公开(公告)号：US20140162434A1

公开(公告)日：2014-06-12

申请号：US14056596

申请日：2013-10-17

Applicant: NITTO DENKO CORPORATION

Inventor： Goji SHIGA ,  Koji MIZUNO ,  Naohide TAKAMOTO

IPC: H01L21/683 ,  H01L21/78

CPC classification number: H01L21/6836 ,  H01L21/563 ,  H01L21/78 ,  H01L23/544 ,  H01L24/81 ,  H01L24/83 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/68377 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/16245 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/81007 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2224/83007 ,  H01L2224/83102 ,  H01L2224/83862 ,  H01L2924/12042 ,  H01L2924/3511 ,  Y10T428/14 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/00

Abstract: A dicing tape integrated adhesive sheet including a substrate, a dicing tape in which a pressure-sensitive adhesive layer is laminated on the substrate, and an adhesive sheet formed on the pressure-sensitive adhesive layer, wherein a peeling force between the pressure-sensitive adhesive layer and the adhesive sheet is 0.02 to 0.5 N/20 mm obtained with a peeling test at a peeling rate of 10 m/minute and a peeling angle of 150°, and an absolute value of a peeling electrification voltage is 0.5 kV or less when the pressure-sensitive adhesive layer and the adhesive sheet are peeled off under conditions of the peeling test.

Abstract translation: 一种切割胶带一体粘合片，其包括基材，在基材上层压有粘合剂层的切割胶带和形成在该粘合剂层上的粘合片，其中，压敏粘合剂 层，粘合片的剥离试验以剥离速度为10m /分钟，剥离角为150°得到0.02〜0.5N / 20mm，剥离带电电压的绝对值为0.5kV以下， 在剥离试验的条件下剥离压敏粘合剂层和粘合片。

公开(公告)号：US20160211217A1

公开(公告)日：2016-07-21

申请号：US14908687

申请日：2014-06-30

Applicant: NITTO DENKO CORPORATION

Inventor： Chie IINO ,  Takeshi MATSUMURA ,  Goji SHIGA ,  Kosuke MORITA

IPC: H01L23/544 ,  H01L25/00 ,  H01L25/065

CPC classification number: H01L23/544 ,  H01L21/561 ,  H01L23/295 ,  H01L23/3128 ,  H01L24/02 ,  H01L24/11 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L2223/54426 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/02311 ,  H01L2224/02313 ,  H01L2224/0401 ,  H01L2224/16146 ,  H01L2224/17181 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83191 ,  H01L2224/92 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06568 ,  H01L2225/06582 ,  H01L2225/06593 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/0231 ,  H01L2224/11 ,  H01L2224/83 ,  H01L21/56 ,  H01L2223/544 ,  H01L21/304 ,  H01L21/78 ,  H01L2924/00014

Abstract: Provided is a thermosetting sheet for sealing which is used to seal an electronic device. One surface of the sheet has a surface roughness (Ra) of 3 μm or less before the sheet is cured.

Abstract translation: 提供一种用于密封电子设备的用于密封的热固性片材。 片材的一个表面在片材固化之前的表面粗糙度（Ra）为3μm以下。

公开(公告)号：US20160056066A1

公开(公告)日：2016-02-25

申请号：US14783339

申请日：2014-04-03

Applicant: NITTO DENKO CORPORATION

Inventor： Goji SHIGA ,  Naohide TAKAMOTO

IPC: H01L21/683 ,  H01L23/00 ,  H01L23/544 ,  C09J7/02 ,  C09J133/08

CPC classification number: H01L21/6836 ,  C08K3/013 ,  C08K3/36 ,  C08K7/18 ,  C08K2201/003 ,  C09J7/38 ,  C09J7/385 ,  C09J133/04 ,  C09J133/08 ,  C09J2201/122 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2433/00 ,  H01L23/544 ,  H01L24/16 ,  H01L24/17 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2223/54433 ,  H01L2223/54453 ,  H01L2223/54486 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/01014 ,  H01L2924/0635 ,  C08L33/04

Abstract: The present invention provides an adhesive sheet used in manufacture of a semiconductor device, containing a filler having an average particle size of 0.3 μm or less and an acrylic resin, wherein the content of the filler is in the range of 20 to 45% by weight with respect to the entire adhesive sheet, and the content of the acrylic resin is in the range of 40 to 70% by weight with respect to entire resin components.

