公开(公告)号：US20200313054A1

公开(公告)日：2020-10-01

申请号：US16649551

申请日：2018-09-21

Applicant: OSRAM OLED GmbH

Inventor： Reiner WINDISCH ,  Florian BÖSL ,  Andreas DOBNER ,  Matthias SPERL

IPC: H01L33/62 ,  H01L33/54

Abstract: A device with a lead frame, a moulded body and a plurality of semiconductor chips configured to generate radiation is specified, wherein the lead frame has two connection parts for external electrical contacting of the device; the moulded body is formed to the lead frame; the moulded body is transmissive to the radiation generated during operation of the device; and the semiconductor chips are arranged on a front-side of the moulded body and each of the semiconductor chips overlap with the device with the moulded body in plan view of the device. Furthermore, a method for producing devices is specified.

公开(公告)号：US20210372597A1

公开(公告)日：2021-12-02

申请号：US16760628

申请日：2018-11-20

Applicant: OSRAM OLED GmbH

Inventor： Reiner WINDISCH ,  Florian BOESL ,  Andreas DOBNER ,  Matthias SPERL

IPC: F21V19/00 ,  F21K9/90 ,  F21S4/28

Abstract: A device includes a carrier and a plurality of semiconductor chips configured to generate radiation. The carrier includes a lead frame. The lead frame includes two connecting parts for external electrical contacting of the device. The semiconductor chips are arranged on the carrier. The carrier is surrounded by a casing at least in places along its entire circumference. The casing forms a side face of the device at least in places. The side face includes traces of material removal.