公开(公告)号：US10321560B2

公开(公告)日：2019-06-11

申请号：US14995087

申请日：2016-01-13

Applicant: Multek Technologies Limited

Inventor： Pui Yin Yu ,  Mark Zhang ,  Jiawen Chen

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/46 ,  H05K3/06 ,  H05K3/18 ,  H05K1/03

Abstract: A printed circuit board (PCB) has multiple layers, where select portions of inner layer circuitry, referred to as inner core circuitry, are exposed from the remaining layers. The PCB having an exposed inner core circuitry is formed using a dummy core plus plating resist process. The select inner core circuitry is part of an inner core. The inner core corresponding to the exposed inner core circuitry forms a semi-flexible PCB portion. The semi-flexible PCB portion is an extension of the remaining adjacent multiple layer PCB. The remaining portion of the multiple layer PCB is rigid. The inner core is common to both the semi-flexible PCB portion and the remaining rigid PCB portion.

公开(公告)号：US09992880B2

公开(公告)日：2018-06-05

申请号：US14995139

申请日：2016-01-13

Applicant: Multek Technologies Limited

Inventor： Pui Yin Yu ,  Mark Zhang ,  Jiawen Chen

IPC: H05K3/36 ,  H05K3/46

CPC classification number: H05K3/4691 ,  H05K2201/09127 ,  H05K2201/09781 ,  H05K2203/0228 ,  Y10T29/49126

Abstract: A printed circuit board (PCB) has multiple layers, where select portions of one or more conductive layers, referred to as core circuitry, form a semi-flexible PCB portion that is protected by an exposed prepreg layer. The semi-flexible PCB portion having an exposed prepreg layer is formed using a dummy core process that leaves the exposed prepreg layer smooth and undamaged. The core circuitry is part of a core structure. The semi-flexible PCB portion is an extension of the remaining adjacent multiple layer PCB. The remaining portion of the multiple layer PCB is rigid. The core structure is common to both the semi-flexible PCB portion and the remaining rigid PCB portion.

公开(公告)号：US20170142829A1

公开(公告)日：2017-05-18

申请号：US14995139

申请日：2016-01-13

Applicant: Multek Technologies Limited

Inventor： Pui Yin Yu ,  Mark Zhang ,  Jiawen Chen

IPC: H05K1/02 ,  H05K3/18 ,  H05K3/46 ,  H05K3/06 ,  H05K1/11 ,  H05K1/14

CPC classification number: H05K3/4691 ,  H05K2201/09127 ,  H05K2201/09781 ,  H05K2203/0228 ,  Y10T29/49126

Abstract: A printed circuit board (PCB) has multiple layers, where select portions of one or more conductive layers, referred to as core circuitry, form a semi-flexible PCB portion that is protected by an exposed prepreg layer. The semi-flexible PCB portion having an exposed prepreg layer is formed using a dummy core process that leaves the exposed prepreg layer smooth and undamaged. The core circuitry is part of a core structure. The semi-flexible PCB portion is an extension of the remaining adjacent multiple layer PCB. The remaining portion of the multiple layer PCB is rigid. The core structure is common to both the semi-flexible PCB portion and the remaining rigid PCB portion.

公开(公告)号：US09999134B2

公开(公告)日：2018-06-12

申请号：US15081623

申请日：2016-03-25

Applicant: Multek Technologies Limited

Inventor： Mark Zhang ,  Kwan Pen ,  Pui Yin Yu

IPC: H05K1/03 ,  H05K3/04 ,  H05K1/18 ,  H05K3/46 ,  H05K3/00

CPC classification number: H05K3/048 ,  H05K1/036 ,  H05K1/183 ,  H05K3/0035 ,  H05K3/0044 ,  H05K3/4697 ,  H05K2201/0187 ,  H05K2201/09109 ,  H05K2201/0989 ,  H05K2203/0228 ,  H05K2203/1383

Abstract: A PCB having multiple stacked layers laminated together. The laminated stack includes regular flow prepreg and includes a recessed cavity, a bottom perimeter of which is formed by a photo definable, or photo imageable, polymer structure, such as a solder mask frame, and a protective film. The solder mask frame and protective film protect inner core circuitry at the bottom of the cavity during the fabrication process, as well as enable the use of regular flow prepreg in the laminated stack.

公开(公告)号：US20170265298A1

公开(公告)日：2017-09-14

申请号：US15081623

申请日：2016-03-25

Applicant: Multek Technologies Limited

Inventor： Mark Zhang ,  Kwan Pen ,  Pui Yin Yu

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/09 ,  H05K3/06 ,  H05K3/42 ,  H05K1/03 ,  H05K3/46

CPC classification number: H05K3/048 ,  H05K1/036 ,  H05K1/183 ,  H05K3/0035 ,  H05K3/0044 ,  H05K3/4697 ,  H05K2201/0187 ,  H05K2201/09109 ,  H05K2201/0989 ,  H05K2203/0228 ,  H05K2203/1383

Abstract: A PCB having multiple stacked layers laminated together. The laminated stack includes regular flow prepreg and includes a recessed cavity, a bottom perimeter of which is formed by a photo definable, or photo imageable, polymer structure, such as a solder mask frame, and a protective film. The solder mask frame and protective film protect inner core circuitry at the bottom of the cavity during the fabrication process, as well as enable the use of regular flow prepreg in the laminated stack.

公开(公告)号：US20170142828A1

公开(公告)日：2017-05-18

申请号：US14995087

申请日：2016-01-13

Applicant: Multek Technologies Limited

Inventor： Pui Yin Yu ,  Mark Zhang ,  Jiawen Chen

IPC: H05K1/02 ,  H05K3/18 ,  H05K3/06 ,  H05K1/11 ,  H05K3/46

CPC classification number: H05K1/0278 ,  H05K1/0298 ,  H05K1/115 ,  H05K3/067 ,  H05K3/181 ,  H05K3/4611 ,  H05K3/4691 ,  H05K2203/0228 ,  H05K2203/0574 ,  H05K2203/06 ,  H05K2203/308

Abstract: A printed circuit board (PCB) has multiple layers, where select portions of inner layer circuitry, referred to as inner core circuitry, are exposed from the remaining layers. The PCB having an exposed inner core circuitry is formed using a dummy core plus plating resist process. The select inner core circuitry is part of an inner core. The inner core corresponding to the exposed inner core circuitry forms a semi-flexible PCB portion. The semi-flexible PCB portion is an extension of the remaining adjacent multiple layer PCB. The remaining portion of the multiple layer PCB is rigid. The inner core is common to both the semi-flexible PCB portion and the remaining rigid PCB portion.