公开(公告)号：US20210372597A1

公开(公告)日：2021-12-02

申请号：US16760628

申请日：2018-11-20

Applicant: OSRAM OLED GmbH

Inventor： Reiner WINDISCH ,  Florian BOESL ,  Andreas DOBNER ,  Matthias SPERL

IPC: F21V19/00 ,  F21K9/90 ,  F21S4/28

Abstract: A device includes a carrier and a plurality of semiconductor chips configured to generate radiation. The carrier includes a lead frame. The lead frame includes two connecting parts for external electrical contacting of the device. The semiconductor chips are arranged on the carrier. The carrier is surrounded by a casing at least in places along its entire circumference. The casing forms a side face of the device at least in places. The side face includes traces of material removal.

公开(公告)号：US20210301988A1

公开(公告)日：2021-09-30

申请号：US17265093

申请日：2019-07-30

Applicant: OSRAM OLED GmbH

Inventor： Florian BOESL

IPC: F21K9/64 ,  F21K9/69 ,  F21K9/90 ,  B60Q1/56

Abstract: A light emitting filament device comprising a carrier extending in a longitudinal direction and having a first main surface, a second main surface opposite to the first main surface, and two side surfaces interconnecting the two main surfaces. Optoelectronic components are disposed on the first main surface of the carrier. A first converter layer is arranged on the first main surface of the carrier and covers the optoelectronic components. A second converter layer is arranged on the second main surface of the carrier. The carrier is designed at at least one location along the longitudinal direction such that at least one of the two side surfaces includes an angle with the first main surface of greater than 90°. The carrier is trapezoidal in cross-section at the at least one location.

公开(公告)号：US20210351228A1

公开(公告)日：2021-11-11

申请号：US17277894

申请日：2018-12-07

Applicant: OSRAM OLED GmbH

Inventor： Meik WECKBECKER ,  Vincent GROLIER ,  Philipp KREUTER ,  Florian BOESL ,  Michael JOBST

IPC: H01L27/15 ,  H01L33/62 ,  H01L33/60 ,  H01L25/11 ,  H01L33/00

Abstract: A light-emitting device includes a multiplicity of light-emitting modules arranged on a first substrate. Each light-emitting module of the multiplicity of light-emitting modules includes a multiplicity of light-emitting components arranged on a second substrate. The second substrate is electrically connected to the first substrate, and includes a common primary lens for the multiplicity of light-emitting components.