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公开(公告)号：US20170352969A1
公开(公告)日：2017-12-07
申请号：US15171636
申请日：2016-06-02
Applicant: Raytheon Company
Inventor： David E. Swernofsky , Brandon W. Pillans
CPC classification number: H01R12/75 , H01R9/0515 , H01R12/55 , H01R12/718 , H01R13/2414 , H05K1/0243 , H05K3/301 , H05K2201/10303
Abstract: A connectable assembly is provided and includes a body defining a recess, a male conductive element supportively disposed proximate to the body and a conductive compliant (CC) plug disposed within the recess for establishing a radially compliant, axially free running electrical connection with the male conductive element.
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公开(公告)号：US09603283B1
公开(公告)日：2017-03-21
申请号：US14879191
申请日：2015-10-09
Applicant: Raytheon Company
Inventor： Brandon W. Pillans , James Mcspadden
CPC classification number: H05K7/202 , H01L23/36 , H01L23/5385 , H01L23/66 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/48 , H01L24/72 , H01L24/73 , H01L24/81 , H01L24/90 , H01L25/0652 , H01L2224/1134 , H01L2224/1308 , H01L2224/16145 , H01L2224/48227 , H01L2224/72 , H01L2224/73207 , H01L2224/81191 , H01L2224/81901 , H01L2224/90 , H01L2224/9202 , H01L2224/92163 , H01L2225/0651 , H01L2225/06513 , H01L2225/06589 , H05K13/00 , H01L2224/85 , H01L2224/11
Abstract: An electronic module, and method for making same, includes free-formed, self-supported interconnect pillars that electrically connect cover electronic components disposed on a cover substrate with base electronic components disposed on a base substrate. The free-formed, self-supported interconnect pillars may extend vertically in a straight path between the cover electronic components and the base electronic components. The free-formed, self-supported interconnect pillars may be formed from an electrically conductive filament provided by an additive manufacturing process. By free-forming the self-supported interconnect pillars directly on the electronic components, the flexibility of electronic module design may be enhanced, while reducing the complexity and cost to manufacture such electronic modules.
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公开(公告)号：US20170040657A1
公开(公告)日：2017-02-09
申请号：US14817891
申请日：2015-08-04
Applicant: Raytheon Company
Inventor： Patrick J. Kocurek , Daniel Schlieter , Christopher Loehrlein , Brandon W. Pillans , Richard G. Pierce
CPC classification number: H01P3/06 , B22F3/1055 , B22F5/10 , B22F2003/1057 , B22F2003/1058 , B29C64/106 , B33Y10/00 , B33Y70/00 , B33Y80/00 , C22C5/06 , H01P3/081 , H01P3/087 , H01P11/003 , H01P11/005 , Y02P10/295
Abstract: A transmission line is provided and includes a center conductor suspended above a ground plane and comprising a line of printed, self-supporting metallic material, ground walls disposed on either side of the center conductor and comprising stacked lines of printed metallic material and a lid suspended above the center conductor between the ground walls and comprising arrayed lines of the printed, self-supporting metallic material.
Abstract translation: 提供传输线，并且包括悬挂在接地平面上方的中心导体，并且包括一排印刷的自支撑金属材料，设置在中心导体两侧的接地壁，并且包括堆叠的印刷金属材料线和悬挂的盖 位于地面壁之间的中心导体之上并且包括印刷的自支撑金属材料的排列线。
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公开(公告)号：US12171064B2
公开(公告)日：2024-12-17
申请号：US17192853
申请日：2021-03-04
Applicant: Raytheon Company
Inventor： Brandon W. Pillans , Robert Manley , Monte R. Sanchez
Abstract: An interconnect is provided that can comprise a recess formed in a body where the recess comprises an axial end wall and a side wall extending from the axial end wall. The interconnect can also comprise a distributed metallized layer disposed on the axial end wall and the side wall and a conductive compliant (CC) plug disposed within the recess to interface with the metallized layer. The CC plug can be configured to establish an electrical connection between a conductive pad disposed on the recess and a male conductive element inserted into the recess via the metallized layer.
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公开(公告)号：US10778176B2
公开(公告)日：2020-09-15
申请号：US16203763
申请日：2018-11-29
Applicant: RAYTHEON COMPANY
Inventor： Richard G. Pierce , Robert S. Isom , Brandon W. Pillans , Mikel White , David D. Heston , John G. Heston
Abstract: Guanella topology balun/unun impedance transformer contains cascaded, i.e., series-coupled, coils of different sizes implemented in RF CMOS technology. The cascading of differently-sized coils provides for a large resonance-free operating bandwidth. The shunt inductive loading maximizes low frequency performance.
