公开(公告)号：US20140202740A1

公开(公告)日：2014-07-24

申请号：US14224216

申请日：2014-03-25

Applicant: NGK SPARK PLUG CO., LTD.

Inventor： Shinnosuke MAEDA ,  Tetsuo SUZUKI ,  Takuya HANDO ,  Tatsuya ITO ,  Satoshi HIRANO ,  Atsuhiko SUGIMOTO

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/09

CPC classification number: H05K1/0298 ,  H01L21/4846 ,  H01L23/49822 ,  H01L2224/16225 ,  H05K1/09 ,  H05K1/111 ,  H05K1/113 ,  H05K3/0055 ,  H05K3/3452 ,  H05K3/4682 ,  H05K2201/068 ,  H05K2201/094 ,  H05K2201/0989 ,  H05K2201/099

Abstract: In a build-up step, a plurality of resin insulation layers and a plurality of conductive layers are alternately laminated in multilayer arrangement on a metal foil separably laminated on a side of a base material, thereby forming a wiring laminate portion. In a drilling step, a plurality of openings are formed in an outermost resin insulation layer through laser drilling so as to expose connection terminals. Subsequently, in a desmear step, smears from inside the openings are removed. In a base-material removing step performed after the build-up step, the base material is removed and the metal foil is exposed.

Abstract translation: 在堆积步骤中，将多个树脂绝缘层和多个导电层以多层布置交替层叠在可分离地层叠在基材侧上的金属箔上，从而形成布线层压体部分。 在钻井工序中，通过激光钻孔在最外层的树脂绝缘层上形成多个开口，露出连接端子。 随后，在去污步骤中，去除开口内部的污迹。 在堆积步骤之后执行的基材除去步骤中，除去基材并暴露金属箔。

公开(公告)号：US20130111746A1

公开(公告)日：2013-05-09

申请号：US13670629

申请日：2012-11-07

Applicant: NGK Spark Plug Co., LTD.

Inventor： Shinnosuke MAEDA ,  Tetsuo SUZUKI ,  Takuya HANDO ,  Atsuhiko SUGIMOTO ,  Satoshi HIRANO ,  Hajime SAIKI

IPC: H05K3/10

CPC classification number: H05K3/0097 ,  H05K3/0035 ,  H05K3/4682 ,  H05K2203/0156 ,  H05K2203/061 ,  H05K2203/1536 ,  Y10T29/49155

Abstract: A method of manufacturing a multilayer wiring substrate includes: a first laminate structure formation step of forming a first laminate structure on a support substrate, the first laminate structure including at least one conductor layer and at least one resin insulation layer; a core substrate formation step of laminating a core substrate on the first laminate structure such that a lower main surface of the core substrate comes in contact with the first laminate structure, the core substrate having a metal layer provided on an upper main surface thereof; and a second laminate structure formation step of forming a second laminate structure on the core substrate such that the second laminate structure covers the metal layer, the second laminate structure including at least one conductor layer and at least one resin insulation layer.

Abstract translation: 一种制造多层布线基板的方法包括：在支撑基板上形成第一层压结构的第一层叠结构形成步骤，所述第一层叠结构包括至少一个导体层和至少一个树脂绝缘层; 核心基板形成步骤，将芯基板层叠在第一层叠结构上，使得芯基板的下主表面与第一层叠结构接触，芯基板具有设置在其上主表面上的金属层; 以及第二层叠结构形成步骤，在所述芯基板上形成第二层叠结构，使得所述第二层叠结构覆盖所述金属层，所述第二层叠结构包括至少一个导体层和至少一个树脂绝缘层。

公开(公告)号：US20150327362A1

公开(公告)日：2015-11-12

申请号：US14651384

申请日：2013-09-11

Applicant: NGK SPARK PLUG CO., LTD.

Inventor： Shinnosuke MAEDA

IPC: H05K1/02 ,  H05K3/42 ,  H05K3/30 ,  H05K3/46 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K1/0298 ,  H01L2224/04105 ,  H01L2224/73267 ,  H01L2924/15153 ,  H05K1/115 ,  H05K1/182 ,  H05K1/185 ,  H05K1/186 ,  H05K3/30 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4647 ,  H05K3/4682 ,  H05K2203/1469 ,  Y10T29/49131

Abstract: To improve the degree of freedom of design of a multilayer wiring substrate incorporating therein an electronic component. A multilayer wiring substrate includes a first layered structure including conductor layers and insulation layers including therein via conductors each having a diameter which decreases from the upper surface of the insulation layer toward the lower surface thereof; an electronic component embedded in the first layered structure; and a second layered structure stacked on the first layered structure, and including conductor layers, and an insulation layer including therein a via conductor having a diameter which decreases from the upper surface of the insulation layer toward the lower surface thereof.

