公开(公告)号：US20160359426A1

公开(公告)日：2016-12-08

申请号：US15103617

申请日：2014-12-11

Applicant: ROMPOWER ENERGY SYSTEMS INC.

Inventor： Ionel Jitaru ,  Ian Poynton ,  Enrique Velasco

IPC: H02M7/00 ,  H02M7/21 ,  H05K1/14 ,  H05K1/02 ,  H05K9/00 ,  H05K1/18

CPC classification number: H02M7/003 ,  H02M7/21 ,  H05K1/0203 ,  H05K1/0256 ,  H05K1/14 ,  H05K1/181 ,  H05K3/366 ,  H05K9/0071 ,  H05K2201/042 ,  H05K2201/044 ,  H05K2201/047 ,  H05K2201/062 ,  H05K2201/09063 ,  H05K2201/0999 ,  H05K2201/10015 ,  H05K2201/10166

Abstract: Meeting todays requirement in power supply technology demands significant technological advancement in optimizing circuit topology, components and materials, thermal and packaging designs. These requirements are being pushed mainly by continuously increasing power density and efficiency requirements. Ultimately, these trends will come to a point whereby limitations from the above mentioned technological advancements is dependent on one of the above, which is the packaging design. To realize this dependence, we need to look at the growing power systems for modern equipment out there. Let us enumerate some of the available AC adapters in terms of power densities of a 45 W adapter. Firstly, square type architecture introduced by Apple is about 7 W/in3, considering the packaging has a profile limitation whereby its AC plug is removable thus occupying relatively bigger chunk of the volume. The next one is by Asus of similar profile to Apple incorporating the AC Plug eliminating the socket assembly in the packaging; which packs about 9 W/in3. Lastly, the typical rectangular profile by Eos which is about 7 W/in3. As for this particular embodiment it is about 40% smaller in profile, in contrast to the 45 W Apple packaging, with increase power density of about 12 W/in3. Packaging design method plays a great role in achieving the above requirements for a very high density converters.

Abstract translation: 电源技术的今天要求在优化电路拓扑，组件和材料，热和封装设计方面需要显着的技术进步。 这些要求主要是通过不断提高功率密度和效率要求来推动的。 最终，这些趋势将会出现，上述技术进步的限制取决于上述之一，即包装设计。 为了实现这种依赖，我们需要看现在的设备不断增长的电力系统。 在45 W适配器的功率密度方面，我们列举一些可用的交流适配器。 首先，Apple推出的Square型架构约为7W / in3，考虑到封装具有配置限制，其AC插头可拆卸，因此占据相对较大的块体积。 接下来的一个是华硕与苹果相似的配置，包括交流插头，消除了包装中的插座组件; 其中包装约9 W / in3。 最后，Eos的典型矩形轮廓约为7 W / in3。 对于这个特定的实施例，与45W苹果包装相比，其功率密度增加约为12W / in3，约为40％。 包装设计方法对于实现上述高密度转换器的要求起着重要作用。