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公开(公告)号：US12068294B2
公开(公告)日：2024-08-20
申请号：US18479129
申请日：2023-10-02
Applicant: PlayNitride Display Co., Ltd.
Inventor： Yun-Li Li
IPC: H01L29/205 , H01L25/075 , H01L25/16 , H01L33/00 , H01L33/60
CPC classification number: H01L25/0753 , H01L25/167 , H01L33/60
Abstract: A manufacturing method of a micro light emitting diode structure includes: providing a first transfer stamp carrying a plurality of micro light emitting elements; providing a second transfer stamp carrying a plurality of light blocking structures, wherein each of the light blocking structures includes a light blocking layer and a light shielding layer disposed on the light blocking layer; providing a temporary substrate; transferring the micro light emitting elements onto the temporary substrate by the first transfer stamp; and transferring the light blocking structures onto the temporary substrate by the second transfer stamp. The micro light emitting elements and the light blocking structures are arranged alternately and fixed to the temporary substrate by connection layer. A reflectivity of the light blocking layer is greater than a reflectivity of the connection layer, and a Young's modulus of the light blocking layer is greater than a Young's modulus of the connection layer.
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公开(公告)号：US11922861B1
公开(公告)日：2024-03-05
申请号：US17963354
申请日：2022-10-11
Applicant: PlayNitride Display Co., Ltd.
Inventor： Kuan-Yung Liao , Yun-Li Li
IPC: G09G3/32
CPC classification number: G09G3/32 , G09G2300/0408 , G09G2300/0452 , G09G2300/0842 , G09G2310/0205 , G09G2310/0267 , G09G2310/0275 , G09G2310/08 , G09G2320/0242 , G09G2330/023
Abstract: Micro LED display device and driving method thereof. The display device includes a display substrate and a data driving circuit. The display substrate includes multiple pixels, and each pixel includes a first subpixel and a second subpixel. The first subpixel has a first subpixel circuit and a first light-emitting element. The second subpixel has a second subpixel circuit and a second light-emitting element. The first subpixel circuit and the second subpixel circuit are configured independently. The data driving circuit is electrically connected to the first and the second subpixel circuits. The data driving circuit transmits a first data signal to the first subpixel circuits to drive the first light-emitting elements and a second data signal to the second subpixel circuits to drive the second light-emitting elements. The first data signal is a PWM signal, and the second data signal is a PAM signal.
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公开(公告)号：US20220415860A1
公开(公告)日：2022-12-29
申请号：US17701678
申请日：2022-03-23
Applicant: PlayNitride Display Co., Ltd.
Inventor： Kuan-Yung Liao , Yun-Li Li , Chih-Ling Wu
IPC: H01L25/075 , H01L21/683 , H01L33/00 , H01L33/62
Abstract: A micro light emitting diode panel, including a circuit substrate, multiple transistor elements, and multiple micro light emitting diodes, is provided. The circuit substrate includes multiple signal lines, multiple bonding pads, and multiple thin film transistors. The bonding pads extend from at least part of the signal lines. The transistor elements are electrically bonded to a part of the bonding pads and are electrically connected to the thin film transistors. The micro light emitting diodes are electrically bonded to another part of the bonding pads and are electrically connected to the thin film transistors. The thin film transistors each have a first semiconductor pattern. The transistor elements each have a second semiconductor pattern. An electron mobility difference between the first semiconductor pattern and the second semiconductor pattern is greater than 30 cm2/V·s. A method of fabricating the micro light emitting diode panel is also provided.
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公开(公告)号：US20210265321A1
公开(公告)日：2021-08-26
申请号：US17084592
申请日：2020-10-29
Applicant: PlayNitride Display Co., Ltd.
Inventor： Yun-Li Li
IPC: H01L25/075 , H01L33/60 , H01L25/16
Abstract: A micro light emitting diode structure includes a temporary substrate, a plurality of micro light emitting elements, a plurality of light blocking structures, and a connection layer. The micro light emitting elements and the light blocking structures are disposed on the temporary substrate and arranged alternately. Each of the light blocking structures includes a light blocking layer, and a light shielding layer disposed on the light blocking layer. The micro light emitting elements and the light blocking structures are fixed to the temporary substrate by the connection layer. A reflectivity of the light blocking layer is greater than a reflectivity of the connection layer, and a Young's modulus of the light blocking layer is greater than a Young's modulus of the connection layer.
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公开(公告)号：US20210125970A1
公开(公告)日：2021-04-29
申请号：US16716509
申请日：2019-12-17
Applicant: PlayNitride Display Co., Ltd.
Inventor： Yun-Li Li , Tzu-Yang Lin , Yu-Hung Lai , Pei-Hsin Chen , Yi-Chun Shih
IPC: H01L25/075 , H01L33/62
Abstract: A micro light-emitting device module includes a circuit substrate, a planarization layer and a micro light-emitting device. The planarization layer is disposed on an upper surface of the circuit substrate and has a first surface and a second surface opposite to each other. The second surface is in contact with the upper surface of the circuit substrate. The micro light-emitting device is disposed on the first surface of the planarization layer. A maximum height difference of the second surface of the planarization layer is greater than a thickness of the micro light-emitting device.
