公开(公告)号：US20240034914A1

公开(公告)日：2024-02-01

申请号：US18358791

申请日：2023-07-25

Applicant: NITTO DENKO CORPORATION

Inventor： Jun AKIYAMA ,  Yuji KATO ,  Taiki UENO

IPC: C09J7/38 ,  C09J11/06 ,  C09J7/25 ,  C09J7/24 ,  H01L21/683

CPC classification number: C09J7/385 ,  C09J11/06 ,  C09J7/255 ,  C09J7/241 ,  H01L21/6836 ,  C09J2203/326 ,  C09J2301/302 ,  C09J2301/408 ,  C09J2433/00 ,  C09J2467/006 ,  C09J2423/006

Abstract: Provided is a pressure-sensitive adhesive sheet for semiconductor processing having excellent solvent resistance. The pressure-sensitive adhesive sheet for semiconductor processing includes a pressure-sensitive adhesive layer formed of a pressure-sensitive adhesive composition containing a base polymer, and a base material. The pressure-sensitive adhesive composition has a swelling degree SA of 2.1 times or less when immersed in an N,N-dimethylpropionamide solution at 23° C. for 1 hour.

公开(公告)号：US20140087087A1

公开(公告)日：2014-03-27

申请号：US14032549

申请日：2013-09-20

Applicant: NITTO DENKO CORPORATION

Inventor： Tooru NAKASHIMA ,  Jun AKIYAMA

IPC: C09D133/08

CPC classification number: C09D133/08 ,  B32B37/26 ,  B32B2037/1253 ,  B32B2037/243 ,  B32B2037/268 ,  B32B2310/0831 ,  B32B2405/00 ,  C09D4/00 ,  C08F2220/1858 ,  C08F220/06 ,  C08F2222/1013

Abstract: A photo-reactive composition layer is formed on a support with transparency while the support is moved in one direction. Then the support is reversed in a first irradiating chamber as to be moved in a direction opposite to the one direction to generate a serpentine transport path. The support prior to reverse and the support subsequent to reverse face to each other serpentinely, and the support is irradiated with light from lamps for ultraviolet-ray emission. The entire photo-reactive composition layer on the serpentine support is photo-polymerized while the light transmits through the support and the photo-reactive composition layer formed on the support. Then photo-polymerization reaction of the photo-reactive composition layer is facilitated in a second irradiating chamber, adjacent to the first irradiating chamber, using lamps for ultraviolet-ray emission different from those used in the first irradiating chamber in property.

Abstract translation: 当载体沿一个方向移动时，在具有透明性的支撑体上形成光反应性组合物层。 然后，第一照射室中的支撑件在与该一个方向相反的方向上移动以产生蛇形传送路径。 在反向之前的支撑件和随后彼此反向的支撑蛇形地，并且支撑件用来自用于紫外线发射的灯的光照射。 蛇纹载体上的整个光反应性组合物层在光透过载体和形成在载体上的光反应性组合物层时被光聚合。 然后，在与第一照射室相邻的第二照射室中，使用与第一照射室中使用的紫外线发射不同的紫外线发射灯，容易进行光反应性组合物层的光聚合反应。

公开(公告)号：US20130177758A1

公开(公告)日：2013-07-11

申请号：US13778880

申请日：2013-02-27

Applicant: Nitto Denko Corporation

Inventor： Kiyoe SHIGETOMI ,  Masayuki OKAMOTO ,  Masato YAMAGATA ,  Jun AKIYAMA

IPC: C09J177/00 ,  C09J7/02 ,  C09J133/10

CPC classification number: C09J177/00 ,  C08K7/00 ,  C08L57/02 ,  C09J7/10 ,  C09J7/22 ,  C09J7/385 ,  C09J133/06 ,  C09J133/10 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2205/106 ,  C09J2205/11 ,  C09J2400/00 ,  C09J2400/24 ,  C09J2433/00 ,  Y10T428/249986 ,  Y10T428/2848 ,  Y10T428/2891

