminated stack includes regular flow prepreg and includes a recessed cavity, a bottom perimeter of which is formed by a photo definable, or photo imageable, polymer structure having a low adhesion to an underlying conductive layer, such as an LPI mixture. The LPI mixture defines cavity dimensions and enables the use of regular flow prepreg in the laminated stack.

公开(公告)号：US09999134B2

公开(公告)日：2018-06-12

申请号：US15081623

申请日：2016-03-25

Applicant: Multek Technologies Limited

Inventor： Mark Zhang ,  Kwan Pen ,  Pui Yin Yu

IPC: H05K1/03 ,  H05K3/04 ,  H05K1/18 ,  H05K3/46 ,  H05K3/00

CPC classification number: H05K3/048 ,  H05K1/036 ,  H05K1/183 ,  H05K3/0035 ,  H05K3/0044 ,  H05K3/4697 ,  H05K2201/0187 ,  H05K2201/09109 ,  H05K2201/0989 ,  H05K2203/0228 ,  H05K2203/1383

Abstract: A PCB having multiple stacked layers laminated together. The laminated stack includes regular flow prepreg and includes a recessed cavity, a bottom perimeter of which is formed by a photo definable, or photo imageable, polymer structure, such as a solder mask frame, and a protective film. The solder mask frame and protective film protect inner core circuitry at the bottom of the cavity during the fabrication process, as well as enable the use of regular flow prepreg in the laminated stack.

公开(公告)号：US20170273195A1

公开(公告)日：2017-09-21

申请号：US15094372

申请日：2016-04-08

Applicant: Multek Technologies Limited

Inventor： Kwan Pen

IPC: H05K3/46 ,  H05K1/11 ,  H05K3/06 ,  H05K1/02 ,  H05K3/42

CPC classification number: H05K3/4611 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/185 ,  H05K3/06 ,  H05K3/42 ,  H05K3/429 ,  H05K3/462 ,  H05K3/4697 ,  H05K2201/09036

Abstract: A PCB having multiple stacked layers laminated together. The laminated stack includes regular flow prepreg and includes a recessed cavity, a bottom perimeter of which is formed by a photo definable, or photo imageable, polymer structure having a low adhesion to an underlying conductive layer, such as an LPI mixture. The LPI mixture defines cavity dimensions and enables the use of regular flow prepreg in the laminated stack.

公开(公告)号：US20170265298A1

公开(公告)日：2017-09-14

申请号：US15081623

申请日：2016-03-25

Applicant: Multek Technologies Limited

Inventor： Mark Zhang ,  Kwan Pen ,  Pui Yin Yu

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/09 ,  H05K3/06 ,  H05K3/42 ,  H05K1/03 ,  H05K3/46

CPC classification number: H05K3/048 ,  H05K1/036 ,  H05K1/183 ,  H05K3/0035 ,  H05K3/0044 ,  H05K3/4697 ,  H05K2201/0187 ,  H05K2201/09109 ,  H05K2201/0989 ,  H05K2203/0228 ,  H05K2203/1383

Abstract: A PCB having multiple stacked layers laminated together. The laminated stack includes regular flow prepreg and includes a recessed cavity, a bottom perimeter of which is formed by a photo definable, or photo imageable, polymer structure, such as a solder mask frame, and a protective film. The solder mask frame and protective film protect inner core circuitry at the bottom of the cavity during the fabrication process, as well as enable the use of regular flow prepreg in the laminated stack.