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    Rotational fill techniques for injection molding of solder
    1.
    发明授权
    Rotational fill techniques for injection molding of solder 失效
    用于注射成型焊料的旋转填充技术

    公开(公告)号：US07784673B2

    公开(公告)日：2010-08-31

    申请号：US12189388

    申请日：2008-08-11

    Applicant: Steven A. Cordes ,  Peter A. Gruber ,  John U. Knickerbocker ,  James L. Speidell

    Inventor： Steven A. Cordes ,  Peter A. Gruber ,  John U. Knickerbocker ,  James L. Speidell

    IPC: B23K31/02 ,  B23K37/00

    CPC classification number: B23K3/0638 ,  B23K35/02 ,  B23K2101/40 ,  H01L2224/11

    Abstract: A system and method for injection molding conductive bonding material into a plurality of cavities in a non-rectangular mold is disclosed. The method comprises aligning a fill head with a non-rectangular mold. The non-rectangular mold includes a plurality of cavities. The fill head is placed in substantial contact with the non-rectangular mold. Rotational motion is provided to at least one of the non-rectangular mold and the fill head while the fill head is in substantial contact with the non-rectangular mold. Conductive bonding material is forced out of the fill head toward the non-rectangular mold. The conductive bonding material is provided into at least one cavity of the plurality of cavities contemporaneous with the at least one cavity being in proximity to the fill head.

    Abstract translation: 公开了一种用于将导电接合材料注射成非矩形模具中的多个空腔的系统和方法。 该方法包括将填充头与非矩形模具对准。 非矩形模具包括多个空腔。 填充头被放置成与非矩形模具基本接触。 旋转运动提供给非矩形模具和填充头中的至少一个，同时填充头基本上与非矩形模具接触。 将导电接合材料从填充头推向非矩形模具。 导电接合材料被提供到与填充头附近的至少一个空腔同时的多个空腔的至少一个空腔中。

    Precision fabricated silicon mold
    2.
    发明申请
    Precision fabricated silicon mold 审中-公开
    精密加工硅模具

    公开(公告)号：US20080029686A1

    公开(公告)日：2008-02-07

    申请号：US11499365

    申请日：2006-08-04

    Applicant: Peter A. Gruber ,  John U. Knickerbocker

    Inventor： Peter A. Gruber ,  John U. Knickerbocker

    IPC: B29C33/56

    CPC classification number: B29C33/405 ,  B29C33/56 ,  B29C33/60 ,  B29K2083/00

    Abstract: The invention provides a reusable precision fabricated silicon mold comprising a mold made of silicon which comprises a desired pattern of physical features cavities etched into the mold to transfer a patter on bumps to a semiconductor wafer, e.g., computer chip, semiconductor device, silicon on insulator device, etc.; an aperture etched into the mold adapted to allow gases to escape but does not to allow a solder to escape during the process of transferring solder bumps to a chip; a protective oxide or nitride on the mold; alignment marks adapted to properly align the mold with a semiconductor wafer; an organic release material on the mold adapted to release the mold from the semiconductor wafer, wherein the mold precisely defines a conductive adhesive material volume for interconnects on the semiconductor wafer.

    Abstract translation: 本发明提供了一种可重复使用的精密制造硅模，其包括由硅制成的模具，其包括蚀刻到模具中的物理特征空腔的图案，以将凸块上的图案转移到半导体晶片，例如计算机芯片，半导体器件，绝缘体上硅 设备等; 蚀刻到模具中的孔径适于允许气体逸出，但是在将焊料凸块转移到芯片的过程中不允许焊料逸出; 模具上的保护性氧化物或氮化物; 对准标记适于使模具与半导体晶片正确对准; 模具上的有机剥离材料适于从半导体晶片释放模具，其中模具精确地限定用于半导体晶片上的互连的导电粘合剂材料体积。

    ROTATIONAL FILL TECHNIQUES FOR INJECTION MOLDING OF SOLDER
    3.
    发明申请
    ROTATIONAL FILL TECHNIQUES FOR INJECTION MOLDING OF SOLDER 失效
    焊接注射成型的旋转填充技术

    公开(公告)号：US20090008057A1

    公开(公告)日：2009-01-08

    申请号：US12189388

    申请日：2008-08-11

    Applicant: Steven A. CORDES ,  Peter A. GRUBER ,  John U. Knickerbocker ,  James L. SPEIDELL

