公开(公告)号：US20240306308A1

公开(公告)日：2024-09-12

申请号：US18650160

申请日：2024-04-30

Applicant: RESONAC CORPORATION

Inventor： Masaya TOBA ,  Kazuhiko KURAFUCHI ,  Takashi MASUKO ,  Kazuyuki MITSUKURA ,  Shinichiro ABE

IPC: H05K3/18 ,  C23C18/16 ,  C23C18/20 ,  C23C18/32 ,  C23C18/38 ,  H05K1/03

CPC classification number: H05K3/181 ,  C23C18/1605 ,  C23C18/165 ,  C23C18/20 ,  C23C18/32 ,  C23C18/38 ,  H05K1/032 ,  H05K2201/068

Abstract: A semiconductor package includes a wiring board and a semiconductor element mounted on the wiring board. The wiring board includes a first insulating material layer having a surface with an arithmetic average roughness Ra of 100 nm or less, a metal wiring provided on the surface of the first insulating material layer, and a second insulating material layer provided to cover the metal wiring. The metal wiring is configured by a metal layer in contact with the surface of the first insulating material layer and a conductive part stacked on a surface of the metal layer, and a nickel content rate of the metal layer is 0.25 to 20% by mass.