Abstract translation: 为了提高其内装有电子部件的多层布线基板的设计自由度。 多层布线基板包括：第一层状结构，其包括导体层和绝缘层，绝缘层包括其中具有从绝缘层的上表面朝向其下表面减小的直径的导体; 嵌入在所述第一分层结构中的电子部件; 以及层叠在所述第一层叠结构上并且包括导体层的第二层状结构，以及包括其绝缘层的绝缘层，所述绝缘层具有从所述绝缘层的上表面朝向其下表面减小的直径的通孔导体。

公开(公告)号：US20140215782A1

公开(公告)日：2014-08-07

申请号：US14229144

申请日：2014-03-28

Applicant: NGK SPARK PLUG CO., LTD.

Inventor： Shinnosuke MAEDA ,  Tetsuo SUZUKI ,  Satoshi HIRANO

IPC: H05K3/46

CPC classification number: H05K3/4682 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K1/113 ,  H05K3/205 ,  H05K2201/09745 ,  H05K2201/099 ,  H05K2203/0361 ,  H05K2203/0369 ,  H05K2203/0588 ,  Y10T29/302 ,  Y10T29/49117 ,  H01L2924/00

Abstract: A plurality of openings are formed in a resin insulation layer on a top surface side of a wiring laminate portion, and a plurality of openings are formed in a resin insulation layer on a bottom surface side thereof. A plurality of connection terminals are disposed to correspond to the openings. Peripheral portions of terminal outer surfaces of the connection terminals are covered by the resin insulation layer on the top surface side, and peripheral portions of terminal outer surfaces of the connection terminals are covered by the resin insulation layer on the bottom surface side. Each of the second-main-surface-side connection terminals has a concave portion at the center of the terminal outer surface, and the deepest portion of the concave portion is located on the interior side in relation to the peripheral portion of the terminal outer surface.

Abstract translation: 在布线层叠部的顶面侧的树脂绝缘层上形成有多个开口部，在其底面侧的树脂绝缘层上形成有多个开口部。 多个连接端子被设置成对应于这些开口。 连接端子的端子外表面的外围部分被顶表面侧上的树脂绝缘层覆盖，并且连接端子的端子外表面的周边部分被底表面侧上的树脂绝缘层覆盖。 每个第二主表面侧连接端子在端子外表面的中心具有凹部，并且凹部的最深部相对于端子外表面的周边部位于内侧 。

公开(公告)号：US20130161079A1

公开(公告)日：2013-06-27

申请号：US13721402

申请日：2012-12-20

Applicant: NGK SPARK PLUG CO., LTD.

Inventor： Shinnosuke MAEDA ,  Tetsuo SUZUKI ,  Takuya HANDO ,  Atsuhiko SUGIMOTO ,  Satoshi HIRANO ,  Hajime SAIKI

IPC: H05K3/46 ,  H05K1/02

CPC classification number: H05K3/4623 ,  H05K1/0298 ,  H05K3/0035 ,  H05K3/0097 ,  H05K3/4673 ,  H05K3/4682 ,  H05K2203/0156 ,  H05K2203/061 ,  H05K2203/1536 ,  Y10T156/1057

Abstract: Embodiments of the presently-disclosed subject matter include a multilayer wiring substrate including a first laminated structure that includes at least one conductive layer and at least one resin insulating layer; a core substrate that includes a reinforced fiber and that is laminated on the first laminated structure; and a second laminated structure that includes at least one conductive layer and at least one resin insulating layer and that is formed on the core substrate; and a plurality of via conductors which penetrate the first laminated structure, the core substrate, and the second laminated structure in the thickness direction, wherein the plurality of via conductors all expand in diameter in one direction, and the reinforced fiber is located above a center of the core substrate in the thickness direction.

Abstract translation: 目前公开的主题的实施例包括：包括第一层压结构的多层布线基板，其包括至少一个导电层和至少一个树脂绝缘层; 核心基板，其包括增强纤维，并且层压在所述第一层叠结构上; 以及第二层压结构，其包括至少一个导电层和至少一个树脂绝缘层，并且形成在所述芯基板上; 以及沿着厚度方向贯穿所述第一层叠结构，所述芯基板和所述第二层叠结构体的多个通孔导体，其中，所述多个通孔导体在一个方向上均直径扩大，所述强化纤维位于中心的上方 的核心基板在厚度方向上。

公开(公告)号：US20150313018A1

公开(公告)日：2015-10-29

申请号：US14650970

申请日：2013-11-15

Applicant: NGK SPARK PLUG CO., LTD.