Abstract: An acrylic pressure-sensitive adhesive composition contains 100 parts by mass of an acrylic polymer (A), 1 to 70 parts by mass of a (meth)acrylic polymer (B) having a weight average molecular weight (Mw) of 1000≦Mw

Abstract translation: 丙烯酸类压敏粘合剂组合物含有100质量份丙烯酸类聚合物（A），1〜70质量份重均分子量（Mw）为1000〜（Mw）的（甲基）丙烯酸系聚合物（B） 30000和1〜50质量份氢化增粘树脂（C）。 （甲基）丙烯酸系聚合物（B）是作为粘合剂组合物的重均分子量小于丙烯酸类聚合物（A）的聚合物，与氢化增粘树脂（C ）。

公开(公告)号：US20240043724A1

公开(公告)日：2024-02-08

申请号：US18358853

申请日：2023-07-25

Applicant: NITTO DENKO CORPORATION

Inventor： Yuji KATO ,  Jun AKIYAMA ,  Taiki UENO

IPC: C09J11/06 ,  C09J7/38 ,  C09J133/08 ,  H01L21/683

CPC classification number: C09J11/06 ,  C09J7/38 ,  C09J133/08 ,  H01L21/6836 ,  C09J2301/408 ,  C09J2301/302 ,  C09J2301/314 ,  C09J2433/00

Abstract: Provided is a pressure-sensitive adhesive sheet for semiconductor processing having excellent followability to unevenness of an adherend, and an excellent anchoring property. The pressure-sensitive adhesive sheet for semiconductor processing includes a pressure-sensitive adhesive layer formed of an ultra-violet (UV)-curable pressure-sensitive adhesive, and a base material. The UV-curable pressure-sensitive adhesive contains a base polymer, a photopolymerization initiator, and a phosphoric acid ester-based surfactant.

公开(公告)号：US20130183455A1

公开(公告)日：2013-07-18

申请号：US13738284

申请日：2013-01-10

Applicant: NITTO DENKO CORPORATION

Inventor： Jun AKIYAMA ,  Hajime FUKUNAGA

IPC: B05D3/06 ,  B05D5/10

CPC classification number: B05D3/067 ,  B05D5/10 ,  C08F2/48 ,  C09J7/385 ,  C09J133/08 ,  C09J2201/622 ,  C09J2205/31

Abstract: Provided is a method for producing an pressure-sensitive adhesive sheet having an ultraviolet-ray curing-type acrylic pressure-sensitive adhesive layer that can undergo, about one or more monomers therefor, high rate-polymerization to be excellent in productivity, and is also excellent in balance between pressure-sensitive adhesive performances. The method includes: applying, onto a substrate, an ultraviolet-ray curing-type acrylic pressure-sensitive adhesive composition including a photopolymerization initiator, and a monomer-component set that is/includes an alkyl (meth)acrylate; and radiating ultraviolet rays to the composition, thereby curing the composition to form a pressure-sensitive adhesive layer. In the method, the irradiance of the rays radiated in the pressure-sensitive adhesive layer forming step is 25 mW/cm2 or more. When the radiation dose of the radiated ultraviolet rays is 600 mJ/cm2 and is 2400 mJ/cm2, the polymerization rate of the monomer-component set is 30% or less, and 70% or more, respectively.

