公开(公告)号：US07784673B2

公开(公告)日：2010-08-31

申请号：US12189388

申请日：2008-08-11

Applicant: Steven A. Cordes ,  Peter A. Gruber ,  John U. Knickerbocker ,  James L. Speidell

Inventor： Steven A. Cordes ,  Peter A. Gruber ,  John U. Knickerbocker ,  James L. Speidell

IPC: B23K31/02 ,  B23K37/00

CPC classification number: B23K3/0638 ,  B23K35/02 ,  B23K2101/40 ,  H01L2224/11

Abstract: A system and method for injection molding conductive bonding material into a plurality of cavities in a non-rectangular mold is disclosed. The method comprises aligning a fill head with a non-rectangular mold. The non-rectangular mold includes a plurality of cavities. The fill head is placed in substantial contact with the non-rectangular mold. Rotational motion is provided to at least one of the non-rectangular mold and the fill head while the fill head is in substantial contact with the non-rectangular mold. Conductive bonding material is forced out of the fill head toward the non-rectangular mold. The conductive bonding material is provided into at least one cavity of the plurality of cavities contemporaneous with the at least one cavity being in proximity to the fill head.

Abstract translation: 公开了一种用于将导电接合材料注射成非矩形模具中的多个空腔的系统和方法。 该方法包括将填充头与非矩形模具对准。 非矩形模具包括多个空腔。 填充头被放置成与非矩形模具基本接触。 旋转运动提供给非矩形模具和填充头中的至少一个，同时填充头基本上与非矩形模具接触。 将导电接合材料从填充头推向非矩形模具。 导电接合材料被提供到与填充头附近的至少一个空腔同时的多个空腔的至少一个空腔中。

公开(公告)号：US20080029686A1

公开(公告)日：2008-02-07

申请号：US11499365

申请日：2006-08-04

Applicant: Peter A. Gruber ,  John U. Knickerbocker

Inventor： Peter A. Gruber ,  John U. Knickerbocker

IPC: B29C33/56

CPC classification number: B29C33/405 ,  B29C33/56 ,  B29C33/60 ,  B29K2083/00

Abstract: The invention provides a reusable precision fabricated silicon mold comprising a mold made of silicon which comprises a desired pattern of physical features cavities etched into the mold to transfer a patter on bumps to a semiconductor wafer, e.g., computer chip, semiconductor device, silicon on insulator device, etc.; an aperture etched into the mold adapted to allow gases to escape but does not to allow a solder to escape during the process of transferring solder bumps to a chip; a protective oxide or nitride on the mold; alignment marks adapted to properly align the mold with a semiconductor wafer; an organic release material on the mold adapted to release the mold from the semiconductor wafer, wherein the mold precisely defines a conductive adhesive material volume for interconnects on the semiconductor wafer.

Abstract translation: 本发明提供了一种可重复使用的精密制造硅模，其包括由硅制成的模具，其包括蚀刻到模具中的物理特征空腔的图案，以将凸块上的图案转移到半导体晶片，例如计算机芯片，半导体器件，绝缘体上硅 设备等; 蚀刻到模具中的孔径适于允许气体逸出，但是在将焊料凸块转移到芯片的过程中不允许焊料逸出; 模具上的保护性氧化物或氮化物; 对准标记适于使模具与半导体晶片正确对准; 模具上的有机剥离材料适于从半导体晶片释放模具，其中模具精确地限定用于半导体晶片上的互连的导电粘合剂材料体积。

公开(公告)号：US07410092B2

公开(公告)日：2008-08-12

申请号：US11409233

申请日：2006-04-21

Applicant: Steven A. Cordes ,  Peter A. Gruber ,  John U. Knickerbocker ,  James L. Speidell

Inventor： Steven A. Cordes ,  Peter A. Gruber ,  John U. Knickerbocker ,  James L. Speidell

IPC: B23K31/02

CPC classification number: B23K3/0638 ,  B23K1/20 ,  B23K2101/40 ,  H01L24/11 ,  H01L24/742 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00

