公开(公告)号：US20140254101A1

公开(公告)日：2014-09-11

申请号：US13786358

申请日：2013-03-05

Applicant: QUALCOMM INCORPORATED

Inventor： Mark A. CARTER ,  Yang ZHANG ,  Yongsheng PENG ,  Jack B. STEENSTRA ,  Michael G. BARRETT

IPC: H05K7/20 ,  H05K9/00 ,  H05K3/30

CPC classification number: H05K7/205 ,  H01L23/3121 ,  H01L23/3677 ,  H01L23/5389 ,  H01L23/552 ,  H01L2924/0002 ,  H01L2924/19105 ,  H05K1/0206 ,  H05K1/0209 ,  H05K1/0218 ,  H05K1/141 ,  H05K1/185 ,  H05K3/0097 ,  H05K3/284 ,  H05K3/30 ,  H05K3/4608 ,  H05K9/00 ,  H05K2201/068 ,  H05K2201/09872 ,  Y10T29/4913 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Method and apparatuses for making a smart phone on a chip (SPOC) are described. Active components may be embedded into a copper core. In an aspect, and optionally, passive components may also be embedded into the copper core. Printed circuit board (PCB) laminate may be layered above and below the copper core. A copper ground plane may be fixed underneath the layer of PCB laminate below, and furthest from, the copper core. One or more additional components may be surface mounted on top of the PCB laminate layers above the copper core. A conformal coating may be applied to completely and thinly encase the one or more surface mounted additional components. The conformal coating may include trenching and a copper sputter coating finish.

Abstract translation: 描述用于制造芯片上的智能手机（SPOC）的方法和装置。 活性组分可嵌入铜芯中。 在一方面，并​​且可选地，无源部件也可以嵌入到铜芯中。 印刷电路板（PCB）层压板可以在铜芯上方和下方分层。 铜接地平面可以固定在PCB层压体下方，最远离铜芯的位置。 一个或多个附加部件可以表面安装在铜芯上方的PCB层叠层的顶部上。 可以施加保形涂层以完全和薄地包住一个或多个表面安装的附加部件。 保形涂层可以包括开沟和铜溅射涂层。