PHOTORESIST UNDERLAYER COMPOSITIONS AND METHODS OF FORMING ELECTRONIC DEVICES

    公开(公告)号:US20240264528A1

    公开(公告)日:2024-08-08

    申请号:US18537020

    申请日:2023-12-12

    CPC classification number: G03F7/11 C07C43/285 C07C49/255 C07C317/22

    Abstract: Photoresist underlayer compositions, comprising: a curable compound comprising a group of the following formula (1):




    wherein: R1 is each independently H, C1-30 alkyl, or C3-30 cycloalkyl; Ar1 is an aromatic ring or a fused aromatic ring system having from 5 to 30 carbon atoms, wherein Ar1 is substituted or unsubstituted; Ar2 is an aromatic ring chosen from a 6-membered carbocyclic aromatic ring, a 5- or 6-membered heteroaromatic ring, or a fused aromatic ring system having from 5 to 30 carbon atoms, wherein Ar2 optionally comprises a fused cyclic imide moiety, a fused oxazole moiety, a fused imidazole moiety, or a fused thiazole moiety, and wherein Ar2 is substituted or unsubstituted; Y1 is a single covalent bond, or is selected from —O—, —C(O)—, —C(O)O—, —S—, —S(O)2—, —N(R2)—, —C(O)N(R2)—, —C(O)N(R2)C(O)—, —(CH2)y—, or a combination thereof, wherein R2 is H, C1-10 alkyl, C2-10 unsaturated hydrocarbyl, C5-30 aryl, C(O)R3, or S(O)2R3, wherein R3 is chosen from H, C1-10 alkyl, C2-10 unsaturated hydrocarbyl, and C5-30 aryl, and y is an integer from 1 to 6; x is an integer from 2 to 5; and * denotes a binding site to a part of the curable compound other than the group represented by formula (1), provided that no two




    groups are in an ortho position to each other on Ar1, wherein ** denotes the point of attachment to an aromatic ring carbon of Ar1; and

    a solvent.

    PHOTORESIST UNDERLAYER COMPOSITION
    4.
    发明公开

    公开(公告)号:US20230194990A1

    公开(公告)日:2023-06-22

    申请号:US18076475

    申请日:2022-12-07

    CPC classification number: G03F7/11 C09D165/02 H01L21/0274

    Abstract: A method of forming a pattern, the method comprising: applying a photoresist underlayer composition over a substrate to provide a photoresist underlayer; forming a photoresist layer over the photoresist underlayer; patterning the photoresist layer; and transferring a pattern from the patterned photoresist layer to the photoresist underlayer. The photoresist underlayer composition includes a polymer that includes a repeating unit represented by Formula 1 as described herein, a compound including a substituent group represented by Formula 2 as described herein, and a solvent.

    COATING COMPOSITIONS AND METHODS OF FORMING ELECTRONIC DEVICES

    公开(公告)号:US20210341840A1

    公开(公告)日:2021-11-04

    申请号:US17231417

    申请日:2021-04-15

    Abstract: Coating compositions comprise: a curable compound comprising: a core chosen from a C6 carbocyclic aromatic ring, a C2-5 heterocyclic aromatic ring, a C9-30 fused carbocyclic aromatic ring system, a C4-30 fused heterocyclic aromatic ring system, C1-20 aliphatic, and C3-20 cycloaliphatic, and three or more substituents of formula (1) wherein at least two substituents of formula (1) are attached to the aromatic core; and wherein: Ar1 is chosen from a C6 carbocyclic aromatic ring, a C2-5 heterocyclic aromatic ring, a C9-30 fused carbocyclic aromatic ring system, and a C4-30 fused heteroocyclic aromatic ring system; Z is a substituent independently chosen from OR1, protected hydroxyl, carboxyl, protected carboxyl, SR1, protected thiol, —O—C(═O)—C1-6 alkyl, halogen, and NHR2; wherein each R1 is independently chosen from H, C1-10 alkyl, C2-10 unsaturated hydrocarbyl, and C5-30 aryl; each R2 is independently chosen from H, C1-10 alkyl, C2-10 unsaturated hydrocarbyl, C5-30 aryl, C(═O)—R1, and S(═O)2—R1; x is an integer from 1 to the total number of available aromatic ring atoms in Ar1; and * denotes the point of attachment to the core; provided that no substituents of formula (1) are in an ortho position to each other on the same aromatic ring of the core; a polymer; and one or more solvents, wherein the total solvent content is from 50 to 99 wt % based on the coating composition. Coated substrates formed with the coating compositions and methods of forming electronic devices using the compositions are also provided. The compositions, coated substrates and methods find particular applicability in the manufacture of semiconductor devices.

    COATING COMPOSITIONS AND METHODS OF FORMING ELECTRONIC DEVICES

    公开(公告)号:US20210343522A1

    公开(公告)日:2021-11-04

    申请号:US17231339

    申请日:2021-04-15

    Abstract: Coating compositions comprise: a B-staged reaction product of one or more compounds comprising: a core chosen from C6-50 carbocyclic aromatic, C2-50 heterocyclic aromatic, C1-20 aliphatic, C1-20 heteroaliphatic, C3-20 cycloaliphatic, and C2-20 heterocycloaliphatic, each of which may be substituted or unsubstituted; and two or more substituents of formula (1) attached to the core: wherein: Ar1 is an aromatic group independently chosen from C6-50 carbocyclic aromatic and C2-50 heteroaromatic, each of which may be substituted or unsubstituted; Z is a substituent independently chosen from OR1, protected hydroxyl, carboxyl, protected carboxyl, SR1, protected thiol, —O—C(═O)—C1-6 alkyl, halogen, and NHR2; wherein each R1 is independently chosen from H, C1-10 alkyl, C2-10 unsaturated hydrocarbyl, and C5-30 aryl; each R2 is independently chosen from H, C1-10 alkyl, C2-10 unsaturated hydrocarbyl, C5-30 aryl, C(═O)—R1, and S(═O)2—R1; x is an integer from 1 to the total number of available aromatic ring atoms in Ar1; and * denotes the point of attachment to the core; provided that when the core comprises an aromatic ring, no substituents of formula (1) are in an ortho position to each other on the same aromatic ring of the core; and one or more solvents, wherein the total solvent content is from 50 to 99 wt % based on the coating composition. Coated substrates formed with the coating compositions and methods of forming electronic devices using the compositions are also provided. The compositions, coated substrates and methods find particular applicability in the manufacture of semiconductor devices.

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