公开(公告)号：US12063738B2

公开(公告)日：2024-08-13

申请号：US17897747

申请日：2022-08-29

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kosuke Nishio ,  Kazuya Soda

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K1/0298 ,  H05K1/11 ,  H05K3/40 ,  H05K3/4644

Abstract: A multilayer substrate includes a multilayer body in which insulating layers are laminated in a laminating direction, a front electrode that is provided on a front surface side of a first insulating layer which is positioned on a front surface side of the multilayer body among the insulating layers, a first internal electrode that is provided on an opposite side to the front electrode with the first insulating layer interposed therebetween, and a first interlayer connection conductor that electrically connects the front electrode and the first internal electrode with each other. The first interlayer connection conductor includes a front side connection surface that is electrically connected with the front electrode and a back side connection surface that is electrically connected with the first internal electrode.

公开(公告)号：US12289828B2

公开(公告)日：2025-04-29

申请号：US18096048

申请日：2023-01-12

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kosuke Nishio

IPC: H05K1/00 ,  H05K1/02

Abstract: A circuit board includes a first section on a left side of a third section in a signal-conductor-layer left-right direction and extending in parallel or substantially in parallel with the third section in a signal-conductor-layer front-back direction when viewed in a stacking direction. The first section includes first thin line portions and first thick line portions, each of the first thick line portions has a line width greater than a line width of each of the first thin line portions. The first thin line portions and the first thick line portions are alternately arranged in the signal-conductor-layer front-back direction. In the signal-conductor-layer left-right direction, center lines of the first thin line portions are positioned leftward relative to center lines of the first thick line portions.

公开(公告)号：US12273994B2

公开(公告)日：2025-04-08

申请号：US17963230

申请日：2022-10-11

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Noriaki Okuda ,  Tomohiro Nagai ,  Kosuke Nishio

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/05 ,  H05K1/18

Abstract: A multilayer substrate module includes a first substrate portion including a first substrate portion body including first insulator layers stacked in a vertical direction and a first conductor layer and/or a first interlayer connection conductor provided at the first substrate portion body. A second substrate portion includes a second substrate portion body including second insulator layers stacked in the vertical direction and a second conductor layer and a second interlayer connection conductor provided at the second substrate portion body, and is mounted on an upper surface of the first substrate portion. A mount device is mounted on an upper surface or a lower surface of the second substrate portion. At least a portion of an inductance component is defined by the first conductor layer and the first interlayer connection conductor.

公开(公告)号：US12230423B2

公开(公告)日：2025-02-18

申请号：US18198475

申请日：2023-05-17

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Nobuo Ikemoto ,  Noriaki Okuda ,  Kosuke Nishio ,  Masanori Okamoto

IPC: H01B7/02 ,  H01B3/30 ,  H01B7/04

Abstract: In a transmission line, a signal conductor layer extends in a front-back direction orthogonal to an up-down direction. A ground conductor layer is above the signal conductor layer. When viewed in a first orthogonal direction, first hollow portions are arranged in the front-back direction in a first direction of the signal conductor layer, and second hollow portions are arranged in the front-back direction in a second direction of the signal conductor layer. Each of regions between adjacent first hollow portions in the front-back direction is a first region. Each of regions between adjacent second hollow portions in the front-back direction is a second region. Each of the first hollow portions overlaps with a corresponding one of the second regions when viewed in a second orthogonal direction. Each of the second hollow portions overlaps with a corresponding one of the first regions when viewed in the second orthogonal direction.

公开(公告)号：US12052818B2

公开(公告)日：2024-07-30

申请号：US17898548

申请日：2022-08-30

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Atsushi Kasuya ,  Tomohiko Naruoka ,  Noriaki Okuda ,  Kosuke Nishio ,  Nobuo Ikemoto

IPC: H05K1/03 ,  H05K1/02 ,  H05K3/00

CPC classification number: H05K1/036 ,  H05K1/0201 ,  H05K1/0215 ,  H05K3/0064 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/015 ,  H05K2201/0323 ,  H05K2201/068

Abstract: A resin multilayer substrate includes a multilayer body including resin base-material layers laminated in a thickness direction and a circuit conductor therein, an end-surface ground conductor provided directly on each end surface of the multilayer body in the thickness direction, an adhesion layer on a side surface of the multilayer body, and a side-surface ground conductor on the adhesion layer. The end-surface and side-surface ground conductors are made of a ground conductor material with a coefficient of thermal expansion whose difference from a coefficient of thermal expansion of the resin base-material layers in a plane direction is smaller than a difference from a coefficient of thermal expansion of the resin base-material layers in the thickness direction. The adhesion layer is made of a material with higher adhesiveness to the side surface of the multilayer body than adhesiveness of the ground conductor material.