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    CAMERA MODULE AND ELECTRONIC DEVICE
    3.
    发明申请
    CAMERA MODULE AND ELECTRONIC DEVICE 有权
    相机模块和电子设备

    公开(公告)号：US20150373238A1

    公开(公告)日：2015-12-24

    申请号：US14840103

    申请日：2015-08-31

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Shigeru TAGO ,  Hirofumi SHINAGAWA ,  Jerry HSIEH ,  Satoshi SASAKI ,  Jun SASAKI ,  Nobuo IKEMOTO ,  Yuki WAKABAYASHI

    IPC: H04N5/225

    CPC classification number: H04N5/2253 ,  H04N5/2254 ,  H04N5/2257

    Abstract: A camera module includes a multilayer base body including a first mounting portion, a second mounting portion, and a connecting portion. The first mounting portion and the second mounting portion are connected to the connecting portion. A connector element is arranged in the second mounting portion. The first mounting portion includes a cavity, and a penetration hole penetrating from the cavity to one surface of the first mounting portion. An image sensor IC is arranged in the cavity, and the lens unit is arranged on the one surface of the first mounting portion at a location at or near the penetration hole. Peripheral circuit components and conductor patterns are mounted to or incorporated in the first mounting portion.

    Abstract translation: 相机模块包括多层基体，其包括第一安装部分，第二安装部分和连接部分。 第一安装部分和第二安装部分连接到连接部分。 连接器元件布置在第二安装部分中。 第一安装部分包括空腔和从腔体穿透到第一安装部分的一个表面的穿透孔。 图像传感器IC布置在空腔中，透镜单元布置在第一安装部分的一个表面上，位于穿透孔处或附近。 外围电路部件和导体图案安装到第一安装部分或结合在第一安装部分中。

    HIGH-FREQUENCY SIGNAL LINE AND ELECTRONIC DEVICE PROVIDED WITH THE SAME
    6.
    发明申请
    HIGH-FREQUENCY SIGNAL LINE AND ELECTRONIC DEVICE PROVIDED WITH THE SAME 有权
    高频信号线和电子设备提供

    公开(公告)号：US20160268666A1

    公开(公告)日：2016-09-15

    申请号：US15159967

    申请日：2016-05-20

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Yuki WAKABAYASHI ,  Bunta OKAMOTO ,  Satoshi SASAKI

    IPC: H01P3/08 ,  H05K1/02

    CPC classification number: H01P3/08 ,  H01P1/2039 ,  H01P3/082 ,  H05K1/0237 ,  H05K1/028 ,  H05K1/111 ,  H05K2201/09236 ,  H05K2201/093 ,  H05K2201/09609 ,  H05K2201/0969 ,  H05K2201/09727 ,  H05K2201/10189

    Abstract: A high-frequency signal line includes a dielectric base with a first line portion and a second line portion each extending along a predetermined straight line parallel or substantially parallel to a predetermined direction, and a third line portion mutually connecting first side ends of the first line portion and the second line portion in the predetermined direction, a signal line, a first ground conductor located on the first side in the layer stacking direction of the signal line, a second ground conductor located on a second side in the layer stacking direction of the signal line, and one or more interlayer connection conductors connecting the first ground conductor and the second ground conductor. In the third line portion, the interlayer connection conductor is provided on the second side in the predetermined direction of the signal line when viewed from the layer stacking direction.

    Abstract translation: 高频信号线包括：电介质基底，具有第一线部分和第二线部分，每个第二线部分沿着与预定方向平行或基本平行的预定直线延伸;以及第三线部分，其相互连接第一线的第一侧端 部分和第二线部分，信号线，位于信号线的层叠方向的第一侧的第一接地导体，位于第二接线导体的层叠方向上的第二接地导体 信号线和连接第一接地导体和第二接地导体的一个或多个层间连接导体。 在第三行部分中，当从层叠方向观察时，层间连接导体设置在信号线的预定方向上的第二侧上。

    CIRCUIT BOARD
    7.
    发明申请
    CIRCUIT BOARD 有权
    电路板

    公开(公告)号：US20150181699A1

    公开(公告)日：2015-06-25

    申请号：US14634982

    申请日：2015-03-02

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Nobuo IKEMOTO ,  Yuki WAKABAYASHI

    IPC: H05K1/02 ,  H05K1/11

    CPC classification number: H05K1/0281 ,  H05K1/115 ,  H05K3/4691

    Abstract: A circuit board includes a plate-shaped dielectric body with a first and a second main surface and including a first area not to be bent and a second area to be bent such that the first main surface becomes an outer side, a first reinforcing member located in the first area nearer the first main surface in relation to a center of the second area in a thickness direction and away from the second area, and a second reinforcing member located in the first area nearer the second main surface in relation to the center of the second area and contacting with a border between the first and the second areas. The first main surface curves from an edge of the first reinforcing member closest to the second area, and the second main surface curves from an edge of the second reinforcing member on the border.

    Abstract translation: 电路板包括具有第一和第二主表面并且包括第一区域不被弯曲的板状电介质体和将第一主表面变成外侧的待弯曲的第二区域，第一加强构件位于 所述第一区域相对于所述第二区域的中心在厚度方向上相对于所述第二区域更靠近所述第一主表面;以及第二加强构件，所述第二加强构件相对于所述第二区域的中心位于所述第二主表面 第二区域并与第一和第二区域之间的边界接触。 第一主表面从最靠近第二区域的第一加强构件的边缘弯曲，并且第二主表面从边界上的第二加强构件的边缘弯曲。

    COMPONENT-EMBEDDED SUBSTRATE
    9.
    发明申请
    COMPONENT-EMBEDDED SUBSTRATE 有权
    组件嵌入式基板

    公开(公告)号：US20160157354A1

    公开(公告)日：2016-06-02

    申请号：US15015475

    申请日：2016-02-04

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Shigeru TAGO ,  Hirofumi SHINAGAWA ,  Yuki WAKABAYASHI ,  Kuniaki YOSUI ,  Yuki ITO ,  Toshiro ADACHI ,  Wataru YANASE ,  Masaki KAWATA

    IPC: H05K1/18 ,  H05K1/02

    CPC classification number: H05K1/185 ,  H05K1/0298 ,  H05K1/186 ,  H05K3/4682 ,  H05K2201/09072 ,  H05K2203/0278

    Abstract: A component-embedded substrate includes a laminate and an electronic component. The electronic component is embedded in the laminate. The laminate includes a frame-shaped conductor pattern. When the laminate is viewed in a laminating direction, the frame-shaped conductor pattern is arranged so as to substantially surround the entire periphery of the electronic component. The frame-shaped conductor pattern includes a first individual conductor pattern and a second individual conductor pattern. The first individual conductor pattern and the second individual conductor pattern are separated from each other. The first individual conductor pattern is arranged close to a first external terminal electrode of the electronic component, and the second individual conductor pattern is arranged close to a second external terminal electrode of the electronic component.

    Abstract translation: 部件嵌入式基板包括层叠体和电子部件。 电子部件嵌入在层压板中。 层压体包括框状导体图案。 当在层叠方向上观察层压体时，框状导体图形被布置成基本上围绕电子部件的整个周边。 框状导体图案包括第一单独导体图案和第二单独导体图案。 第一单独导体图案和第二单独导体图案彼此分离。 第一单独导体图案布置成靠近电子部件的第一外部端子电极，并且第二单独导体图案布置成靠近电子部件的第二外部端子电极。

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