Mask structure
    1.
    发明授权
    Mask structure 有权
    面膜结构

    公开(公告)号:US09069253B2

    公开(公告)日:2015-06-30

    申请号:US13801945

    申请日:2013-03-13

    CPC classification number: G03F1/22 G03F1/24

    Abstract: A mask structure, including a substrate; an absorber layer formed on the substrate; and a patterned reflection layer formed on the absorber layer. Optionally, the mask structure may further include a buffer layer, a conductive coating, or combinations thereof. The buffer layer may be formed between the absorber layer and the reflection layer, and the conductive coating may be formed at a back side of the substrate.

    Abstract translation: 一种掩模结构,包括基底; 形成在所述基板上的吸收体层; 以及形成在吸收体层上的图案化反射层。 任选地,掩模结构还可以包括缓冲层,导电涂层或其组合。 缓冲层可以形成在吸收层和反射层之间,并且导电涂层可以形成在衬底的背面。

    MASK STRUCTURE
    2.
    发明申请
    MASK STRUCTURE 有权
    掩模结构

    公开(公告)号:US20140272674A1

    公开(公告)日:2014-09-18

    申请号:US13801945

    申请日:2013-03-13

    CPC classification number: G03F1/22 G03F1/24

    Abstract: A mask structure, including a substrate; an absorber layer formed on the substrate; and a patterned reflection layer formed on the absorber layer. Optionally, the mask structure may further include a buffer layer, a conductive coating, or combinations thereof. The buffer layer may be formed between the absorber layer and the reflection layer, and the conductive coating may be formed at a back side of the substrate.

    Abstract translation: 一种掩模结构,包括基底; 形成在所述基板上的吸收体层; 以及形成在吸收体层上的图案化反射层。 任选地,掩模结构还可以包括缓冲层,导电涂层或其组合。 缓冲层可以形成在吸收层和反射层之间,并且导电涂层可以形成在衬底的背面。

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