Abstract translation: 本发明提供一种用于制造半导体器件的粘合片，其包含平均粒度为0.3μm以下的填料和丙烯酸树脂，其中填料的含量为20〜45重量％ 相对于整个粘合片，丙烯酸树脂的含量相对于树脂成分的总量为40〜70重量％。

公开(公告)号：US20140203458A1

公开(公告)日：2014-07-24

申请号：US14221314

申请日：2014-03-21

Applicant: NITTO DENKO CORPORATION

Inventor： Naohide TAKAMOTO ,  Goji SHIGA ,  Fumiteru ASAI ,  Toshimasa SUGIMURA

IPC: H01L21/683 ,  H01L21/78

CPC classification number: H01L21/6836 ,  C09J7/22 ,  C09J7/38 ,  C09J2203/326 ,  C09J2205/31 ,  H01L21/78 ,  H01L23/544 ,  H01L24/16 ,  H01L24/81 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2223/54486 ,  H01L2224/16225 ,  H01L2924/12042 ,  Y10T428/1467 ,  Y10T428/1471 ,  Y10T428/28 ,  H01L2924/00

Abstract: The present invention provides a dicing tape-integrated film for semiconductor back surface, including a film for flip chip type semiconductor back surface for protecting a back surface of a semiconductor element flip chip-connected onto an adherend, and a dicing tape, the dicing tape including a base material and a pressure-sensitive adhesive layer provided on the base material, the film for flip chip type semiconductor back surface being formed on the pressure-sensitive adhesive layer, in which the pressure-sensitive adhesive layer is a radiation-curable pressure-sensitive adhesive layer whose pressure-sensitive adhesive force toward the film for flip chip type semiconductor back surface is decreased by irradiation with a radiation ray.

Abstract translation: 本发明提供了一种用于半导体背面的切割带集成膜，包括用于倒装芯片型半导体背表面的膜，用于保护连接到被粘物上的半导体元件倒装芯片的后表面和切割带，切割带 包括基材和设置在基材上的压敏粘合剂层，在压敏粘合剂层上形成用于倒装芯片型半导体背表面的膜，其中压敏粘合剂层是可辐射固化压力 敏感粘合剂层，其通过用辐射线照射而降低了对于倒装芯片型半导体背表面的膜的压敏粘合力。

公开(公告)号：US20160172230A1

公开(公告)日：2016-06-16

申请号：US15046235

申请日：2016-02-17

Applicant: NITTO DENKO CORPORATION

Inventor： Naohide TAKAMOTO ,  Goji SHIGA ,  Fumiteru ASAI

IPC: H01L21/683 ,  H01L21/78 ,  H01L21/66 ,  H01L23/00 ,  B32B37/12 ,  B32B7/12

CPC classification number: H01L21/6836 ,  B32B5/022 ,  B32B5/028 ,  B32B7/12 ,  B32B15/08 ,  B32B25/08 ,  B32B25/12 ,  B32B25/14 ,  B32B25/18 ,  B32B27/08 ,  B32B27/10 ,  B32B27/12 ,  B32B27/281 ,  B32B27/306 ,  B32B27/308 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B27/365 ,  B32B27/38 ,  B32B29/002 ,  B32B37/12 ,  B32B2250/44 ,  B32B2270/00 ,  B32B2274/00 ,  B32B2307/202 ,  B32B2307/302 ,  B32B2307/306 ,  B32B2307/414 ,  B32B2307/514 ,  B32B2307/54 ,  B32B2307/732 ,  B32B2457/14 ,  H01L21/78 ,  H01L22/20 ,  H01L24/81 ,  H01L2221/68327 ,  H01L2221/68386 ,  H01L2924/014 ,  Y10T156/10 ,  Y10T428/24355

Abstract: The present invention relates to a dicing tape-integrated film for semiconductor back surface, which includes: a dicing tape including a base material having an asperities-formed surface, and a pressure-sensitive adhesive layer laminated on the base material, and a film for semiconductor back surface laminated on the pressure-sensitive adhesive layer of the dicing tape, in which the dicing tape has a haze of at most 45%.