Abstract: A system, method, and apparatus for injection molding conductive bonding material into a plurality of cavities in a surface are disclosed. The method comprises aligning a fill head with a surface. The mold includes a plurality of cavities. The method further includes placing the fill head in substantial contact with the surface. At least a first gas is channeled about a first region of the fill head. The at least first gas has a temperature above a melting point of conductive bonding material residing in a reservoir thereby maintaining the conductive bonding material in a molten state. The conductive bonding material is forced out of the fill head toward the surface. The conductive bonding material is provided into at least one cavity of the plurality of cavities contemporaneous with the at least one cavity being in proximity to the fill head.

Abstract translation: 公开了一种用于将导电接合材料注射成表面中的多个空腔的系统，方法和装置。 该方法包括将填充头与表面对准。 模具包括多个空腔。 该方法还包括将填充头与表面实质接触。 至少第一气体围绕填充头的第一区域引导。 所述至少第一气体具有高于位于储存器中的导电接合材料的熔点的温度，从而将导电接合材料保持在熔融状态。 导电接合材料从表面压出填料头。 导电接合材料被提供到与填充头附近的至少一个空腔同时的多个空腔的至少一个空腔中。

公开(公告)号：US07348270B1

公开(公告)日：2008-03-25

申请号：US11625449

申请日：2007-01-22

Applicant: David H. Danovitch ,  Mukta G. Farooq ,  Peter A. Gruber ,  John U. Knickerbocker ,  George R. Proto ,  Da-Yuan Shih

Inventor： David H. Danovitch ,  Mukta G. Farooq ,  Peter A. Gruber ,  John U. Knickerbocker ,  George R. Proto ,  Da-Yuan Shih

IPC: H01L21/44

CPC classification number: H01L24/11 ,  H01L21/6835 ,  H01L24/13 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/94 ,  H01L25/0657 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/111 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/27334 ,  H01L2224/73104 ,  H01L2224/83 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2224/11 ,  H01L2224/03 ,  H01L2224/27 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A method for forming interconnects onto attachment points of a wafer includes the steps of providing a mold with a plurality of cavities having a predetermined shape, depositing a release agent on surfaces of the cavities, filling the cavities with an interconnect material to form the interconnects, removing the release agent from the mold, and attaching the interconnects to the attachment points of the wafer. An adhesive layer can optionally be deposited in addition to the release layer. The adhesive layer can be used, for example, to bond the chip to a package.

Abstract translation: 用于在晶片的附接点上形成互连的方法包括以下步骤：提供具有预定形状的多个空腔的模具，在空腔的表面上沉积脱模剂，用互连材料填充空腔以形成互连， 从模具中除去脱模剂，以及将互连件附接到晶片的附接点。 除了剥离层之外，还可任选地沉积粘合剂层。 粘合剂层可以用于例如将芯片粘合到包装上。

公开(公告)号：US08551816B2

公开(公告)日：2013-10-08

申请号：US13439198

申请日：2012-04-04

Applicant: Steven A. Cordes ,  Matthew J. Farinelli ,  Sherif A. Goma ,  Peter A. Gruber ,  John U. Knickerbocker ,  James L. Speidell

Inventor： Steven A. Cordes ,  Matthew J. Farinelli ,  Sherif A. Goma ,  Peter A. Gruber ,  John U. Knickerbocker ,  James L. Speidell

IPC: H01L21/44 ,  H01L23/48

CPC classification number: H01L21/6835 ,  H01L24/11 ,  H01L24/81 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/06183 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/16137 ,  H01L2224/16238 ,  H01L2224/17183 ,  H01L2224/81005 ,  H01L2224/811 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/81986 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01054 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/83851 ,  H01L2224/81

Abstract: The present invention allows for direct chip-to-chip connections using the shortest possible signal path.

