公开(公告)号：US20210285897A1

公开(公告)日：2021-09-16

申请号：US17193219

申请日：2021-03-05

Applicant: REDLEN TECHNOLOGIES, INC.

Inventor： Christopher READ ,  Keira FLANAGAN ,  Michael AYUKAWA ,  Jeffrey Allan WALTON

IPC: G01N23/046 ,  G01N23/083

Abstract: A radiation detector module includes a frame, a module circuit board connected to the frame, detector units that each include radiation sensors disposed above the frame and electrically connected to the module circuit board, and an optically and infrared radiation opaque, X-ray transparent, electrically insulating detector shield covering a top surface and at least one side surface of the radiation sensors.

公开(公告)号：US20190339402A1

公开(公告)日：2019-11-07

申请号：US15972717

申请日：2018-05-07

Applicant: REDLEN TECHNOLOGIES, INC.

Inventor： Robert CRESTANI ,  Christopher READ ,  Michael AYUKAWA ,  Glenn BINDLEY ,  Kris INIEWSKI

IPC: G01T1/24 ,  G01T1/20

Abstract: A radiation detector unit includes an interposer, at least one radiation sensor bonded to a front side of an interposer, an application-specific integrated chip (ASIC) bonded to a backside of the interposer, a carrier board bonded to the backside of the interposer and located on a backside of the ASIC, and at least one flex cable assembly attached to a respective side of the carrier board.

公开(公告)号：US20180329079A1

公开(公告)日：2018-11-15

申请号：US15592368

申请日：2017-05-11

Applicant: REDLEN TECHNOLOGIES, INC.

Inventor： Pinghe LU ,  Michael AYUKAWA ,  Christopher READ ,  Robert CRESTANI ,  Jeffrey WALTON

IPC: G01T1/17 ,  B29C65/48

CPC classification number: B29C65/4855 ,  B29L2031/34 ,  C09J7/30 ,  C09J9/02 ,  C09J2201/134 ,  C09J2201/36 ,  C09J2201/602 ,  H01L27/00

Abstract: A cathode conductive strip can be attached to a semiconductor radiation sensor by using a double sided dual adhesive electrically conductive tape in a sensor assembly or a detector module to provide reliable electrical connection between the semiconductor radiation sensor and the cathode conductive strip. The double sided dual adhesive electrically conductive tape includes an electrically conductive backing with two different adhesion strength adhesives on both sides. The high adhesion strength side is bonded to the cathode electrode of the semiconductor radiation sensor. The lower adhesion strength side is bonded to the conductive face of the cathode conductive strip.