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公开(公告)号：US07316939B2
公开(公告)日：2008-01-08
申请号：US10985668
申请日：2004-11-11
Applicant: Munehide Saimen
Inventor： Munehide Saimen
CPC classification number: H01L23/4985 , H01L21/67092 , H01L24/86 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H05K1/118 , H05K3/005 , H05K3/0052 , H05K3/0064 , H05K2201/10681 , H05K2201/2009 , H05K2203/1545 , Y10T83/869
Abstract: A method for manufacturing a semiconductor device is provided including: providing a reinforcing member on one surface of a wiring substrate that has a first region where a semiconductor chip is mounted and a second region around the first region, and has terminals extending from the first region to the second region formed on another surface thereof in a manner that the reinforcing member overlaps the terminals and a part thereof protrudes from the first region to the second region; cutting the terminals along a boundary between the first region and the second region; and continuously cutting the reinforcing member from an inboard side thereof to an outboard side along the boundary between the first region and the second region.
Abstract translation: 一种半导体装置的制造方法，其特征在于，包括：在布线基板的具有安装半导体芯片的第一区域和所述第一区域周围的第二区域的一个表面上设置加强构件，并且具有从所述第一区域 形成在其另一表面上的第二区域，其中所述加强构件与所述端子重叠并且其一部分从所述第一区域突出到所述第二区域; 沿着第一区域和第二区域之间的边界切割端子; 并且沿着所述第一区域和所述第二区域之间的边界，将所述加强构件从内侧连续切割到所述外侧。
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公开(公告)号：US20060102382A1
公开(公告)日：2006-05-18
申请号：US11247612
申请日：2005-10-10
Applicant: Munehide Saimen
Inventor： Munehide Saimen
CPC classification number: H05K3/0052 , H01L2924/0002 , H05K1/0393 , H05K1/118 , H05K3/005 , H05K3/0058 , H05K2201/09063 , H05K2201/2009 , H05K2203/1545 , Y10T29/49128 , Y10T29/49789 , H01L2924/00
Abstract: A manufacturing method of an electronic part, comprises: sectioning a wiring substrate along a line intersecting a through hole, the wiring substrate having; a base substrate, a wiring pattern provided on a first surface of the base substrate, a reinforcement member provided on a second surface of the base substrate, and the through hole which is positioned so as to overlap partially an end of the reinforcement member and which extends through the base substrate.
Abstract translation: 一种电子部件的制造方法，其特征在于，包括：沿着与通孔相交的线分割布线基板，所述布线基板具有： 基底基板，设置在基底基板的第一表面上的布线图案，设置在基底基板的第二表面上的加强部件和定位成部分地与加强部件的端部重叠的通孔， 延伸穿过基底。
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公开(公告)号：US20050194693A1
公开(公告)日：2005-09-08
申请号：US10985667
申请日：2004-11-11
Applicant: Munehide Saimen
Inventor： Munehide Saimen
CPC classification number: H05K3/0052 , H01L24/86 , H01L2224/7565 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H05K1/118 , H05K3/005 , H05K3/0064 , H05K2201/10681 , H05K2203/1545 , Y10T29/49117 , Y10T29/49789 , Y10T29/49835
Abstract: A method for manufacturing a semiconductor device is provided including: providing a reinforcing member on one surface of a wiring substrate that has a first region where a semiconductor chip is mounted and a second region around the first region, and has terminals extending from the first region to the second region formed on another surface thereof, in a manner that the reinforcing member overlaps the terminals and a part thereof protrudes from the first region to the second region; punching through from a surface side having the terminals in the wiring substrate, thereby cutting the terminals along a boundary between the first region and the second region; and punching through from the surface side having the reinforcing member in the wiring substrate, thereby continuously cutting the reinforcing member from an inboard side thereof to an outboard side along the boundary between the first region and the second region.