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Patent Agency Ranking
公开(公告)号：US20240346982A1
公开(公告)日：2024-10-17
申请号：US18389791
申请日：2023-12-20
Applicant: PlayNitride Display Co., Ltd.
Inventor： Yun-Li Li , Kuan-Yung Liao , Sheng-Yuan Sun , Zong Huei Tsai
CPC classification number: G09G3/32 , G06F3/013 , G09G2300/023 , G09G2320/0626 , G09G2354/00
Abstract: A multi-layer display module includes a first display panel, a second display panel, a driving device, and an image composition control unit. The second display panel is located beside the first display panel and overlaps the first display panel. The first display panel and the second display panel have an interval therebetween. The driving device is configured to simultaneously provide image signals to the first display panel and the second display panel. An object image displayed in the first display panel is a first object image. An object image displayed in the second display panel is a second object image. The image composition control unit is configured to increase a size of the first object image displayed on the first display panel or decrease a size of the second object image displayed on the second display panel according to information of a relative position of an outside viewer.
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公开(公告)号：US12087876B2
公开(公告)日：2024-09-10
申请号：US18464297
申请日：2023-09-11
Applicant: PlayNitride Display Co., Ltd.
Inventor： Yun-Li Li , Yi-Chun Shih
CPC classification number: H01L33/005 , H01L33/486 , H01L33/62 , H01L33/642 , H01L2933/0066
Abstract: A micro-electronic element transfer apparatus including a first conveyer portion, a second conveyer portion, and a light source device is provided. The first conveyer portion is configured to output a plurality of micro-electronic elements. The second conveyer portion includes a first rolling component and a substrate. The substrate is disposed on the first rolling component and is moved through rolling of the first rolling component. A plurality of bumps are disposed on the substrate. The light source device is configured to irradiate the bumps for heating, and the bumps generate a phase transition. When the micro-electronic elements are outputted from the first conveyer portion, a connection force between the micro-electronic elements and the first conveyer portion is less than a connection force between the micro-electronic elements and the bumps. The micro-electronic elements are respectively bonded to the bumps. A micro-electronic element transfer method is also provided.
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公开(公告)号：US20230420601A1
公开(公告)日：2023-12-28
申请号：US18464297
申请日：2023-09-11
Applicant: PlayNitride Display Co., Ltd.
Inventor： Yun-Li Li , Yi-Chun Shih
CPC classification number: H01L33/005 , H01L33/486 , H01L33/642 , H01L33/62 , H01L2933/0066
Abstract: A micro-electronic element transfer apparatus including a first conveyer portion, a second conveyer portion, and a light source device is provided. The first conveyer portion is configured to output a plurality of micro-electronic elements. The second conveyer portion includes a first rolling component and a substrate. The substrate is disposed on the first rolling component and is moved through rolling of the first rolling component. A plurality of bumps are disposed on the substrate. The light source device is configured to irradiate the bumps for heating, and the bumps generate a phase transition. When the micro-electronic elements are outputted from the first conveyer portion, a connection force between the micro-electronic elements and the first conveyer portion is less than a connection force between the micro-electronic elements and the bumps. The micro-electronic elements are respectively bonded to the bumps. A micro-electronic element transfer method is also provided.
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公开(公告)号：US11799052B2
公开(公告)日：2023-10-24
申请号：US17087632
申请日：2020-11-03
Applicant: PlayNitride Display Co., Ltd.
Inventor： Yun-Li Li , Yi-Chun Shih
CPC classification number: H01L33/005 , H01L33/486 , H01L33/62 , H01L33/642 , H01L2933/0066
Abstract: A micro-electronic element transfer apparatus including a first conveyer portion, a second conveyer portion, and a light source device is provided. The first conveyer portion is configured to output a plurality of micro-electronic elements. The second conveyer portion includes a first rolling component and a substrate. The substrate is disposed on the first rolling component and is moved through rolling of the first rolling component. A plurality of bumps are disposed on the substrate. The light source device is configured to irradiate the bumps for heating, and the bumps generate a phase transition. When the micro-electronic elements are outputted from the first conveyer portion, a connection force between the micro-electronic elements and the first conveyer portion is less than a connection force between the micro-electronic elements and the bumps. The micro-electronic elements are respectively bonded to the bumps. A micro-electronic element transfer method is also provided.
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公开(公告)号：US20230029828A1
公开(公告)日：2023-02-02
申请号：US17499881
申请日：2021-10-13
Applicant: PlayNitride Display Co., Ltd.
Inventor： Yun-Li Li , Yu-Hung Lai , Tzu-Yang Lin
Abstract: Mass transfer equipment including a base stage, a first substrate stage, a second substrate stage, at least one laser head and a servo motor module is provided. The first substrate stage is adapted to drive a target substrate to move along a first direction. The second substrate stage is adapted to drive at least one micro device substrate to move along a second direction. The at least one laser head is adapted to move to a target position of the second substrate stage and emits a laser beam toward the at least one micro device substrate. At least one micro device is separated from a substrate of the at least one micro device substrate and connected with the target substrate after the irradiation of the laser beam. The servo motor module is used for driving the first substrate stage, the second substrate stage and the at least one laser head to move.
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