    Inventor： Steven A. CORDES ,  Peter A. GRUBER ,  John U. Knickerbocker ,  James L. SPEIDELL

    IPC: B22D17/00 ,  B22D2/00

    CPC classification number: B23K3/0638 ,  B23K35/02 ,  B23K2101/40 ,  H01L2224/11

    Abstract: A system and method for injection molding conductive bonding material into a plurality of cavities in a non-rectangular mold is disclosed. The method comprises aligning a fill head with a non-rectangular mold. The non-rectangular mold includes a plurality of cavities. The fill head is placed in substantial contact with the non-rectangular mold. Rotational motion is provided to at least one of the non-rectangular mold and the fill head while the fill head is in substantial contact with the non-rectangular mold. Conductive bonding material is forced out of the fill head toward the non-rectangular mold. The conductive bonding material is provided into at least one cavity of the plurality of cavities contemporaneous with the at least one cavity being in proximity to the fill head.

    Abstract translation: 公开了一种用于将导电接合材料注射成非矩形模具中的多个空腔的系统和方法。 该方法包括将填充头与非矩形模具对准。 非矩形模具包括多个空腔。 填充头被放置成与非矩形模具基本接触。 旋转运动提供给非矩形模具和填充头中的至少一个，同时填充头基本上与非矩形模具接触。 将导电接合材料从填充头推向非矩形模具。 导电接合材料被提供到与填充头附近的至少一个空腔同时的多个空腔的至少一个空腔中。

    CONDUCTIVE BONDING MATERIAL FILL TECHNIQUES
    5.
    发明申请
    CONDUCTIVE BONDING MATERIAL FILL TECHNIQUES 有权
    导电粘接材料填充技术

    公开(公告)号：US20080272177A1

    公开(公告)日：2008-11-06

    申请号：US12173346

    申请日：2008-07-15

    Applicant: Steven A. Cordes ,  Peter A. Gruber ,  John U. Knickerbocker ,  James L. Speidell

    Inventor： Steven A. Cordes ,  Peter A. Gruber ,  John U. Knickerbocker ,  James L. Speidell

    IPC: B23K37/06

    CPC classification number: H05K3/3484 ,  B23K3/0607 ,  B23K2101/42 ,  H05K3/4038 ,  H05K2201/0305 ,  H05K2201/09472 ,  H05K2203/0126 ,  H05K2203/043 ,  H05K2203/0568

    Abstract: A system provides solder into cavities in a circuit supporting substrate. The system places a fill head in substantial contact with a circuit supporting substrate. The circuit supporting substrate includes at least one cavity. A linear motion or a rotational motion is provided to at least one of the circuit supporting substrate and the fill head while the fill head is in substantial contact with the circuit supporting substrate. Solder is forced out of the fill head toward the circuit supporting substrate. The solder is provided into the at least one cavity contemporaneous with the at least one cavity being in proximity to the fill head. The system brings a second circuit supporting substrate in close proximity to the circuit supporting substrate, at least one receiving pad on the second circuit supporting substrate substantially contacts the conductive bonding material of the at least one cavity.

    Abstract translation: 系统将焊料提供到电路支撑衬底中的空腔中。 该系统使填充头与电路支撑衬底基本接触。 电路支撑衬底包括至少一个空腔。 当填充头与电路支撑衬底基本接触时，向电路支撑衬底和填充头中的至少一个提供直线运动或旋转运动。 焊料被迫从填充头朝向电路支撑基板。 焊料被提供到与填充头附近的至少一个空腔同时的至少一个空腔中。 系统使第二电路支撑衬底紧靠电路支撑衬底，第二电路支撑衬底上的至少一个接收衬垫基本上接触至少一个空腔的导电接合材料。

    Conductive bonding material fill techniques
    6.
    发明授权
    Conductive bonding material fill techniques 有权
    导电接合材料填充技术

    公开(公告)号：US07410090B2

    公开(公告)日：2008-08-12

    申请号：US11409244

    申请日：2006-04-21

    Applicant: Steven A. Cordes ,  Peter A. Gruber ,  John U. Knickerbocker ,  James L. Speidell