Abstract translation: 一种半导体装置的制造方法，其特征在于，包括：在布线基板的具有安装半导体芯片的第一区域和所述第一区域周围的第二区域的一个表面上设置加强构件，并且具有从所述第一区域 形成在其另一表面上的第二区域，其中所述加强构件与所述端子重叠并且其一部分从所述第一区域突出到所述第二区域; 从布线基板中具有端子的表面侧穿孔，从而沿着第一区域和第二区域之间的边界切割端子; 从布线基板的具有加强部件的表面侧穿孔，从而沿着第一区域与第二区域之间的边界从内侧向外侧连续切割加强部件。
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4.发明授权Method for manufacturing flexible substrate and flexible substrate punching device 有权柔性基板和柔性基板冲孔装置的制造方法公开(公告)号：US08640582B2
公开(公告)日：2014-02-04
申请号：US12350775
申请日：2009-01-08
Applicant: Munehide Saimen
Inventor： Munehide Saimen
CPC classification number: H05K3/0052 , H05K1/0269 , H05K1/0393 , H05K3/005 , H05K2201/09918 , H05K2203/1476 , H05K2203/1545 , H05K2203/163 , Y10T83/0467 , Y10T83/0572 , Y10T83/141 , Y10T83/178 , Y10T83/541 , Y10T83/6484
Abstract: A method for manufacturing a flexible substrate includes punching out a flexible substrate from a flexible tape wherein the flexible substrate has a first contour that is a part of a contour of the flexible substrate, and a second contour that is a remaining portion of the contour other than the first contour, and requires a punching accuracy lower than a punching accuracy of the first contour. The method includes the steps of: operating a first die by a control section to punch out the first contour from the flexible tape; judging by the control section as to whether a punching accuracy of the first contour meets a standard; and operating a second die by the control section to punch out the second contour from the flexible tape thereby separating the flexible substrate from the flexible tape when the control section judges that the punching accuracy of the first contour meets the standard, and not operate the second die when the control section judges that the punching accuracy of the first contour does not meet the standard.
Abstract translation: 一种制造柔性基板的方法包括从柔性带冲出柔性基板，其中柔性基板具有作为柔性基板的轮廓的一部分的第一轮廓，以及作为轮廓其他部分的第二轮廓 比第一轮廓高，并且要求冲压精度低于第一轮廓的冲孔精度。 该方法包括以下步骤：通过控制部分操作第一模具以从柔性带上冲出第一轮廓; 由控制部判断第一轮廓的冲孔精度是否满足标准; 并且通过所述控制部分操作第二模具以从所述柔性胶带冲出所述第二轮廓，从而当所述控制部分判断所述第一轮廓的冲裁精度满足所述标准时将所述柔性基板与所述柔性带分离，并且不操作所述第二轮廓 当控制部判定第一轮廓的冲裁精度不符合标准时，会死亡。
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公开(公告)号：US07582955B2
公开(公告)日：2009-09-01
申请号：US11998357
申请日：2007-11-29
Applicant: Munehide Saimen
Inventor： Munehide Saimen
IPC: H01L23/495
CPC classification number: H05K3/0052 , H01L24/86 , H01L2224/7565 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H05K1/118 , H05K3/005 , H05K3/0064 , H05K2201/10681 , H05K2203/1545 , Y10T29/49117 , Y10T29/49789 , Y10T29/49835
Abstract: A method for manufacturing a semiconductor device is provided including: providing a reinforcing member on one surface of a wiring substrate that has a first region where a semiconductor chip is mounted and a second region around the first region, and has terminals extending from the first region to the second region formed on another surface thereof, in a manner that the reinforcing member overlaps the terminals and a part thereof protrudes from the first region to the second region; punching through from a surface side having the terminals in the wiring substrate, thereby cutting the terminals along a boundary between the first region and the second region; and punching through from the surface side having the reinforcing member in the wiring substrate, thereby continuously cutting the reinforcing member from an inboard side thereof to an outboard side along the boundary between the first region and the second region.
