公开(公告)号：US09215802B2

公开(公告)日：2015-12-15

申请号：US14234604

申请日：2012-12-25

Applicant: NGK SPARK PLUG CO., LTD.

Inventor： Jyun Suzuki ,  Naoki Kito ,  Masami Hasegawa ,  Chizuo Nakashima

IPC: H05K1/00 ,  H05K1/03 ,  H05K3/00 ,  H05K1/18 ,  H05K3/40

CPC classification number: H05K1/0306 ,  H05K1/183 ,  H05K3/0052 ,  H05K3/403 ,  H05K2201/0909 ,  H05K2201/09181 ,  H05K2201/0919 ,  H05K2201/09354

Abstract: A wiring substrate includes a substrate body formed of a plate-like ceramic, having a front surface, a back surface, and a height of 0.8 mm or less; a cavity opening at the front surface and having a rectangular shape as viewed in plane; and side walls having a thickness of 0.3 mm or less between a side surface of the cavity and a side surface of the substrate body. The wiring substrate further includes an electrically conductive layer having the form of a frame and formed on the front surface to surround an opening of the cavity; a ceramic surface having the form of a frame and located adjacently to the electrically conductive layer and along the outer periphery of the front surface; and a via conductor formed in the substrate body along the side surface of the cavity between a bottom surface of the cavity and the front surface.

Abstract translation: 布线基板包括由板状陶瓷形成的基板主体，具有前表面，背面和0.8mm以下的高度; 在前表面开口的空腔，在平面上具有矩形形状; 以及在空腔的侧表面和基板主体的侧表面之间具有0.3mm或更小的厚度的侧壁。 布线基板还包括具有框架形式并形成在前表面上以包围空腔的开口的导电层; 陶瓷表面，其具有框架的形式并且与导电层相邻并且沿着前表面的外周定位; 以及形成在所述基板主体中的所述通孔导体，其沿​​着所述空腔的底表面和所述前表面之间的所述空腔的侧表面。

公开(公告)号：US20140174803A1

公开(公告)日：2014-06-26

申请号：US14234604

申请日：2012-12-25

Applicant: NGK SPARK PLUG CO., LTD

Inventor： Jyun Suzuki ,  Naoki Kito ,  Masami Hasegawa ,  Chizuo Nakashima

IPC: H05K1/03

CPC classification number: H05K1/0306 ,  H05K1/183 ,  H05K3/0052 ,  H05K3/403 ,  H05K2201/0909 ,  H05K2201/09181 ,  H05K2201/0919 ,  H05K2201/09354

Abstract: A wiring substrate includes a substrate body formed of a plate-like ceramic, having a front surface, a back surface, and a height of 0.8 mm or less; a cavity opening at the front surface and having a rectangular shape as viewed in plane; and side walls having a thickness of 0.3 mm or less between a side surface of the cavity and a side surface of the substrate body. The wiring substrate further includes an electrically conductive layer having the form of a frame and formed on the front surface to surround an opening of the cavity; a ceramic surface having the form of a frame and located adjacently to the electrically conductive layer and along the outer periphery of the front surface; and a via conductor formed in the substrate body along the side surface of the cavity between a bottom surface of the cavity and the front surface.

Abstract translation: 布线基板包括由板状陶瓷形成的基板主体，具有前表面，背面和0.8mm以下的高度; 在前表面开口的空腔，在平面上具有矩形形状; 以及在空腔的侧表面和基板主体的侧表面之间具有0.3mm或更小的厚度的侧壁。 布线基板还包括具有框架形式并形成在前表面上以包围空腔的开口的导电层; 陶瓷表面，其具有框架的形式并且与导电层相邻并且沿着前表面的外周定位; 以及形成在所述基板主体中的所述通孔导体，其沿​​着所述空腔的底表面和所述前表面之间的所述空腔的侧表面。