公开(公告)号：US20140177188A1

公开(公告)日：2014-06-26

申请号：US13727124

申请日：2012-12-26

Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.

Inventor： Philip Jason Stephanou ,  Ravindra V. Shenoy ,  Kwan-Yu Lai ,  James G. Shook ,  Nassim Khonsari ,  Peter Jings Lin ,  Tsongming Kao ,  Peng Cheng Lin

IPC: B23K26/20 ,  H05K7/02

CPC classification number: H05K7/02 ,  B23K1/0016 ,  B23K1/0053 ,  B23K1/0056 ,  B23K1/19 ,  B23K26/03 ,  B23K26/042 ,  B23K26/206

Abstract: This disclosure provides systems, methods and apparatus for packaging of dissimilar devices using electromagnetic radiation from a laser. In one aspect, an apparatus can include a first substrate, a second substrate, and a first device and a second device disposed on the second substrate. A first metal ring on the first substrate contacts a second metal ring on a second substrate, and is heated by a first electromagnetic radiation from a laser to enclose a first cavity containing the first device. A third metal ring on the first substrate contacts a fourth metal ring on the second substrate, and is heated by a second electromagnetic radiation to enclose a second cavity containing the second device. Enclosing the first cavity may be performed under a first atmosphere, and the enclosing the second cavity may be performed under a second, different atmosphere.

Abstract translation: 本公开提供了使用来自激光器的电磁辐射来封装不同装置的系统，方法和装置。 在一个方面，一种装置可以包括第一基板，第二基板以及设置在第二基板上的第一装置和第二装置。 第一衬底上的第一金属环接触第二衬底上的第二金属环，并且被来自激光器的第一电磁辐射加热以封闭包含第一器件的第一腔。 第一衬底上的第三金属环接触第二衬底上的第四金属环，并且被第二电磁辐射加热以封闭包含第二器件的第二腔。 封闭第一空腔可以在第一气氛下进行，并且封闭第二空腔可以在第二不同的气氛下进行。

公开(公告)号：US20150346478A1

公开(公告)日：2015-12-03

申请号：US14500690

申请日：2014-09-29

Applicant: QUALCOMM MEMS Technologies, Inc.

Inventor： Cheonhong Kim ,  Tsongming Kao ,  Jian Ma ,  Lixia Zhou ,  Tallis Young Chang ,  Shu-Jhih Chen ,  John Hyunchul Hong

IPC: G02B26/00 ,  G02B5/00 ,  G02B5/20 ,  H01L27/12

CPC classification number: G02B26/001 ,  G02B5/003 ,  G02B5/208 ,  H01L27/1214 ,  H01L27/1248 ,  H01L27/1259 ,  H01L29/78633

Abstract: A display assembly includes an array of display elements disposed between a first substrate and a second substrate, the array of display elements including one or more thin film transistors (TFTs). A black mask arrangement is disposed between the first substrate and the second substrate, the black mask arrangement being configured to prevent light entering the display assembly from reaching the TFTs.

Abstract translation: 显示组件包括布置在第一衬底和第二衬底之间的显示元件阵列，显示元件阵列包括一个或多个薄膜晶体管（TFT）。 黑色掩模布置设置在第一基板和第二基板之间，黑色掩模布置被配置为防止进入显示器组件的光到达TFT。

公开(公告)号：US20150166333A1

公开(公告)日：2015-06-18

申请号：US14104915

申请日：2013-12-12

Applicant: QUALCOMM MEMS Technologies, Inc.

Inventor： Wenguang Li ,  Tsongming Kao

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0058 ,  B81B7/0038 ,  B81C1/00333 ,  B81C2203/0172

Abstract: This disclosure provides systems, methods and apparatus for a laminated film enclosing an array of microelectromechanical systems (MEMS) structures. In one aspect, a MEMS apparatus includes a substrate having a device region and an edge region surrounding the device region and an array of MEMS structures on the substrate at the device region. A protective layer is disposed over the array of MEMS structures. A laminated film is disposed over the protective layer and in contact with the substrate to form a seal at the edge region, where the laminated film forms a cavity between the substrate and the laminated film at the device region. The laminated film includes a moisture barrier layer facing away from the array of MEMS structures, and a desiccant layer facing toward the array of MEMS structures.

Abstract translation: 本公开提供了用于封装微机电系统（MEMS）结构阵列的层压膜的系统，方法和装置。 在一个方面，MEMS装置包括具有器件区域和围绕器件区域的边缘区域以及器件区域上的衬底上的MEMS结构阵列的衬底。 保护层设置在MEMS结构阵列上。 层叠膜设置在保护层上方并与基板接触以在边缘区域形成密封，其中层压膜在器件区域处在基板和层压膜之间形成空腔。 层压膜包括背离MEMS结构阵列的防潮层和面向MEMS结构阵列的干燥剂层。

公开(公告)号：US09156678B2

公开(公告)日：2015-10-13

申请号：US14104915

申请日：2013-12-12

Applicant: QUALCOMM MEMS Technologies, Inc.

Inventor： Wenguang Li ,  Tsongming Kao

IPC: H01L23/20 ,  B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0058 ,  B81B7/0038 ,  B81C1/00333 ,  B81C2203/0172

Abstract: This disclosure provides systems, methods and apparatus for a laminated film enclosing an array of microelectromechanical systems (MEMS) structures. In one aspect, a MEMS apparatus includes a substrate having a device region and an edge region surrounding the device region and an array of MEMS structures on the substrate at the device region. A protective layer is disposed over the array of MEMS structures. A laminated film is disposed over the protective layer and in contact with the substrate to form a seal at the edge region, where the laminated film forms a cavity between the substrate and the laminated film at the device region. The laminated film includes a moisture barrier layer facing away from the array of MEMS structures, and a desiccant layer facing toward the array of MEMS structures.

Abstract translation: 本公开提供了用于封装微机电系统（MEMS）结构阵列的层压膜的系统，方法和装置。 在一个方面，MEMS装置包括具有器件区域和围绕器件区域的边缘区域以及器件区域上的衬底上的MEMS结构阵列的衬底。 保护层设置在MEMS结构阵列上。 层叠膜设置在保护层上方并与基板接触以在边缘区域形成密封，其中层压膜在器件区域处在基板和层压膜之间形成空腔。 层压膜包括背离MEMS结构阵列的防潮层和面向MEMS结构阵列的干燥剂层。