Abstract translation: 本发明允许使用尽可能短的信号路径进行直接芯片到芯片的连接。

公开(公告)号：US07819376B2

公开(公告)日：2010-10-26

申请号：US11930269

申请日：2007-10-31

Applicant: David H. Danovitch ,  Mukta G. Farooq ,  Peter A. Gruber ,  John U. Knickerbocker ,  George R. Proto ,  Da-Yuan Shih

Inventor： David H. Danovitch ,  Mukta G. Farooq ,  Peter A. Gruber ,  John U. Knickerbocker ,  George R. Proto ,  Da-Yuan Shih

IPC: H01L21/44

CPC classification number: H01L24/11 ,  H01L21/6835 ,  H01L24/13 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/94 ,  H01L25/0657 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/111 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/27334 ,  H01L2224/73104 ,  H01L2224/83 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2224/11 ,  H01L2224/03 ,  H01L2224/27 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A method for forming interconnects onto attachment points of a wafer includes the steps of providing a mold with a plurality of cavities having a predetermined shape, depositing a release agent on surfaces of the cavities, filling the cavities with an interconnect material to form the interconnects, removing the release agent from the mold, and attaching the interconnects to the attachment points of the wafer. An adhesive layer can optionally be deposited in addition to the release layer. The adhesive layer can be used, for example, to bond the chip to a package.

Abstract translation: 用于在晶片的附接点上形成互连的方法包括以下步骤：提供具有预定形状的多个空腔的模具，在空腔的表面上沉积脱模剂，用互连材料填充空腔以形成互连， 从模具中除去脱模剂，以及将互连件附接到晶片的附接点。 除了剥离层之外，还可任选地沉积粘合剂层。 粘合剂层可以用于例如将芯片粘合到包装上。

公开(公告)号：US07416104B2

公开(公告)日：2008-08-26

申请号：US11409232

申请日：2006-04-21

Applicant: Steven A. Cordes ,  Peter A. Gruber ,  John U. Knickerbocker ,  James L. Speidell

Inventor： Steven A. Cordes ,  Peter A. Gruber ,  John U. Knickerbocker ,  James L. Speidell

IPC: B23K31/02

CPC classification number: B23K3/0638 ,  B23K35/02 ,  B23K2101/40 ,  H01L2224/11

Abstract: A system and method for injection molding conductive bonding material into a plurality of cavities in a non-rectangular mold is disclosed. The method comprises aligning a fill head with a non-rectangular mold. The non-rectangular mold includes a plurality of cavities. The fill head is placed in substantial contact with the non-rectangular mold. Rotational motion is provided to at least one of the non-rectangular mold and the fill head while the fill head is in substantial contact with the non-rectangular mold. Conductive bonding material is forced out of the fill head toward the non-rectangular mold. The conductive bonding material is provided into at least one cavity of the plurality of cavities contemporaneous with the at least one cavity being in proximity to the fill head.

Abstract translation: 公开了一种用于将导电接合材料注射成非矩形模具中的多个空腔的系统和方法。 该方法包括将填充头与非矩形模具对准。 非矩形模具包括多个空腔。 填充头被放置成与非矩形模具基本接触。 旋转运动提供给非矩形模具和填充头中的至少一个，同时填充头基本上与非矩形模具接触。 将导电接合材料从填充头推向非矩形模具。 导电接合材料被提供到与填充头附近的至少一个空腔同时的多个空腔的至少一个空腔中。

公开(公告)号：US20080175939A1

公开(公告)日：2008-07-24

申请号：US11930269

申请日：2007-10-31

Applicant: David H. Danovitch ,  Mukta G. Farooq ,  Peter A. Gruber ,  John U. Knickerbocker ,  George R. Proto ,  Da-Yuan Shih

Inventor： David H. Danovitch ,  Mukta G. Farooq ,  Peter A. Gruber ,  John U. Knickerbocker ,  George R. Proto ,  Da-Yuan Shih

IPC: B29C35/08

CPC classification number: H01L24/11 ,  H01L21/6835 ,  H01L24/13 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/94 ,  H01L25/0657 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/111 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/27334 ,  H01L2224/73104 ,  H01L2224/83 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2224/11 ,  H01L2224/03 ,  H01L2224/27 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A method for forming interconnects onto attachment points of a wafer includes the steps of providing a mold with a plurality of cavities having a predetermined shape, depositing a release agent on surfaces of the cavities, filling the cavities with an interconnect material to form the interconnects, removing the release agent from the mold, and attaching the interconnects to the attachment points of the wafer. An adhesive layer can optionally be deposited in addition to the release layer. The adhesive layer can be used, for example, to bond the chip to a package.