Abstract translation: 本发明涉及一种半导体背面用切割带一体化膜，其特征在于，包括：具有凹凸形成面的基材和层叠在基材上的粘合剂层的切割带，以及用于 半导体背表面层叠在切割带的压敏粘合剂层上，其中切割带的雾度为至多45％。

公开(公告)号：US20150162236A1

公开(公告)日：2015-06-11

申请号：US14624702

申请日：2015-02-18

Applicant: NITTO DENKO CORPORATION

Inventor： Naohide TAKAMOTO ,  Goji SHIGA ,  Fumiteru ASAI

IPC: H01L21/683 ,  C09J7/02 ,  B32B38/10 ,  B32B37/12 ,  B32B38/00

CPC classification number: H01L21/6836 ,  B32B37/1284 ,  B32B38/0004 ,  B32B38/10 ,  B32B2405/00 ,  B32B2457/14 ,  C09J7/20 ,  C09J165/00 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2461/00 ,  C09J2463/00 ,  H01L21/561 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/293 ,  H01L23/3114 ,  H01L23/3164 ,  H01L23/544 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2221/68336 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2221/68386 ,  H01L2223/54406 ,  H01L2223/5442 ,  H01L2223/5448 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/27003 ,  H01L2224/27436 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29386 ,  H01L2224/73204 ,  H01L2224/81095 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/8191 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/92 ,  H01L2224/92125 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/15788 ,  Y10T156/1052 ,  Y10T156/1064 ,  Y10T156/1075 ,  Y10T156/1077 ,  Y10T156/1082 ,  Y10T156/1093 ,  Y10T428/1471 ,  Y10T428/1476 ,  Y10T428/1495 ,  Y10T428/15 ,  Y10T428/21 ,  H01L21/78 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2924/01083 ,  H01L2224/13099

Abstract: The present invention relates to a film for semiconductor device production, which includes: a separator; and a plurality of adhesive layer-attached dicing tapes each including a dicing tape and an adhesive layer laminated on the dicing tape, which are laminated on the separator at a predetermined interval in such a manner that the adhesive layer attaches to the separator, in which the separator has a cut formed along the outer periphery of the dicing tape, and the depth of the cut is at most ⅔ of the thickness of the separator.

Abstract translation: 本发明涉及一种用于半导体器件生产的膜，其包括：隔板; 以及多个粘附层附着的切割带，每个粘合剂层附着的切割带包括层合在切割带上的切割带和粘合剂层，它们以预定的间隔层压在隔板上，使得粘合剂层附着到隔板上，其中 分离器具有沿着切割带的外周形成的切口，并且切割深度为隔板的厚度的至多。。

公开(公告)号：US20140175677A1

公开(公告)日：2014-06-26

申请号：US14188991

申请日：2014-02-25

Applicant: NITTO DENKO CORPORATION

Inventor： Naohide TAKAMOTO ,  Takeshi MATSUMURA ,  Goji SHIGA

IPC: H01L21/683 ,  H01L23/00

CPC classification number: H01L21/6836 ,  H01L21/67132 ,  H01L23/562 ,  H01L24/16 ,  H01L24/81 ,  H01L2221/68377 ,  H01L2224/81201 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/3025 ,  Y10T428/28 ,  Y10T428/2848 ,  H01L2924/00

Abstract: The present invention provides a dicing tape-integrated film for semiconductor back surface, which includes: a dicing tape including a base material and a pressure-sensitive adhesive layer provided on the base material; and a film for flip chip type semiconductor back surface provided on the pressure-sensitive adhesive layer, in which the film for flip chip type semiconductor back surface contains a black pigment.

Abstract translation: 本发明提供一种半导体背面用切割带一体膜，其特征在于，包括：基材的切割带和设置在基材上的粘合剂层; 以及用于倒装芯片型半导体背面的膜包含黑色颜料的压敏粘合剂层上的倒装芯片型半导体背面的膜。

公开(公告)号：US20140159254A1

公开(公告)日：2014-06-12

申请号：US14182543

申请日：2014-02-18

Applicant: NITTO DENKO CORPORATION

Inventor： Naohide TAKAMOTO ,  Takeshi MATSUMURA ,  Goji SHIGA

IPC: H01L23/00 ,  H01L21/683 ,  H01L21/78

CPC classification number: H01L23/562 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3164 ,  H01L23/544 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/81 ,  H01L2221/68377 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16221 ,  H01L2224/274 ,  H01L2224/73204 ,  H01L2224/81007 ,  H01L2224/81097 ,  H01L2224/81193 ,  H01L2224/814 ,  H01L2224/81815 ,  H01L2224/831 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/3025 ,  Y10T428/1476 ,  Y10T428/28 ,  H01L2924/01082 ,  H01L2924/01047 ,  H01L2924/0103 ,  H01L2924/01083 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/3512 ,  H01L2924/00