Abstract translation: 一种半导体装置的制造方法，其特征在于，包括：在布线基板的具有安装半导体芯片的第一区域和所述第一区域周围的第二区域的一个表面上设置加强构件，并且具有从所述第一区域 形成在其另一表面上的第二区域，其中所述加强构件与所述端子重叠并且其一部分从所述第一区域突出到所述第二区域; 从布线基板中具有端子的表面侧穿孔，从而沿着第一区域和第二区域之间的边界切割端子; 从布线基板的具有加强部件的表面侧穿孔，从而沿着第一区域与第二区域之间的边界从内侧向外侧连续切割加强部件。
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Patent Agency Ranking
公开(公告)号：US20090197111A1
公开(公告)日：2009-08-06
申请号：US12365636
申请日：2009-02-04
Applicant: Munehide Saimen
Inventor： Munehide Saimen
CPC classification number: H05K3/363 , G02F1/13452 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/2929 , H01L2224/293 , H01L2224/2939 , H01L2224/294 , H01L2224/2989 , H01L2224/83851 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/07802 , H01L2924/07811 , H01L2924/12041 , H01L2924/15788 , H01L2924/19043 , H01L2924/3025 , H05K3/323 , H05K3/361 , H05K2201/0221 , H05K2203/0278 , H05K2203/0425 , Y10T428/12569 , H01L2924/00014 , H01L2924/00
Abstract: A method of producing an electro-optical device for electrically connecting a first terminal portion provided on an electro-optical panel to a second terminal portion of a substrate includes applying an anisotropic conductive adhesive containing conductive particles made of a low-melting-point material onto either the first terminal portion or the second terminal portion, and electrically connecting the first terminal portion to the second terminal portion by eutectic bonding by melting the conductive particles by application of heat in thermocompression bonding of the second terminal portion to the first terminal portion with the anisotropic conductive adhesive therebetween.
Abstract translation: 一种制造用于将设置在电光面板上的第一端子部分电连接到基板的第二端子部分的电光装置的方法包括将包含由低熔点材料制成的导电颗粒的各向异性导电粘合剂涂覆到 或者是第一端子部分或第二端子部分，并且通过在第二端子部分与第一端子部分的热压接合中通过施加热量来熔化导电颗粒而通过共晶接合将第一端子部分与第二端子部分电连接， 各向异性导电粘合剂。
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公开(公告)号：US07282389B2
公开(公告)日：2007-10-16
申请号：US10985666
申请日：2004-11-11
Applicant: Munehide Saimen
Inventor： Munehide Saimen
IPC: H01L21/00
CPC classification number: H01L24/86 , H01L23/4985 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H05K1/0393 , H05K3/005 , H05K3/0052 , H05K3/0097 , H05K2201/09063 , H05K2201/2009 , H05K2203/1545
Abstract: A method for manufacturing a semiconductor device is provided including: providing a reinforcing member on one surface of a wiring substrate that has a first region where a semiconductor chip is mounted and a second region around the first region, and has terminals extending from the first region to the second region formed on another surface thereof, in a manner that the reinforcing member overlaps the terminals and a part thereof protrudes from the first region to the second region; punching through from a surface side having the reinforcing member in the wiring substrate, thereby continuously cutting the reinforcing member from an inboard side thereof to an outboard side along a boundary between the first region and the second region; and punching through from the surface side having the reinforcing member in the wiring substrate, thereby cutting the terminals along the boundary between the first region and the second region.
