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    LIGHT EMITTING ASSEMBLY AND METHOD FOR OPERATING A LIGHT EMITTING ASSEMBLY
    1.
    发明申请
    LIGHT EMITTING ASSEMBLY AND METHOD FOR OPERATING A LIGHT EMITTING ASSEMBLY 审中-公开

    公开(公告)号：US20180295694A1

    公开(公告)日：2018-10-11

    申请号：US15949119

    申请日：2018-04-10

    Applicant: OSRAM GmbH

    Inventor： Farhang Ghasemi Afshar

    IPC: H05B33/08

    CPC classification number: H05B33/0857 ,  H05B33/0824 ,  H05B33/0863 ,  H05B33/0869 ,  H05B37/0227 ,  H05B37/029

    Abstract: A light emitting assembly includes a first light emitting component, a second light emitting component, and a third light emitting component. The components are arranged such that a first light, a second light and a third light mix to form a mixed light. The assembly includes a control device, which has a first control channel and a second control channel operating the three components and configured such that in a first operating range the first component is driven via the first channel and the second and third components are driven jointly via the second channel. In the first operating range the mixed light is continuously adjustable from the first color to a fourth color, and in a second operating range the second component is driven via the second channel and the first and third components are driven jointly via the first channel.

    LED MODULE INCLUDING AN LED
    4.
    发明申请
    LED MODULE INCLUDING AN LED 有权
    LED模块包括一个LED

    公开(公告)号：US20160010808A1

    公开(公告)日：2016-01-14

    申请号：US14790033

    申请日：2015-07-02

    Applicant: Osram GmbH

    Inventor： Farhang Ghasemi Afshar

    IPC: F21K99/00 ,  F21V23/06 ,  F21V3/00

    CPC classification number: H01L25/0753 ,  H01L33/52 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: An LED module includes a carrier plate having an arrangement face and a wall on the upper side of the plate, the wall running peripherally around the arrangement face and being raised upwards with respect to said arrangement face; an LED arranged on the face; a contact element, to which the LED is connected; and an at least partially transparent potted body covering the arrangement face and the LED towards the top and laterally adjoins an inner face of the wall. The wall is formed monolithically with the remaining carrier plate and is interrupted over its periphery, and the potted body does not adjoin the inner wall face of the wall. The contact element extends away from the arrangement face along the upper side of the carrier plate in the interruption region so that electrical contact can be made with the LED via the contact element from outside the body.

    Abstract translation: LED模块包括：承载板，其具有在所述板的上侧上的布置面和壁，所述壁在所述布置面周围周边延伸并相对于所述布置面向上升起; 一个LED布置在脸上; LED连接到的接触元件; 以及至少部分透明的盆盖体，其覆盖所述布置面和所述LED朝向顶部并横向邻接所述壁的内表面。 壁与剩余的载板一体形成，并在其周边上被中断，并且盆状体不与壁的内壁面相邻。 接触元件在中断区域中沿着承载板的上侧远离配置面延伸，使得可以通过接触元件从身体外部与LED进行电接触。

    LED module including an LED
    5.
    发明授权
    LED module including an LED 有权

    公开(公告)号：US09613936B2

    公开(公告)日：2017-04-04

    申请号：US14790033

    申请日：2015-07-02

    Applicant: Osram GmbH

    Inventor： Farhang Ghasemi Afshar

    IPC: F21S13/10 ,  H01L25/075 ,  H01L33/52 ,  H01L33/62

    CPC classification number: H01L25/0753 ,  H01L33/52 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: An LED module includes a carrier plate having an arrangement face and a wall on the upper side of the plate, the wall running peripherally around the arrangement face and being raised upwards with respect to said arrangement face; an LED arranged on the face; a contact element, to which the LED is connected; and an at least partially transparent potted body covering the arrangement face and the LED towards the top and laterally adjoins an inner face of the wall. The wall is formed monolithically with the remaining carrier plate and is interrupted over its periphery, and the potted body does not adjoin the inner wall face of the wall. The contact element extends away from the arrangement face along the upper side of the carrier plate in the interruption region so that electrical contact can be made with the LED via the contact element from outside the body.