Abstract translation: 提供一种具有紫外线固化型丙烯酸类压敏粘合剂层的粘合片的制造方法，该粘合剂层可以经受大约一种或多种单体的高速聚合，生产率优异，并且也是 压敏粘合剂性能之间的平衡优异。 该方法包括：在基材上涂布含有光聚合引发剂的紫外线固化型丙烯酸类压敏粘合剂组合物和（甲基）丙烯酸烷基酯的单体组分组合物， 并将紫外线照射到组合物上，从而固化组合物以形成压敏粘合剂层。 在该方法中，在粘合剂层形成步骤中照射的射线的辐照度为25mW / cm 2以上。 当辐射紫外线的辐射剂量为600mJ / cm 2且为2400mJ / cm 2时，单体组分的聚合速率分别为30％以下，70％以上。

公开(公告)号：US20240287354A1

公开(公告)日：2024-08-29

申请号：US18572140

申请日：2022-02-22

Applicant: NITTO DENKO CORPORATION

Inventor： Jun AKIYAMA ,  Keita YOSHIDA

IPC: C09J7/38

CPC classification number: C09J7/38 ,  C09J2203/326 ,  C09J2301/312

Abstract: Provided is a pressure-sensitive adhesive sheet for processing a semiconductor element, which is capable of protecting a semiconductor element from electrostatic breakdown caused by peeling electrification and frictional electrification even under a high-humidity environment and/or under the application of a high voltage. The pressure-sensitive adhesive sheet includes a pressure-sensitive adhesive layer and a base material. A surface resistivity ρsBM of the base material and a surface resistivity ρsPA of the pressure-sensitive adhesive layer are each 1.0×1013Ω/□ or less. In one embodiment, a surface resistivity ρs10VBM of the base material at a time of application of 10 V and a surface resistivity ρs10VPA of the pressure-sensitive adhesive layer at a time of application of 10 V, and a surface resistivity ρs1000VBM 1,000 V and a surface resistivity ρs1000VPA 1,000 V satisfy the following expression (1) and expression (2).









ρs

1000
⁢

VBM


/

ρs

10
⁢

VBM



≤

1
,
000





(
1
)














ρs

1000
⁢

VPA


/

ρs

10
⁢

VPA



≤

1
,
000





(
2
)

公开(公告)号：US20160160089A1

公开(公告)日：2016-06-09

申请号：US14951591

申请日：2015-11-25

Applicant: NITTO DENKO CORPORATION

Inventor： Shunpei TANAKA ,  Tomokazu TAKAHASHI ,  Jun AKIYAMA

IPC: C09J7/02 ,  H01L21/683

CPC classification number: H01L21/6836 ,  C09J7/22 ,  C09J7/38 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2433/00 ,  H01L21/6835 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2221/68386

Abstract: Provided is a pressure-sensitive adhesive sheet capable of maintaining a desired pressure-sensitive adhesive characteristic even in a production method for a semiconductor including, for example, a step of peeling off a support material. The pressure-sensitive adhesive sheet includes a backing layer and a pressure-sensitive adhesive layer, in which the pressure-sensitive adhesive layer has a water contact angle of from 80° to 105°. The pressure-sensitive adhesive sheet is used in a production method for a semiconductor including a step in which the pressure-sensitive adhesive layer is brought into contact with a solvent having a solubility in water at 20° C. of 1 g/100 mL or less.

Abstract translation: 提供即使在包括例如剥离载体材料的步骤的半导体制造方法中也能够保持期望的压敏粘合剂特性的压敏粘合片。 压敏粘合片包括背层和粘合剂层，其中粘合剂层的水接触角为80°至105°。 该粘合片用于半导体制造方法，其包括使粘合剂层与20℃下在水中溶解度为1g / 100mL的溶剂接触的步骤，或 减。

