公开(公告)号：US20170156214A1

公开(公告)日：2017-06-01

申请号：US15430869

申请日：2017-02-13

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shigeru TAGO ,  Daisuke TSURUGA

IPC: H05K1/18 ,  H05K1/02 ,  H05K3/46 ,  H05K1/11

CPC classification number: H05K1/185 ,  H01L2224/04105 ,  H01L2224/19 ,  H01L2224/73267 ,  H01L2224/92244 ,  H05K1/0243 ,  H05K1/028 ,  H05K1/115 ,  H05K1/186 ,  H05K3/4617 ,  H05K3/4644 ,  H05K3/4691 ,  H05K2201/0129 ,  H05K2201/05 ,  H05K2201/09527 ,  H05K2201/10515 ,  H05K2203/0285 ,  H05K2203/063

Abstract: A component-embedded substrate includes first to sixth thermoplastic resin bases, a first electronic component in the second thermoplastic resin base and including a first terminal, and a second electronic component in the fifth thermoplastic resin base and including a second terminal. The first terminal faces the second electronic component in a stacking direction. The second terminal faces the first electronic component in the stacking direction. A first planar conductor to which the first terminal is directly bonded is provided on the third thermoplastic resin base. An interlayer connection conductor to which the second terminal is directly bonded and in communication with the first planar conductor is provided in or on the fourth thermoplastic resin base.

公开(公告)号：US20170034911A1

公开(公告)日：2017-02-02

申请号：US15290149

申请日：2016-10-11

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshihito OTSUBO ,  Daisuke TSURUGA

IPC: H05K1/09 ,  H05K3/46 ,  H05K3/40 ,  H05K1/11

CPC classification number: H05K1/09 ,  H01L21/486 ,  H01L23/145 ,  H01L23/49822 ,  H01L23/49883 ,  H01L2224/16225 ,  H01L2924/0002 ,  H01L2924/19105 ,  H05K1/113 ,  H05K1/115 ,  H05K3/3436 ,  H05K3/3442 ,  H05K3/4038 ,  H05K3/4644 ,  H05K2201/032 ,  H05K2201/09472 ,  H05K2201/09545 ,  H05K2201/09563 ,  H05K2203/06 ,  H01L2924/00

Abstract: A resin multilayer substrate includes a laminate including a plurality of resin layers and an interlayer connecting conductor which extends through at least one of the plurality of resin layers and is directly exposed to an outside of the laminate.

Abstract translation: 树脂多层基板包括多个树脂层和层间连接导体的层叠体，该层叠连接导体延伸穿过多个树脂层中的至少一个并且直接暴露于层压体的外部。

公开(公告)号：US20160029489A1

公开(公告)日：2016-01-28

申请号：US14878287

申请日：2015-10-08

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yuki WAKABAYASHI ,  Shigeru TAGO ,  Daisuke TSURUGA ,  Masaki KAWATA

IPC: H05K1/11 ,  H05K3/32 ,  H05K3/46 ,  H05K3/00 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K1/115 ,  H03H7/0115 ,  H03H2001/0085 ,  H05K1/028 ,  H05K1/0298 ,  H05K1/165 ,  H05K1/186 ,  H05K3/0064 ,  H05K3/0094 ,  H05K3/32 ,  H05K3/3484 ,  H05K3/4617 ,  H05K3/4697 ,  H05K2201/0141 ,  H05K2201/09263 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2203/046 ,  H05K2203/063 ,  H05K2203/1484 ,  Y02P70/611

Abstract: A component-embedded substrate includes a cavity including through-holes penetrating through resin sheets in a stacked body of resin sheets having flexibility. An electronic chip component including external electrodes is disposed in the cavity. The resin sheet on which the electronic chip component is located is provided with through-holes into which conductive pastes are filled. The resin sheet includes cut-away portions communicating with a through-hole and located at a distance from each other across the through-hole. When this stacked body is hot-pressed, the conductive pastes overflow from the through-holes. However, the overflowing conductive pastes enter the cut-away portions.

Abstract translation: 组件嵌入式基板包括具有穿透树脂片的通孔的空腔，该树脂片具有柔性的树脂片层叠体。 包括外部电极的电子芯片组件设置在空腔中。 电子芯片部件所在的树脂片设置有填充有导电性糊剂的贯通孔。 树脂片包括与通孔连通并且穿过通孔彼此相距一定距离的切除部分。 当该堆叠体被热压时，导电浆料从通孔溢出。 然而，溢出的导电浆料进入切割部分。