    LED MODULE
    6.
    发明申请
    LED MODULE 有权
    LED模块

    公开(公告)号：US20140191255A1

    公开(公告)日：2014-07-10

    申请号：US14133747

    申请日：2013-12-19

    Applicant: OSRAM GmbH

    Inventor： Farhang Ghasemi Afshar ,  Krister Bergenek ,  Andreas Dobner ,  Holger Huebner ,  Meik Weckbecker ,  Ralph Wirth

    IPC: H01L31/12

    CPC classification number: H05B33/0803

    Abstract: In various embodiments, a light emitting diode module may include a carrier plate, at least one light emitting diode, and at least one sensor configured to register light emitted by the light emitting diode. The light emitting diode is attached to a light emitting diode installation side of the carrier plate. The sensor is installed countersunk through a hole of the carrier plate in relation to the light emitting diode installation side thereof.

    Abstract translation: 在各种实施例中，发光二极管模块可以包括载体板，至少一个发光二极管，以及配置成对发光二极管发射的光进行配准的至少一个传感器。 发光二极管连接到载板的发光二极管安装侧。 传感器相对于其发光二极管安装侧通过承载板的孔安装埋头。

    Light emitting assembly and method for operating a light emitting assembly
    7.
    发明授权
    Light emitting assembly and method for operating a light emitting assembly 有权

    公开(公告)号：US10178733B2

    公开(公告)日：2019-01-08

    申请号：US15949119

    申请日：2018-04-10

    Applicant: OSRAM GmbH

    Inventor： Farhang Ghasemi Afshar

    IPC: H05B37/02 ,  H05B33/08

    Abstract: A light emitting assembly includes a first light emitting component, a second light emitting component, and a third light emitting component. The components are arranged such that a first light, a second light and a third light mix to form a mixed light. The assembly includes a control device, which has a first control channel and a second control channel operating the three components and configured such that in a first operating range the first component is driven via the first channel and the second and third components are driven jointly via the second channel. In the first operating range the mixed light is continuously adjustable from the first color to a fourth color, and in a second operating range the second component is driven via the second channel and the first and third components are driven jointly via the first channel.

    LED module
    8.
    发明授权
    LED module 有权
    LED模块

    公开(公告)号：US09414447B2

    公开(公告)日：2016-08-09

    申请号：US14133747

    申请日：2013-12-19

    Applicant: OSRAM GmbH

    Inventor： Farhang Ghasemi Afshar ,  Krister Bergenek ,  Andreas Dobner ,  Holger Huebner ,  Meik Weckbecker ,  Ralph Wirth

    IPC: H01L33/52 ,  H01L33/44 ,  H01L23/522 ,  F21V33/00 ,  H05B33/08

    CPC classification number: H05B33/0803

    Abstract: In various embodiments, a light emitting diode module may include a carrier plate, at least one light emitting diode, and at least one sensor configured to register light emitted by the light emitting diode. The light emitting diode is attached to a light emitting diode installation side of the carrier plate. The sensor is installed countersunk through a hole of the carrier plate in relation to the light emitting diode installation side thereof.

    Abstract translation: 在各种实施例中，发光二极管模块可以包括载体板，至少一个发光二极管，以及配置成对发光二极管发射的光进行配准的至少一个传感器。 发光二极管连接到载板的发光二极管安装侧。 传感器相对于其发光二极管安装侧通过承载板的孔安装埋头。

    LIGHTING MODULE WITH SEMICONDUCTOR LIGHT SOURCES AND CARRIER PLATE
    9.
    发明申请
    LIGHTING MODULE WITH SEMICONDUCTOR LIGHT SOURCES AND CARRIER PLATE 有权
    具有半导体光源和载体板的照明模块

    公开(公告)号：US20160225747A1

    公开(公告)日：2016-08-04

    申请号：US15021952

    申请日：2014-08-22

    Applicant: OSRAM GMBH

    Inventor： Farhang Ghasemi Afshar ,  Axel Kaltenbacher

    IPC: H01L25/075 ,  H01L33/64 ,  H01L33/48

    CPC classification number: H01L25/0753 ,  H01L33/483 ,  H01L33/62 ,  H01L33/644 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/00014

    Abstract: Various embodiments may relate to a lighting module which is equipped with several semiconductor light sources, in particular LED-chips and includes a metallic carrier plate. Several metallic carrier substrates are arranged on the carrier plate and are electrically insulated therefrom. At least one semiconductor light source is arranged on the carrier substrates and the carrier substrates are electrically connected in series.

    Abstract translation: 各种实施例可以涉及配备有几个半导体光源，特别是LED芯片并且包括金属载体板的照明模块。 几个金属载体基板布置在载体板上并与其电绝缘。 至少一个半导体光源被布置在载体基板上，并且载体基板串联电连接。

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