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公开(公告)号：US20200313054A1
公开(公告)日：2020-10-01
申请号：US16649551
申请日：2018-09-21
Applicant: OSRAM OLED GmbH
Inventor： Reiner WINDISCH , Florian BÖSL , Andreas DOBNER , Matthias SPERL
Abstract: A device with a lead frame, a moulded body and a plurality of semiconductor chips configured to generate radiation is specified, wherein the lead frame has two connection parts for external electrical contacting of the device; the moulded body is formed to the lead frame; the moulded body is transmissive to the radiation generated during operation of the device; and the semiconductor chips are arranged on a front-side of the moulded body and each of the semiconductor chips overlap with the device with the moulded body in plan view of the device. Furthermore, a method for producing devices is specified.
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