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Patent Agency Ranking
公开(公告)号：US10692641B2
公开(公告)日：2020-06-23
申请号：US15952364
申请日：2018-04-13
Applicant: Raytheon Company
Abstract: A transmission line impedance transformer including at least two different dielectric media having different dielectric properties, each of the dielectric media being configured to taper in thickness along the length of the impedance transformer in an inverse relationship with respect to each other so as to form a combined dielectric medium having an effective dielectric property that is graded along the transmission path. The two or more dielectric media may be disposed between two conductors to provide an impedance transformer in which a characteristic impedance of the transmission line varies along its length in response to the gradation of the effective dielectric property of the combined dielectric medium.
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公开(公告)号：US20180233269A1
公开(公告)日：2018-08-16
申请号：US15952364
申请日：2018-04-13
Applicant: Raytheon Company
Abstract: A transmission line impedance transformer including at least two different dielectric media having different dielectric properties, each of the dielectric media being configured to taper in thickness along the length of the impedance transformer in an inverse relationship with respect to each other so as to form a combined dielectric medium having an effective dielectric property that is graded along the transmission path. The two or more dielectric media may be disposed between two conductors to provide an impedance transformer in which a characteristic impedance of the transmission line varies along its length in response to the gradation of the effective dielectric property of the combined dielectric medium.
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公开(公告)号：US09373460B2
公开(公告)日：2016-06-21
申请号：US13727524
申请日：2012-12-26
Applicant: Raytheon Company
Inventor： Brandon W. Pillans , Francis J. Morris , Mikel J. White
CPC classification number: H01H11/00 , H01G5/16 , H01H57/00 , Y10T29/49105
Abstract: Systems and methods for providing high-capacitive RF MEMS switches are provided. In one embodiment, the invention relates to a micro-electro-mechanical switch assembly including a substrate, an electrode disposed on a portion of the substrate, a dielectric layer disposed on at least a portion of the electrode, a metal layer disposed on at least a portion of the dielectric layer, and a flexible membrane having first and second ends supported at spaced locations on the substrate base, where the flexible membrane is configured to move from a default position to an actuated position in response to a preselected switching voltage applied between the flexible membrane and the electrode, and where, in the actuated position, the flexible membrane is in electrical contact with the metal layer.
Abstract translation: 提供了用于提供高电容RF MEMS开关的系统和方法。 在一个实施例中，本发明涉及一种微机电开关组件，其包括衬底，设置在衬底的一部分上的电极，设置在电极的至少一部分上的电介质层，至少设置在金属层上的金属层 所述电介质层的一部分以及柔性膜，所述柔性膜具有第一和第二端部，其支撑在所述基板基底上的间隔位置处，其中所述柔性膜被配置为响应于施加在所述介电层之间的预选开关电压而从默认位置移动到致动位置 柔性膜和电极，并且其中在致动位置中柔性膜与金属层电接触。
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公开(公告)号：US20220287179A1
公开(公告)日：2022-09-08
申请号：US17192853
申请日：2021-03-04
Applicant: Raytheon Company
Inventor： Brandon W. Pillans , Robert Manley , Monte R. Sanchez
Abstract: An interconnect is provided that can comprise a recess formed in a body where the recess comprises an axial end wall and a side wall extending from the axial end wall. The interconnect can also comprise a distributed metallized layer disposed on the axial end wall and the side wall and a conductive compliant (CC) plug disposed within the recess to interface with the metallized layer. The CC plug can be configured to establish an electrical connection between a conductive pad disposed on the recess and a male conductive element inserted into the recess via the metallized layer.
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公开(公告)号：US20200177151A1
公开(公告)日：2020-06-04
申请号：US16203763
申请日：2018-11-29
Applicant: RAYTHEON COMPANY
Inventor： Richard G. Pierce , Robert S. Isom , Brandon W. Pillans , Mikel White , David D. Heston , John G. Heston
Abstract: Guanella topology balun/unun impedance transformer contains cascaded, i.e., series-coupled, coils of different sizes implemented in RF CMOS technology. The cascading of differently-sized coils provides for a large resonance-free operating bandwidth. The shunt inductive loading maximizes low frequency performance.
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