公开(公告)号：US20090211795A1

公开(公告)日：2009-08-27

申请号：US12394889

申请日：2009-02-27

Applicant: Noriyuki SHIRASAWA

Inventor： Noriyuki SHIRASAWA

IPC: H05K1/16

CPC classification number: H05K3/305 ,  H01L21/563 ,  H01L23/13 ,  H01L23/498 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/92125 ,  H05K3/3452 ,  H05K2201/09063 ,  H05K2201/0989 ,  H05K2201/09909 ,  H05K2201/10674 ,  H05K2201/10977 ,  Y02P70/613 ,  Y10T29/49121 ,  Y10T29/49126 ,  H01L2924/00

Abstract: A printed board comprising a packaging surface on which an electronic component is packaged, an adhesion prohibited portion which is provided at a region of the printed board different from a region where the electronic component is provided, and to which adhesion of the adhesive material is prohibited, and a blocking step portion which is formed at a region between the region where the electronic component is provided and the region where the adhesion prohibited portion is provided, which blocks any adhesive material which has spilled out from between the bottom surface of the electronic component and the packaging surface from reaching the adhesion prohibited portion.

Abstract translation: 一种印刷电路板，包括封装有电子部件的封装表面，设置在与设置有电子部件的区域不同的印刷电路板的区域的粘合禁止部分，并且粘合剂材料的粘合被禁止 以及形成在设置电子部件的区域与设置有防粘连部的区域之间的区域的阻挡台阶部，其阻挡从电子部件的底面之间溅出的任何粘合材料 并且包装表面到达不粘附部分。