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公开(公告)号：US12300674B2
公开(公告)日：2025-05-13
申请号：US17615446
申请日：2020-10-29
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Michael Brandl , Andreas Dobner , Matthias Goldbach , Sebastian Wittmann , Uli Hiller , Markus Klein , Thomas Schwarz , Andreas Waldschik , Michael Wittmann , Matthias Bruckschloegl , Stefan Groetsch , Rainer Huber , Peter Brick , Ludwig Hofbauer
IPC: H01L25/075 , B60K35/00 , H01L33/60 , H10H20/80 , H10H20/856
Abstract: An optoelectronic device, in particular an at least semi-transparent pane for example for a vehicle, comprises: a cover layer, a carrier layer, an intermediate layer between the cover layer and the carrier layer, wherein at least one and preferably a plurality of optoelectronic light sources, in particular μLEDS, is arranged on at least one surface of the intermediate layer and/or is at least partially embedded in the intermediate layer, wherein the intermediate layer is adapted such that light emitted by the optoelectronic light sources at least partially spreads in and along the intermediate layer and exits the intermediate layer within and/or at a pre-set distance to the respective optoelectronic light source in a direction through the cover layer and/or through the carrier layer.
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公开(公告)号：US12291096B2
公开(公告)日：2025-05-06
申请号：US17615396
申请日：2020-10-29
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Matthias Goldbach , Stefan Groetsch , Ludwig Hofbauer , Sebastian Wittmann , Robert Regensburger , Thomas Schwarz , Michael Brandl , Andreas Dobner , Sebastian Stigler
Abstract: An optoelectronic device comprises a plurality of layer segments, in particular intermediate layer segments, arranged between a cover layer and a carrier layer. At least one optoelectronic component is arranged on at least one of the plurality of layer segments and a first and a second layer segment of the plurality of the layer segments are overlapping each other along a first direction each forming a respective boundary region. The first layer segment comprises at least one first contact pad and the second layer segment comprises at least one second contact pad, wherein the at least one first and second contact pad are arranged in the respective boundary region facing each other and being mechanically and electrically connected. The at least one first and second contact pad each comprises a plurality of nanowires which are at least partially made of conductive material such as for example copper, gold, or nickel.
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公开(公告)号：US20180083063A1
公开(公告)日：2018-03-22
申请号：US15825003
申请日：2017-11-28
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Stefan Groetsch , Matthias Kiessling , Michael Wittmann , Stefan Gruber
CPC classification number: H01L27/15 , H05B33/0803 , H05B33/0815 , H05B33/083
Abstract: An optoelectronic semiconductor component includes a first functional region having an active zone provided for generating radiation or for receiving radiation, and a second functional region, which is suitable for contributing to the driving of the first functional region. The first functional region and the second functional region are integrated on the same carrier substrate.
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公开(公告)号：US09190394B2
公开(公告)日：2015-11-17
申请号：US14346687
申请日：2012-09-21
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Frank Singer , Michael Zitzlsperger , Stefan Groetsch
CPC classification number: H01L25/0753 , F21S41/141 , H01L24/73 , H01L33/62 , H01L33/64 , H01L33/642 , H01L2224/32245 , H01L2224/48247 , H01L2224/48471 , H01L2224/48479 , H01L2224/73265 , H01L2924/00014 , H01L2924/19107 , H01L2224/48227 , H01L2924/00 , H01L2924/00012 , H01L2224/4554
Abstract: An LED module has an electrically insulating main body, a base surface and a mounting surface located opposite the base surface. A number of electrical connection contacts are arranged at the mounting surface. The connection contacts do not adjoin the base surface. A heat sink is arranged in the main body. The heat sink extends from the mounting surface as far as the base surface. Furthermore, the LED module has a number of LED chips, each having an electrically insulating carrier substrate at a chip underside and two chip contacts at a chip top side. The LED chips are arranged with the electrically insulating carrier substrate on the heat sink.
Abstract translation: LED模块具有电绝缘主体，基面和与基面相对的安装面。 多个电连接触点设置在安装表面。 连接触点不与基面相邻。 散热器布置在主体中。 散热片从安装表面延伸到基面最远处。 此外，LED模块具有多个LED芯片，每个LED芯片在芯片下侧具有电绝缘载体基板，在芯片顶侧具有两个芯片触点。 LED芯片布置有散热器上的电绝缘载体衬底。
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公开(公告)号：US20250096206A1
公开(公告)日：2025-03-20
申请号：US18970720
申请日：2024-12-05
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Michael BRANDL , Andreas Dobner , Matthias Goldbach , Sebastian Wittmann , Uli Hiller , Markus Klein , Thomas Schwarz , Andreas Waldschik , Michael Wittmann , Matthias Bruckschloegl , Stefan Groetsch , Rainer Huber , Peter Brick , Ludwig Hofbauer
IPC: H01L25/075 , B60K35/00 , H01L33/60
Abstract: An optoelectronic device, in particular an at least partially transparent pane for example of a vehicle, comprises a first layer, in particular an intermediate layer arranged between a cover layer and a carrier layer, at least one electronic or optoelectronic component, which is at least partially or completely embedded in the first layer and at least one structured conductor layer. A first portion of the conductor layer is arranged on an upper surface of the first layer and a second portion of the conductor layer is arranged on a top surface of the electronic or optoelectronic component and is in contact with an electric contact of the electronic or optoelectronic component. The electric contact, in particular a contact pad, is arranged on the top surface.
