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1.发明申请公开(公告)号：US20190313535A1
公开(公告)日：2019-10-10
申请号：US16450459
申请日：2019-06-24
Applicant: PI-CRYSTAL INCORPORATION
Inventor： Junichi TAKEYA , Seiichiro YAMAGUCHI , Masataka ITOH
Abstract: Research on practical realization of various types of printable devices has progressed, and the realization of devices in which these printable devices are integrated on a flexible board is expected. However, there is the problem that, if a plurality of printable devices are simply integrated on the same board, the area of the integrated device increases, and the yield ratio greatly decreases. An integration technique that solves the problem of an increase in the area and a decrease in the yield ratio is in demand. Electronic devices to be integrated are formed on individual boards, the boards are laid to overlap each other in a predetermined relationship, and then through-vias are formed at predetermined positions. With this, the electronic devices are electrically connected to each other, and function as an integrated device.
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2.发明申请公开(公告)号：US20180107083A1
公开(公告)日：2018-04-19
申请号：US15567326
申请日：2016-04-20
Applicant: PI-CRYSTAL INCORPORATION
Inventor： Seiichiro YAMAGUCHI , Junichi TAKEYA , Masataka ITOH , Norikazu SHOMOTO , Mina UEMATSU
IPC: G02F1/1362 , G02F1/1368 , H01L27/12 , H01L27/32
CPC classification number: G02F1/136286 , G02F1/1333 , G02F1/133345 , G02F1/134309 , G02F1/1368 , G02F2001/13613 , G09F9/30 , H01L27/1259 , H01L27/3274 , H01L29/786 , H01L51/05
Abstract: Active matrix array devices are constituted by devices that have a function such as those of a display/light emitting device, a sensor, a memory or an actuator, and are arranged in a matrix array shape, and the expansion of usage in various fields and applications is expected. However, there is little similarity and compatibility in the forming process and materials between a device such as a display/light emitting device, a sensor, a memory, or an actuator, and a circuit portion that controls such a device in the matrix element, and therefore the device and the circuit portion are mutually restricting factors. This results in an increase in the manufacturing cost and limitation of the function.A conventional active matrix array device is manufactured by performing various process steps on the same substrate. Control circuit portions each including a transistor are formed in some of the process steps. In contrast, the problem described above is solved by forming the control circuit portions of an active matrix array device on a substrate different from that of other portions, and the control circuit portions are respectively mounted on matrix elements in a middle step of the manufacturing process of the matrix array body or after a final step thereof.
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3.发明申请公开(公告)号：US20170374746A1
公开(公告)日：2017-12-28
申请号：US15676472
申请日：2017-08-14
Applicant: PI-CRYSTAL INCORPORATION
Inventor： Junichi TAKEYA , Seiichiro YAMAGUCHI , Masataka ITOH
CPC classification number: H05K3/361 , H05K1/115 , H05K1/116 , H05K1/118 , H05K1/144 , H05K3/363 , H05K3/403 , H05K3/4038 , H05K3/4623 , H05K2201/041 , H05K2201/09181 , H05K2201/09845 , H05K2201/10121 , H05K2201/10151
Abstract: Research on practical realization of various types of printable devices has progressed, and the realization of devices in which these printable devices are integrated on a flexible board is expected. However, there is the problem that, if a plurality of printable devices are simply integrated on the same board, the area of the integrated device increases, and the yield ratio greatly decreases. An integration technique that solves the problem of an increase in the area and a decrease in the yield ratio is in demand. Electronic devices to be integrated are formed on individual boards, the boards are laid to overlap each other in a predetermined relationship, and then through-vias are formed at predetermined positions. With this, the electronic devices are electrically connected to each other, and function as an integrated device.
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