    Inventor： Steven A. Cordes ,  Peter A. Gruber ,  John U. Knickerbocker ,  James L. Speidell

    IPC: B23K31/02

    CPC classification number: H05K3/3484 ,  B23K3/0607 ,  B23K2101/42 ,  H05K3/4038 ,  H05K2201/0305 ,  H05K2201/09472 ,  H05K2203/0126 ,  H05K2203/043 ,  H05K2203/0568

    Abstract: A system, method, and apparatus of providing conductive bonding material into a plurality of cavities in a circuit supporting substrate is disclosed. The method comprises placing a fill head in substantial contact with a circuit supporting substrate. The circuit supporting substrate includes at least one cavity. A linear motion or a rotational motion is provided to at least one of the circuit supporting substrate and the fill head while the fill head is in substantial contact with the circuit supporting substrate. Conductive bonding material is forced out of the fill head toward the circuit supporting substrate. The conductive bonding material is provided into the at least one cavity contemporaneous with the at least one cavity being in proximity to the fill head.

    Abstract translation: 公开了一种在电路支撑衬底中的多个空腔中提供导电接合材料的系统，方法和装置。 该方法包括将填充头放置成与电路支撑衬底基本接触。 电路支撑衬底包括至少一个空腔。 当填充头与电路支撑衬底基本接触时，向电路支撑衬底和填充头中的至少一个提供直线运动或旋转运动。 导电接合材料被迫从填充头朝向电路支撑基板排出。 所述导电接合材料被提供到与所述至少一个空腔同时的至少一个空腔中，所述至少一个空腔在所述填充头附近。

    FLEXIBLE NOZZLE FOR INJECTION MOLDED SOLDER
    7.
    发明申请
    FLEXIBLE NOZZLE FOR INJECTION MOLDED SOLDER 审中-公开
    用于注射成型焊枪的柔性喷嘴

    公开(公告)号：US20080179035A1

    公开(公告)日：2008-07-31

    申请号：US11626986

    申请日：2007-01-25

    Applicant: Peter A. Gruber ,  John U. Knickerbocker

    Inventor： Peter A. Gruber ,  John U. Knickerbocker

    IPC: B22D17/00 ,  B22D41/00

    CPC classification number: B22D17/2023 ,  B22D17/30 ,  B22D18/04 ,  B23K3/0623 ,  B23K3/0638 ,  H05K3/3457 ,  H05K2203/0113 ,  H05K2203/0126 ,  H05K2203/0338

    Abstract: A flexible nozzle for injection molded solder and a method of utilizing a flexible nozzle for injection molded solder applications. In order to be able to efficiently carry out the injection molded soldering process, there is utilized a compliant or flexible solder-dispensing nozzle structure, which is particularly advantageously adapted to be utilized with circular or round molds. In this connection, the tip of the nozzle, which provides for the discharge of the solder, provides a series of small holes or apertures for extruding the solder under pressure from at least one solder reservoir. In one embodiment, there may be employed a single solder reservoir with which there communicates a plurality of discharge apertures or holes for extruding the solder so as to fill suitable cavities or recesses formed in a facing surface of a mold for injection molded solder. Alternatively, rather than dispensing or extruding the solder from a single reservoir through a plurality of holes or discharge apertures, each respective aperture or a group of apertures may be connected to, respectively, a separate solder reservoir of a plurality of reservoirs subjected to pressure to facilitate the solder extrusion onto the mold surface.

    Abstract translation: 一种用于注塑焊料的柔性喷嘴和一种利用柔性喷嘴进行注射成型焊料应用的方法。 为了能够有效地执行注射成型的焊接工艺，采用柔性或柔性的焊料分配喷嘴结构，其特别有利地适于与圆形或圆形模具一起使用。 在这方面，提供用于排出焊料的喷嘴的尖端提供一系列小孔或孔，用于在至少一个焊料储存器的压力下挤出焊料。 在一个实施例中，可以使用单个焊料储存器，其中连通多个排出孔或孔，用于挤出焊料，以填充形成在用于注射成型焊料的模具的相对表面中的合适的空腔或凹部。 或者，而不是通过多个孔或排放孔从单个储存器分配或挤出焊料，每个相应的孔或一组孔可以分别连接到经受压力的多个储存器的单独的焊料储存器 有助于将焊料挤出到模具表面上。

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