Inventor： Shinnosuke MAEDA

IPC: H05K1/11 ,  H01L21/48 ,  H05K3/00 ,  H05K3/46 ,  H05K3/40 ,  H01L23/498 ,  H05K1/03

CPC classification number: H05K1/116 ,  H01L21/4846 ,  H01L21/486 ,  H01L23/145 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/036 ,  H05K1/0366 ,  H05K1/115 ,  H05K3/0032 ,  H05K3/0038 ,  H05K3/4038 ,  H05K3/4602 ,  H05K2201/0191 ,  H05K2201/029 ,  H05K2201/094 ,  H05K2201/09454 ,  H05K2201/09536 ,  H05K2201/09827 ,  H05K2201/09854 ,  H05K2203/0152 ,  H05K2203/0384 ,  H01L2924/00

Abstract: A wiring substrate includes an insulation substrate, a through hole, an upper-surface-side land conductor, a lower-surface-side land conductor, and a through hole conductor. The insulation substrate includes a first insulation layer, a second insulation layer, and a glass fiber layer provided between the first and second insulation layers. The through hole has a diameter which decreases from the upper surface of the insulation substrate toward the interior thereof, which becomes smallest at the glass fiber layer, and which increases from the glass fiber layer toward the lower surface of the insulation substrate. The upper-surface-side land conductor and the lower-surface-side land conductor respectively cover the upper-surface-side and lower-surface-side openings of the through hole. The through hole conductor is formed in the through hole. The upper-surface-side opening of the through hole has a diameter larger than that of the lower-surface-side opening of the through hole, and the upper-surface-side land conductor has a diameter larger than that of the lower-surface-side land conductor.

Abstract translation: 布线基板包括绝缘基板，通孔，上表面侧接地导体，下表面接地导体和通孔导体。 绝缘基板包括第一绝缘层，第二绝缘层和设置在第一绝缘层和第二绝缘层之间的玻璃纤维层。 通孔具有从绝缘基板的上表面朝向其内部减小的直径，其在玻璃纤维层处最小，并且从玻璃纤维层朝向绝缘基板的下表面增大。 上表面侧接地导体和下表面侧接地导体分别覆盖通孔的上表面侧面和下表面侧开口。 通孔导体形成在通孔中。 通孔的上表面侧开口的直径大于通孔的下表面侧开口的直径，并且上表面侧接地导体的直径大于下表面开口的直径 地面指挥。

公开(公告)号：US20130160290A1

公开(公告)日：2013-06-27

申请号：US13721556

申请日：2012-12-20

Applicant: NGK SPARK PLUG CO., LTD.

Inventor： Shinnosuke MAEDA ,  Tetsuo SUZUKI ,  Takuya HANDO ,  Atsuhiko SUGIMOTO ,  Satoshi HIRANO ,  Hajime SAIKI

IPC: H05K3/10

CPC classification number: H05K3/10 ,  H05K3/0035 ,  H05K3/0097 ,  H05K3/4673 ,  H05K3/4682 ,  H05K2203/0156 ,  H05K2203/061 ,  H05K2203/1536 ,  Y10T29/49124 ,  Y10T29/49155

Abstract: Embodiments of the presently-disclosed subject matter include a first laminated structure in which at least one conductor layer and at least one resin insulating layer are alternately formed is formed on a supporting substrate, and a core substrate is formed so as to come into contact with the conductor layer which is the uppermost layer of the first laminated structure. Then, laser light is emitted to the core substrate to form a through hole and a metal layer is formed in the through hole. Then, a second laminated structure including at least one conductor layer and at least one resin insulating layer is formed on the core substrate. At that time, the thickness of the conductor layer which is the uppermost layer of the first laminated structure is greater than that of the other conductor layers.

Abstract translation: 目前公开的主题的实施例包括在支撑基板上形成有至少一个导体层和至少一个树脂绝缘层交替形成的第一层叠结构，并且形成芯基板以与 作为第一层叠结构的最上层的导体层。 然后，将激光发射到芯基板以形成通孔，并且在通孔中形成金属层。 然后，在芯基板上形成包括至少一个导体层和至少一个树脂绝缘层的第二叠层结构。 此时，作为第一层叠结构的最上层的导体层的厚度大于其他导体层的厚度。