公开(公告)号：US20210372597A1

公开(公告)日：2021-12-02

申请号：US16760628

申请日：2018-11-20

Applicant: OSRAM OLED GmbH

Inventor： Reiner WINDISCH ,  Florian BOESL ,  Andreas DOBNER ,  Matthias SPERL

IPC: F21V19/00 ,  F21K9/90 ,  F21S4/28

Abstract: A device includes a carrier and a plurality of semiconductor chips configured to generate radiation. The carrier includes a lead frame. The lead frame includes two connecting parts for external electrical contacting of the device. The semiconductor chips are arranged on the carrier. The carrier is surrounded by a casing at least in places along its entire circumference. The casing forms a side face of the device at least in places. The side face includes traces of material removal.

公开(公告)号：US20210285607A1

公开(公告)日：2021-09-16

申请号：US17259064

申请日：2019-07-10

Applicant: OSRAM OLED GmbH

Inventor： Frank SINGER ,  Ralph BERTRAM ,  Andreas DOBNER ,  Andreas WALDSCHIK

IPC: F21S4/20 ,  F21V9/30 ,  H01L25/075 ,  H01L33/54 ,  B29C48/30 ,  B29C48/154 ,  B29C48/06

Abstract: A placement device for placing optoelectronic components on electrical lines includes a holding device for holding at least one electric line extending in a longitudinal direction, and an application device for arranging optoelectronic components on the at least one electrical line.

公开(公告)号：US20200303594A1

公开(公告)日：2020-09-24

申请号：US16754720

申请日：2018-10-08

Applicant: OSRAM OLED GmbH

Inventor： Jörg Erich SORG ,  Christoph KOLLER ,  Andreas DOBNER

IPC: H01L33/48 ,  H01S5/022 ,  H01L33/62 ,  H01L33/52

Abstract: In one embodiment, the optoelectronic semiconductor component (1) comprises a semiconductor chip (2) for generating radiation and an inorganic housing (3). The semiconductor chip (2) is accommodated in a hermetically sealed manner in the housing (3). The housing (3) has a preferably ceramic base plate (31), a cover plate (33) and at least one preferably ceramic housing ring (32) and a plurality of electrical through-connections (51). A recess (15), in which the semiconductor chip (2) is located, is formed by the housing ring (32). The base plate (31) has a plurality of electrical connection surfaces (35) on a component underside (11). A plurality of through-connections (51) each extend through the base plate (31), through the cover plate (33) and through the housing ring (32). The base plate (31), the at least one housing ring (32) and the cover plate (33) are firmly connected to one another via continuous, peripheral inorganic sealing frames (6). Finally, the housing (3) comprises a radiation exit region (34) for emitting radiation.

公开(公告)号：US20210041073A1

公开(公告)日：2021-02-11

申请号：US16979605

申请日：2019-03-05

Applicant: OSRAM OLED GmbH

Inventor： Jasmin MUSTER ,  Dennis SPRENGER ,  Joerg SORG ,  Sergey KUDAEV ,  Andreas DOBNER ,  Melanie ZUMKLEY

IPC: F21S41/176 ,  F21S41/16 ,  H01S5/00 ,  H01S5/024 ,  H01S5/022 ,  H01S5/323

Abstract: An irradiation unit is disclosed that includes a pump radiation source for emitting pump radiation in the form of a beam, a conversion element for at least partially converting the pump radiation into conversion radiation, and a support on which the conversion element is situated. The support accommodates a through-hole through which the beam including the pump radiation is incident on an incident surface of the conversion element, the though-hole being laterally delimited by an inner wall face of the support, at least one portion of the face tapering in the direction of the incident surface. During operation, the pump radiation conducted in the beam is at least intermittently at least in part, incident on the inner wall face of the support and is reflected thereby onto the incident surface.

公开(公告)号：US20200313054A1

公开(公告)日：2020-10-01

申请号：US16649551

申请日：2018-09-21

Applicant: OSRAM OLED GmbH

Inventor： Reiner WINDISCH ,  Florian BÖSL ,  Andreas DOBNER ,  Matthias SPERL

IPC: H01L33/62 ,  H01L33/54

Abstract: A device with a lead frame, a moulded body and a plurality of semiconductor chips configured to generate radiation is specified, wherein the lead frame has two connection parts for external electrical contacting of the device; the moulded body is formed to the lead frame; the moulded body is transmissive to the radiation generated during operation of the device; and the semiconductor chips are arranged on a front-side of the moulded body and each of the semiconductor chips overlap with the device with the moulded body in plan view of the device. Furthermore, a method for producing devices is specified.