Abstract translation: 一种半导体装置的制造方法，其特征在于，包括：在布线基板的具有安装半导体芯片的第一区域和所述第一区域周围的第二区域的一个表面上设置加强构件，并且具有从所述第一区域 形成在其另一表面上的第二区域，其中所述加强构件与所述端子重叠并且其一部分从所述第一区域突出到所述第二区域; 从配线基板的具有加强构件的表面侧穿孔，从而沿着第一区域和第二区域之间的边界从内侧向外侧连续切割加强构件; 从布线基板的具有加强部件的表面侧穿过，从而沿着第一区域和第二区域之间的边界切断端子。
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公开(公告)号：US20050186702A1
公开(公告)日：2005-08-25
申请号：US10985666
申请日：2004-11-11
Applicant: Munehide Saimen
Inventor： Munehide Saimen
CPC classification number: H01L24/86 , H01L23/4985 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H05K1/0393 , H05K3/005 , H05K3/0052 , H05K3/0097 , H05K2201/09063 , H05K2201/2009 , H05K2203/1545
Abstract: A method for manufacturing a semiconductor device is provided including: providing a reinforcing member on one surface of a wiring substrate that has a first region where a semiconductor chip is mounted and a second region around the first region, and has terminals extending from the first region to the second region formed on another surface thereof, in a manner that the reinforcing member overlaps the terminals and a part thereof protrudes from the first region to the second region; punching through from a surface side having the reinforcing member in the wiring substrate, thereby continuously cutting the reinforcing member from an inboard side thereof to an outboard side along a boundary between the first region and the second region; and punching through from the surface side having the reinforcing member in the wiring substrate, thereby cutting the terminals along the boundary between the first region and the second region.
Abstract translation: 一种半导体装置的制造方法，其特征在于，包括：在布线基板的具有安装半导体芯片的第一区域和所述第一区域周围的第二区域的一个表面上设置加强构件，并且具有从所述第一区域 形成在其另一表面上的第二区域，其中所述加强构件与所述端子重叠并且其一部分从所述第一区域突出到所述第二区域; 从配线基板的具有加强构件的表面侧穿孔，从而沿着第一区域和第二区域之间的边界从内侧向外侧连续切割加强构件; 从布线基板的具有加强部件的表面侧穿过，从而沿着第一区域和第二区域之间的边界切断端子。
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公开(公告)号：US08675372B2
公开(公告)日：2014-03-18
申请号：US13418545
申请日：2012-03-13
Applicant: Munehide Saimen
Inventor： Munehide Saimen
CPC classification number: G02F1/13452
Abstract: In at least one embodiment of the disclosure, an electrooptic device includes first and second mounting terminals arranged on a terminal portion to be aligned in a direction intersecting with a side of the electrooptic substrate. A first flexible substrate is connected to the first mounting terminal. A second flexible substrate is connected to the second mounting terminal and arranged to be superimposed on the first flexible substrate. A resin member covers the first flexible substrate, the second flexible substrate and the electrooptic substrate.
Abstract translation: 在本公开的至少一个实施例中，电光装置包括布置在端子部分上的第一和第二安装端子，以在与电光基板的侧面相交的方向上对齐。 第一柔性基板连接到第一安装端子。 第二柔性基板连接到第二安装端子并被布置成叠置在第一柔性基板上。 树脂构件覆盖第一柔性基板，第二柔性基板和电光基板。
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公开(公告)号：US08289492B2
公开(公告)日：2012-10-16
申请号：US12947032
申请日：2010-11-16
Applicant: Munehide Saimen
Inventor： Munehide Saimen
IPC: G02F1/1345
CPC classification number: H05K1/0269 , G02F1/13452 , H05K3/361 , H05K2201/09918 , H05K2203/166
Abstract: An electro-optical device includes an electro-optical panel including a pair of first panel alignment marks having a first shape and a pair of second panel alignment marks having a second shape; a first circuit substrate provided with a first circuit substrate alignment mark which is represented by the first shape in plan view; and a second circuit substrate provided with a second circuit substrate alignment mark which is represented by the second shape in plan view.
Abstract translation: 电光装置包括电光面板，其包括具有第一形状的一对第一面板对准标记和具有第二形状的一对第二面板对准标记; 第一电路基板，设置有在俯视图中由第一形状表示的第一电路基板对准标记; 以及第二电路基板，其设置有在俯视图中由第二形状表示的第二电路基板对准标记。
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