Abstract: The present invention provides a dicing tape-integrated film for semiconductor back surface, which includes: a dicing tape including a base material and a pressure-sensitive adhesive layer provided on the base material; and a film for flip chip type semiconductor back surface provided on the pressure-sensitive adhesive layer, in which a peel force (temperature: 23° C., peeling angle: 180°, tensile rate: 300 mm/min) between the pressure-sensitive adhesive layer of the dicing tape and the film for flip chip type semiconductor back surface is from 0.05 N/20 mm to 1.5 N/20 mm.

Abstract translation: 本发明提供一种半导体背面用切割带一体膜，其特征在于，包括：基材的切割带和设置在基材上的粘合剂层; 以及设置在压敏粘合剂层上的倒装芯片型半导体背面的膜，其中压敏粘合剂层之间的剥离力（温度：23℃，剥离角度：180°，拉伸速度：300mm / min） 切割带的粘合剂层和倒装芯片型半导体背面的膜的厚度为0.05N / 20mm至1.5N / 20mm。

公开(公告)号：US20130328217A1

公开(公告)日：2013-12-12

申请号：US13910304

申请日：2013-06-05

Applicant: NITTO DENKO CORPORATION

Inventor： Naohide TAKAMOTO ,  Goji SHIGA

IPC: H01L21/56

CPC classification number: H01L21/561 ,  H01L21/563 ,  H01L23/293 ,  H01L23/295 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16238 ,  H01L2224/16258 ,  H01L2224/81007 ,  H01L2224/81097 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2924/12042 ,  H01L2924/00014 ,  H01L2924/0103 ,  H01L2924/01083 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/00

Abstract: An object of the present invention is to provide a method of marking a semiconductor element with which a semiconductor device can be manufactured effectively even in the case of marking every semiconductor element, and a method of manufacturing the semiconductor device. The present invention relates to a method of marking a semiconductor element, wherein marking is performed on a semiconductor element that is inserted in a pocket of a carrier that can be wound up in a reel state. The present invention relates to a method of manufacturing a semiconductor device comprising: a step 1 of inserting a semiconductor element in a pocket of a carrier that can be wound up in a reel state; and a step 2 of marking the semiconductor element that is inserted in the pocket.

Abstract translation: 本发明的目的是提供一种标记半导体元件的方法，即使在标记每个半导体元件的情况下也能够有效地制造半导体器件，以及半导体器件的制造方法。 本发明涉及一种标记半导体元件的方法，其中在插入可以卷绕在卷轴状态的载体的凹槽中的半导体元件上执行标记。 本发明涉及一种制造半导体器件的方法，包括：将半导体元件插入可卷绕在卷轴状态的载体的凹槽中的步骤1; 以及标记插入袋中的半导体元件的步骤2。

公开(公告)号：US20180346640A1

公开(公告)日：2018-12-06

申请号：US16059750

申请日：2018-08-09

Applicant: NITTO DENKO CORPORATION

Inventor： Goji SHIGA ,  Naohide TAKAMOTO ,  Fumiteru ASAI

IPC: C08G59/62 ,  C09J163/00 ,  C08L63/00 ,  B32B27/38 ,  C08K3/36

CPC classification number: C08G59/621 ,  B32B27/38 ,  C08K3/36 ,  C08L63/00 ,  C09J163/00 ,  H01L2224/16225 ,  Y10T83/04 ,  Y10T428/31511

Abstract: The present invention relates to a film for flip chip type semiconductor back surface to be formed on a back surface of a semiconductor element flip chip-connected onto an adherend, the film for flip chip type semiconductor back surface having a ratio of A/B falling within a range of 1 to 8×103 (%/GPa), in which A is an elongation ratio (%) of the film for flip chip type semiconductor back surface at 23° C. before thermal curing and B is a tensile storage modulus (GPa) of the film for flip chip type semiconductor back surface at 23° C. before thermal curing.