Abstract translation: 用于在晶片的附接点上形成互连的方法包括以下步骤：提供具有预定形状的多个空腔的模具，在空腔的表面上沉积脱模剂，用互连材料填充空腔以形成互连， 从模具中除去脱模剂，以及将互连件附接到晶片的附接点。 除了剥离层之外，还可任选地沉积粘合剂层。 粘合剂层可以用于例如将芯片粘合到包装上。

公开(公告)号：US20080315409A1

公开(公告)日：2008-12-25

申请号：US11765055

申请日：2007-06-19

Applicant: Steven A. Cordes ,  Matthew J. Farinelli ,  Sherif A. Goma ,  Peter A. Gruber ,  John U. Knickerbocker ,  James L. Speidell

Inventor： Steven A. Cordes ,  Matthew J. Farinelli ,  Sherif A. Goma ,  Peter A. Gruber ,  John U. Knickerbocker ,  James L. Speidell

IPC: H01L23/48

CPC classification number: H01L21/6835 ,  H01L24/11 ,  H01L24/81 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/06183 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/16137 ,  H01L2224/16238 ,  H01L2224/17183 ,  H01L2224/81005 ,  H01L2224/811 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/81986 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01054 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/83851 ,  H01L2224/81

Abstract: The present invention allows for direct chip-to-chip connections using the shortest possible signal path.

Abstract translation: 本发明允许使用尽可能短的信号路径进行直接芯片到芯片的连接。

公开(公告)号：US20080272177A1

公开(公告)日：2008-11-06

申请号：US12173346

申请日：2008-07-15

Applicant: Steven A. Cordes ,  Peter A. Gruber ,  John U. Knickerbocker ,  James L. Speidell

Inventor： Steven A. Cordes ,  Peter A. Gruber ,  John U. Knickerbocker ,  James L. Speidell

IPC: B23K37/06

CPC classification number: H05K3/3484 ,  B23K3/0607 ,  B23K2101/42 ,  H05K3/4038 ,  H05K2201/0305 ,  H05K2201/09472 ,  H05K2203/0126 ,  H05K2203/043 ,  H05K2203/0568

Abstract: A system provides solder into cavities in a circuit supporting substrate. The system places a fill head in substantial contact with a circuit supporting substrate. The circuit supporting substrate includes at least one cavity. A linear motion or a rotational motion is provided to at least one of the circuit supporting substrate and the fill head while the fill head is in substantial contact with the circuit supporting substrate. Solder is forced out of the fill head toward the circuit supporting substrate. The solder is provided into the at least one cavity contemporaneous with the at least one cavity being in proximity to the fill head. The system brings a second circuit supporting substrate in close proximity to the circuit supporting substrate, at least one receiving pad on the second circuit supporting substrate substantially contacts the conductive bonding material of the at least one cavity.

Abstract translation: 系统将焊料提供到电路支撑衬底中的空腔中。 该系统使填充头与电路支撑衬底基本接触。 电路支撑衬底包括至少一个空腔。 当填充头与电路支撑衬底基本接触时，向电路支撑衬底和填充头中的至少一个提供直线运动或旋转运动。 焊料被迫从填充头朝向电路支撑基板。 焊料被提供到与填充头附近的至少一个空腔同时的至少一个空腔中。 系统使第二电路支撑衬底紧靠电路支撑衬底，第二电路支撑衬底上的至少一个接收衬垫基本上接触至少一个空腔的导电接合材料。