公开(公告)号：US20140144681A1

公开(公告)日：2014-05-29

申请号：US13686620

申请日：2012-11-27

Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.

Inventor： Victor Louis Arockiaraj Pushparaj ,  Ravindra V. Shenoy ,  Jon Bradley Lasiter ,  Kwan-Yu Lai ,  Donald William Kidwell ,  Ana Rangelova Londergan

IPC: H05K1/03 ,  B32B7/12 ,  H05K1/16 ,  B32B3/30 ,  C23C28/00 ,  H05K1/09 ,  C23C16/02 ,  B32B3/26

CPC classification number: H05K1/162 ,  B32B3/266 ,  B32B3/30 ,  B32B7/12 ,  C03C17/3435 ,  C03C17/3626 ,  C03C17/3639 ,  C03C17/3649 ,  C03C17/3655 ,  C03C17/3671 ,  C03C17/3697 ,  C23C16/045 ,  C23C16/34 ,  C23C16/45525 ,  C23C28/322 ,  C23C28/34 ,  H01L23/15 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L28/75 ,  H01L28/91 ,  H01L2924/0002 ,  Y10T428/24322 ,  Y10T428/24545 ,  H01L2924/00

Abstract: This disclosure provides systems, methods and apparatus for an adhesive metal nitride layer on glass. In one aspect, a glass substrate having a surface is provided. A via with a depth to width aspect ratio of 5 to 1 or greater extends at least partially through the glass substrate. An adhesive metal nitride layer is disposed on the surface of the glass substrate and on one or more interior surfaces of the via. The adhesive metal nitride layer includes at least one of titanium nitride and tantalum nitride.

Abstract translation: 本公开提供了用于玻璃上的粘合性金属氮化物层的系统，方法和装置。 一方面，提供具有表面的玻璃基板。 深度与宽度纵横比为5至1或更大的通孔至少部分延伸穿过玻璃基底。 粘合金属氮化物层设置在玻璃基板的表面上和通孔的一个或多个内表面上。 粘合性金属氮化物层包括氮化钛和氮化钽中的至少一种。

公开(公告)号：US10115671B2

公开(公告)日：2018-10-30

申请号：US13748294

申请日：2013-01-23

Applicant: QUALCOMM MEMS Technologies, Inc.

Inventor： Ravindra V. Shenoy ,  Kwan-Yu Lai ,  Philip Jason Stephanou ,  Mario Francisco Velez ,  Jonghae Kim ,  Evgeni Petrovich Gousev

IPC: H01L23/538 ,  G09G3/3266 ,  H01L25/00 ,  H01L23/15 ,  H01L23/498 ,  H01L21/48 ,  H01L25/10 ,  H01L23/31 ,  H01L23/50

Abstract: This disclosure provides systems, methods and apparatus for glass via bars that can be used in compact three-dimensional packages, including package-on-packages (PoPs). The glass via bars can provide high density electrical interconnections in the PoPs. In some implementations, the glass via bars can include integrated passive components. Packaging methods employing glass via bars are also provided.

公开(公告)号：US20140035892A1

公开(公告)日：2014-02-06

申请号：US13748294

申请日：2013-01-23

Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.

Inventor： Ravindra V. Shenoy ,  Kwan-Yu Lai ,  Philip Jason Stephanou ,  Mario Francisco Velez ,  Jonghae Kim ,  Evgeni Petrovich Gousev

IPC: H01L23/538 ,  G09G3/32 ,  H01L25/00

CPC classification number: H01L23/5389 ,  G09G3/3266 ,  H01L21/486 ,  H01L23/15 ,  H01L23/3121 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/50 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/12044 ,  H01L2924/1461 ,  H01L2924/00

Abstract: This disclosure provides systems, methods and apparatus for glass via bars that can be used in compact three-dimensional packages, including package-on-packages (PoPs). The glass via bars can provide high density electrical interconnections in the PoPs. In some implementations, the glass via bars can include integrated passive components. Packaging methods employing glass via bars are also provided.

Abstract translation: 本公开提供了可用于紧凑三维封装（包括封装封装（PoP））的用于玻璃通孔条的系统，方法和装置。 玻璃通孔棒可以在PoP中提供高密度电连接。 在一些实施方案中，玻璃通孔棒可以包括集成的无源部件。 还提供了采用玻璃通孔条的包装方法。

公开(公告)号：US20140177188A1

公开(公告)日：2014-06-26

申请号：US13727124

申请日：2012-12-26

Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.

Inventor： Philip Jason Stephanou ,  Ravindra V. Shenoy ,  Kwan-Yu Lai ,  James G. Shook ,  Nassim Khonsari ,  Peter Jings Lin ,  Tsongming Kao ,  Peng Cheng Lin

IPC: B23K26/20 ,  H05K7/02

CPC classification number: H05K7/02 ,  B23K1/0016 ,  B23K1/0053 ,  B23K1/0056 ,  B23K1/19 ,  B23K26/03 ,  B23K26/042 ,  B23K26/206

Abstract: This disclosure provides systems, methods and apparatus for packaging of dissimilar devices using electromagnetic radiation from a laser. In one aspect, an apparatus can include a first substrate, a second substrate, and a first device and a second device disposed on the second substrate. A first metal ring on the first substrate contacts a second metal ring on a second substrate, and is heated by a first electromagnetic radiation from a laser to enclose a first cavity containing the first device. A third metal ring on the first substrate contacts a fourth metal ring on the second substrate, and is heated by a second electromagnetic radiation to enclose a second cavity containing the second device. Enclosing the first cavity may be performed under a first atmosphere, and the enclosing the second cavity may be performed under a second, different atmosphere.

Abstract translation: 本公开提供了使用来自激光器的电磁辐射来封装不同装置的系统，方法和装置。 在一个方面，一种装置可以包括第一基板，第二基板以及设置在第二基板上的第一装置和第二装置。 第一衬底上的第一金属环接触第二衬底上的第二金属环，并且被来自激光器的第一电磁辐射加热以封闭包含第一器件的第一腔。 第一衬底上的第三金属环接触第二衬底上的第四金属环，并且被第二电磁辐射加热以封闭包含第二器件的第二腔。 封闭第一空腔可以在第一气氛下进行，并且封闭第二空腔可以在第二不同的气氛下进行。