公开(公告)号：US20140254108A1

公开(公告)日：2014-09-11

申请号：US13792092

申请日：2013-03-10

Applicant: QUALCOMM INCORPORATED

Inventor： Yang ZHANG ,  Jack B. STEENSTRA

IPC: H05K1/02 ,  H05K3/32 ,  H05K3/46 ,  H05K7/02

CPC classification number: H05K1/0298 ,  H05K1/0201 ,  H05K7/02 ,  H05K2201/09663 ,  H05K2201/09709 ,  H05K2201/09972 ,  H05K2201/10098 ,  H05K2201/10151 ,  Y10T29/49124 ,  Y10T29/4913

Abstract: A printed circuit board assembly for reducing the impact of heat generated from circuitry within a handheld or non-handheld device is provided. The printed circuit board assembly may include a printed circuit board comprising a plurality of conductive layers and a plurality of dielectric layers where each dielectric layer is disposed between a pair of conductive layers. Each conductive layer may include a first portion and a second portion separated by a gap where the gaps in the alternating conductive layers are misaligned. The first portion of each conductive layer may be substantially thermally isolated from the second portion of each conductive layer.

Abstract translation: 提供了一种用于减少由手持设备或非手持设备内的电路产生的热量的影响的印刷电路板组件。 印刷电路板组件可以包括印刷电路板，其包括多个导电层和多个电介质层，其中每个电介质层设置在一对导电层之间。 每个导电层可以包括由交替导电层中的间隙不对准的间隙分开的第一部分和第二部分。 每个导电层的第一部分可以与每个导电层的第二部分基本上热隔离。

公开(公告)号：US20140254101A1

公开(公告)日：2014-09-11

申请号：US13786358

申请日：2013-03-05

Applicant: QUALCOMM INCORPORATED

Inventor： Mark A. CARTER ,  Yang ZHANG ,  Yongsheng PENG ,  Jack B. STEENSTRA ,  Michael G. BARRETT

IPC: H05K7/20 ,  H05K9/00 ,  H05K3/30

CPC classification number: H05K7/205 ,  H01L23/3121 ,  H01L23/3677 ,  H01L23/5389 ,  H01L23/552 ,  H01L2924/0002 ,  H01L2924/19105 ,  H05K1/0206 ,  H05K1/0209 ,  H05K1/0218 ,  H05K1/141 ,  H05K1/185 ,  H05K3/0097 ,  H05K3/284 ,  H05K3/30 ,  H05K3/4608 ,  H05K9/00 ,  H05K2201/068 ,  H05K2201/09872 ,  Y10T29/4913 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Method and apparatuses for making a smart phone on a chip (SPOC) are described. Active components may be embedded into a copper core. In an aspect, and optionally, passive components may also be embedded into the copper core. Printed circuit board (PCB) laminate may be layered above and below the copper core. A copper ground plane may be fixed underneath the layer of PCB laminate below, and furthest from, the copper core. One or more additional components may be surface mounted on top of the PCB laminate layers above the copper core. A conformal coating may be applied to completely and thinly encase the one or more surface mounted additional components. The conformal coating may include trenching and a copper sputter coating finish.

Abstract translation: 描述用于制造芯片上的智能手机（SPOC）的方法和装置。 活性组分可嵌入铜芯中。 在一方面，并​​且可选地，无源部件也可以嵌入到铜芯中。 印刷电路板（PCB）层压板可以在铜芯上方和下方分层。 铜接地平面可以固定在PCB层压体下方，最远离铜芯的位置。 一个或多个附加部件可以表面安装在铜芯上方的PCB层叠层的顶部上。 可以施加保形涂层以完全和薄地包住一个或多个表面安装的附加部件。 保形涂层可以包括开沟和铜溅射涂层。

公开(公告)号：US20140215805A1

公开(公告)日：2014-08-07

申请号：US13757811

申请日：2013-02-03

Applicant: QUALCOMM INCORPORATED

Inventor： Yang ZHANG ,  Jack B. STEENSTRA

IPC: H05K13/00

CPC classification number: H05K13/00 ,  H05K1/0218 ,  H05K3/284 ,  H05K3/288 ,  H05K2201/10204 ,  H05K2201/10371 ,  H05K2203/0173 ,  Y10T29/49004

Abstract: A method for manufacturing a removable metalized conformal shield for a circuit substrate having at least one circuit component includes: forming a cast representing the circuit substrate having the at least one circuit component; preparing a metalized conformal shield using the cast; applying the metalized conformal shield to the circuit substrate; measuring an output of the circuit component of the circuit substrate; removing the metalized conformal shield from the circuit substrate; and adjusting the circuit component based on the measured output.

Abstract translation: 一种用于制造具有至少一个电路部件的电路基板的可拆卸金属化共形屏蔽的方法，包括：形成表示具有所述至少一个电路部件的电路基板的铸件; 使用铸件制备金属化保形盾; 将金属化的共形屏蔽施加到电路基板; 测量电路基板的电路部件的输出; 从电路基板去除金属化的共形屏蔽; 并且基于测量的输出来调整电路部件。