公开(公告)号：US20240132714A1

公开(公告)日：2024-04-25

申请号：US18277309

申请日：2022-06-22

Applicant: NAMICS CORPORATION

Inventor： Yuki MATSUURA ,  Ayako SATO ,  Tomoya YAMAZAWA

IPC: C08L63/00 ,  H01L21/56 ,  H01L23/29

CPC classification number: C08L63/00 ,  H01L21/563 ,  H01L23/295 ,  C08K2201/003

Abstract: To suppress the bias of the distribution of a filler dispersed in a sealing material (cured product) covering an electrode connection portion, provided is an epoxy resin composition, including: (A) an epoxy resin; (B) a curing agent; (C) a filler; and (D) an ionic compound in which at least one of a cation or an anion is organic matter.