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Patent Agency Ranking
公开(公告)号：US12095015B2
公开(公告)日：2024-09-17
申请号：US17414861
申请日：2019-12-17
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Thomas Schwarz , Andreas Dobner , Frank Singer , Stefan Groetsch
IPC: H01L33/60 , H01L25/075 , H01L33/00 , H01L33/50
CPC classification number: H01L33/60 , H01L25/0753 , H01L33/005 , H01L33/50 , H01L2933/0058 , H01L2933/0091
Abstract: An optoelectronic light emitting device includes a pixel with a transparent or translucent carrier substrate, on which a semiconductor light emitting arrangement with at least one micro LED is arranged. The micro LED extends over a partial area of the pixel. The main radiation direction of the semiconductor light emitting arrangement is directed onto a backscattering surface element arranged behind the transparent carrier substrate in viewing direction. The semiconductor light emitting arrangement includes a beam shaping element.
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公开(公告)号：US12040317B2
公开(公告)日：2024-07-16
申请号：US17541761
申请日：2021-12-03
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Michael Brandl , Andreas Dobner , Matthias Goldbach , Sebastian Wittmann , Uli Hiller , Markus Klein , Thomas Schwarz , Andreas Waldschik , Michael Wittmann , Matthias Bruckschloegl , Stefan Groetsch , Rainer Huber , Peter Brick , Ludwig Hofbauer
IPC: H04W72/20 , H01L25/075 , H01L33/46 , H01L33/62 , H01L33/64 , H04W72/51 , B60J3/00 , B60K35/00 , B60K35/60 , B62J50/22
CPC classification number: H01L25/0756 , H01L33/46 , H01L33/62 , H01L33/641 , H04W72/20 , H04W72/51 , B60J3/00 , B60K35/00 , B60K35/60 , B60K2370/785 , B62J50/22
Abstract: An optoelectronic device comprises a plurality of optoelectronic light sources being arranged on a first layer, in particular an intermediate layer being arranged between a cover layer and a carrier layer. The first layer comprises or consists of an at least partially transparent material and each optoelectronic light source of the plurality of optoelectronic light sources comprises an individual light converter for converting light emitted by the associated light source into converted light. The light converter of each optoelectronic light source is arranged on the first layer and/or the associated optoelectronic light source.
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公开(公告)号：US20160380172A1
公开(公告)日：2016-12-29
申请号：US15039861
申请日：2014-11-25
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： Michael Brandl , Stefan Groetsch , Tobias Gebuhr , Michael Zitzlsperger , Thomas Schwarz
IPC: H01L33/62 , F21S8/10 , H01L25/075
CPC classification number: H01L33/62 , F21S41/141 , F21S43/14 , H01L25/0753 , H01L33/486 , H01L2224/48091 , H01L2224/48227 , H01L2924/0002 , H01L2924/15311 , H01L2933/0033 , H01L2924/00014
Abstract: Various embodiments may relate to a component arrangement with at least two electrical components arranged next to one another in a product configuration. Each of the electrical components have at least two electrical terminal contacts and the components arranged next to one another are mechanically connected to one another by an adhesive arranged between the components, and the component arrangement is designed for the individual components of the component arrangement to be applied together to a circuit carrier.
Abstract translation: 各种实施例可以涉及具有在产品配置中彼此相邻布置的至少两个电气部件的部件布置。 每个电气部件具有至少两个电气端子触点，并且彼此相邻布置的部件通过布置在部件之间的粘合剂彼此机械连接，并且部件布置被设计用于部件布置的各个部件为 一起应用于电路载体。
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公开(公告)号：US12298528B2
公开(公告)日：2025-05-13
申请号：US17615722
申请日：2020-10-29
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Andreas Dobner , Uli Hiller , Peter Brick , Hubert Halbritter , Thomas Schwarz , Michael Wittmann , Stefan Groetsch , Simon Schwalenberg , Sebastian Wittmann
Abstract: An optoelectronic device, in particular a display device, comprises: at least one optoelectronic light source, an at least partially transparent front layer, an at least partially transparent support layer, wherein the light source is arranged between the front layer and the support layer, wherein a front side of the light source faces the front layer and a rear side of the light source faces the support layer, and wherein a limiting device is provided in a circumferential direction around the light source, wherein the limiting device limits a spatial region, in which the light source emits light such that total internal reflection of the emitted light, in particular at an interface between the front layer and the outside, is avoided or at least reduced.
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公开(公告)号：US09997559B2
公开(公告)日：2018-06-12
申请号：US15825003
申请日：2017-11-28
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Stefan Groetsch , Matthias Kiessling , Michael Wittmann , Stefan Gruber
CPC classification number: H01L27/15 , H05B33/0803 , H05B33/0815 , H05B33/083
Abstract: An optoelectronic semiconductor component includes a first functional region having an active zone provided for generating radiation or for receiving radiation, and a second functional region, which is suitable for contributing to the driving of the first functional region. The first functional region and the second functional region are integrated on the same carrier substrate.
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