公开(公告)号：US20140220255A1

公开(公告)日：2014-08-07

申请号：US14169727

申请日：2014-01-31

Applicant: NITTO DENKO CORPORATION

Inventor： Jun AKIYAMA ,  Tooru NAKASHIMA

IPC: C09J7/02

CPC classification number: C09J7/385 ,  C09J2205/31

Abstract: Provided is a method for producing a pressure-sensitive adhesive sheet having an ultraviolet-ray curing-type acrylic pressure-sensitive adhesive layer that has a high conversion per unit amount of light, is excellent in productivity, and is also excellent in balance between pressure-sensitive adhesive performances. The method includes: a pressure-sensitive adhesive layer forming step in which the composition is irradiated with and cured by ultraviolet rays to form a pressure-sensitive adhesive layer; wherein an ultraviolet lamp that radiates the ultraviolet rays in the pressure-sensitive adhesive layer forming step is an LED lamp; the ultraviolet rays are radiated intermittently; and the time of bright periods when the ultraviolet rays are radiated is from 1 second to 30 seconds, and the time of dark periods when the rays are not radiated is from 0.1 timed to 20 times the time of the bright periods.

Abstract translation: 本发明提供一种具有紫外线固化型丙烯酸系粘合剂层的粘合片的制造方法，该粘合片具有高单位量的转化率，生产率优异，压力平衡优异 敏感胶粘剂性能。 该方法包括：压敏粘合剂层形成步骤，其中通过紫外线照射和固化组合物以形成压敏粘合剂层; 其中在所述压敏粘合剂层形成步骤中照射紫外线的紫外线灯是LED灯; 紫外线间歇地辐射; 紫外线照射时的亮时间为1秒〜30秒，光线不照射时的黑暗时期为亮时间的0.1倍〜20倍。

公开(公告)号：US20140147599A1

公开(公告)日：2014-05-29

申请号：US14091964

申请日：2013-11-27

Applicant: NITTO DENKO CORPORATION

Inventor： Jun AKIYAMA ,  Tooru NAKASHIMA

IPC: C09J7/02 ,  C08J5/18

CPC classification number: C08J5/18 ,  B29C35/0888 ,  B29C35/10 ,  B29C2035/0827 ,  C09J7/38

Abstract: The present invention relates to a method in which: a photoreactive composition layer is formed on a support while conveying the support in one direction, the support is turned around at least once so that the support before turnaround faces the support after turnaround by conveying the support in the direction opposite the foregoing one direction to make a conveying route of the support multistage traveling, and in the course of multistage traveling, the support is turned around while keeping contact with three or more conveying rollers at least during the first turnaround, and light is emitted toward the support from a light irradiator to cause photopolymerization of the photoreactive composition layer formed on the support.

Abstract translation: 本发明涉及一种方法，其中：在一个方向上输送支持体的同时，在支撑体上形成光反应性组合物层，支撑体至少转动一次，使得转向后的支撑件在转向后面对支撑件， 在与上述一个方向相反的方向上，使得支撑件多段行进的输送路径，并且在多级行进过程中，至少在第一次周转期间保持与三个或更多输送辊的接触的同时转动支撑件，并且光 从光照射器向支撑体射出，使形成在支持体上的光反应性组合物层发生光聚合。

公开(公告)号：US20130274419A1

公开(公告)日：2013-10-17

申请号：US13911194

申请日：2013-06-06

Applicant: NITTO DENKO CORPORATION

Inventor： Masayuki OKAMOTO ,  Masahito NIWA ,  Jun AKIYAMA ,  Kiyoe SHIGETOMI

IPC: C09J133/08

CPC classification number: C09J133/08 ,  C08F120/18 ,  C08F220/14 ,  C08F220/18 ,  C08F222/1006 ,  C08F2220/1858 ,  C09J133/06 ,  C08F226/08 ,  C08F220/06

Abstract: An acrylic pressure-sensitive adhesive composition contains: an acrylic polymer (A); and a (meth)acrylic polymer (B) that includes, as a monomer unit, a (meth)acrylic monomer having a tricyclic or higher alicyclic structure and that has a weight average molecular weight of 1000 or more and less than 30000.

Abstract translation: 丙烯酸类压敏粘合剂组合物包含：丙烯酸类聚合物（A）; 和作为单体单元的（甲基）丙烯酸系聚合物（B），其具有三环或更高脂环结构的重均分子量为1000以上且小于30000的（甲基）丙烯酸单体。