公开(公告)号：US20170079142A1

公开(公告)日：2017-03-16

申请号：US15078452

申请日：2016-03-23

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jae-Ean LEE ,  Jung-Han LEE ,  Jin-Ho PARK ,  Jung-Hyun CHO ,  Yong-Ho BAEK

IPC: H05K1/18 ,  H05K3/00 ,  H05K1/09 ,  H05K3/46 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/183 ,  H01L23/13 ,  H01L23/49822 ,  H01L23/49827 ,  H05K3/4644 ,  H05K3/4697 ,  H05K2201/10674 ,  H05K2203/308

Abstract: A printed circuit board and a manufacturing method thereof are provided. A printed circuit board may include a first insulating layer comprising a photosensitive material on a core layer, a second insulating layer comprising a material comprising a reinforcing material on the first insulating layer, and a cavity formed in the first insulating layer and the second insulating layer.

Abstract translation: 提供一种印刷电路板及其制造方法。 印刷电路板可以包括在芯层上包括感光材料的第一绝缘层，包括在第一绝缘层上包含增强材料的材料的第二绝缘层和形成在第一绝缘层和第二绝缘层中的空腔 。

公开(公告)号：US20160374197A1

公开(公告)日：2016-12-22

申请号：US15139698

申请日：2016-04-27

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jae-Ean LEE ,  Jee-Soo MOK ,  Young-Gwan KO ,  Soon-Oh JUNG ,  Kyung-Hwan KO ,  Yong-Ho BAEK

IPC: H05K1/02 ,  H05K3/46 ,  H05K1/18 ,  H05K3/18 ,  H05K3/40 ,  H05K1/11 ,  H05K3/06

CPC classification number: H05K1/0298 ,  H01L23/13 ,  H01L23/49822 ,  H01L23/49827 ,  H05K1/111 ,  H05K1/113 ,  H05K1/183 ,  H05K3/06 ,  H05K3/061 ,  H05K3/188 ,  H05K3/40 ,  H05K3/4644 ,  H05K3/4652 ,  H05K3/4697 ,  H05K2201/09036 ,  H05K2203/308

Abstract: A printed circuit board includes: an insulating layer including a cavity formed therein, the cavity being recessed into the insulating layer from a top surface of the insulating layer; a first circuit layer formed inside the insulating layer such that a portion of the first circuit layer is disposed within the cavity; a second circuit layer disposed above the insulating layer; a first surface-treated layer disposed above the portion of the first circuit layer disposed within the cavity; and a second surface-treated layer disposed above the second circuit layer.

Abstract translation: 印刷电路板包括：绝缘层，其包括形成在其中的空腔，所述空腔从绝缘层的顶表面凹入绝缘层; 形成在所述绝缘层内的第一电路层，使得所述第一电路层的一部分设置在所述空腔内; 设置在所述绝缘层上方的第二电路层; 第一表面处理层，设置在设置在腔内的第一电路层的部分之上; 以及设置在第二电路层上方的第二表面处理层。

公开(公告)号：US20160381792A1

公开(公告)日：2016-12-29

申请号：US15174563

申请日：2016-06-06

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jee-Soo MOK ,  Young-Gwan KO ,  Jung-Hyun PARK ,  Jae-Ean LEE ,  Young Kuk KO ,  Going-Sik KIM

IPC: H05K1/02 ,  H05K3/46 ,  H05K3/40 ,  H05K1/11 ,  H05K3/00

CPC classification number: H05K1/0271 ,  H05K1/0206 ,  H05K1/053 ,  H05K3/429 ,  H05K3/4608 ,  H05K3/4661 ,  H05K3/4688 ,  H05K2201/096

Abstract: A printed circuit board in accordance with an embodiment includes a core layer, a photo imagable dielectric layer, and an inner circuit layer. The core layer includes a core stiffener layer, a first metal layer formed on an upper surface of the core stiffener layer, and a second metal layer formed on a lower surface of the core stiffener layer. The photo imagable dielectric layer is formed on an upper surface and a lower surface of the core layer. The inner circuit layer is formed on the photo imagable dielectric layer.

Abstract translation: 根据实施例的印刷电路板包括芯层，可光成像介质层和内电路层。 芯层包括芯加强件层，形成在芯加强件层的上表面上的第一金属层和形成在芯加强件层的下表面上的第二金属层。 可成像的介电层形成在芯层的上表面和下表面上。 内部电路层形成在可成像的介电层上。

公开(公告)号：US20160374196A1

公开(公告)日：2016-12-22

申请号：US15133944

申请日：2016-04-20

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jae-Ean LEE ,  Jee-Soo MOK ,  Young-Gwan KO ,  Soon-Oh JUNG ,  Kyung-Hwan KO ,  Yong-Ho BAEK

IPC: H05K1/02 ,  H05K3/46 ,  H05K3/40 ,  H05K1/11

CPC classification number: H05K3/4697 ,  H05K3/282 ,  H05K3/4007 ,  H05K3/4644 ,  H05K3/4673

Abstract: A printed circuit board includes: a first insulating layer; a first circuit layer disposed above the first insulating layer; a second insulating layer disposed above the first insulating layer; a second circuit layer disposed above the second insulating layer and constructed of a photosensitive material; and a protective layer disposed above the second insulating layer and surrounding the second circuit layer, wherein the protective layer includes a tunnel type cavity and exposes a portion of the second circuit layer to an outside environment, and wherein the second insulating layer exposes a portion of the first circuit layer located below the cavity to an outside environment.

Abstract translation: 印刷电路板包括：第一绝缘层; 设置在所述第一绝缘层上方的第一电路层; 设置在所述第一绝缘层上方的第二绝缘层; 第二电路层，设置在所述第二绝缘层上并由感光材料构成; 以及保护层，其设置在所述第二绝缘层的上方并且围绕所述第二电路层，其中所述保护层包括隧道型腔，并将所述第二电路层的一部分暴露于外部环境，并且其中所述第二绝缘层暴露所述第二绝缘层的一部分 第一电路层位于空腔下面到外部环境。

公开(公告)号：US20160242277A1

公开(公告)日：2016-08-18

申请号：US15041925

申请日：2016-02-11

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jae-Ean LEE ,  Jee-Soo MOK ,  Young-Gwan KO ,  Soon-Oh JUNG ,  Kyung-Hwan KO ,  Yong-Ho BAEK

IPC: H05K1/02 ,  H05K3/46 ,  H05K3/16 ,  H05K1/11

CPC classification number: H05K3/4697 ,  H05K1/113 ,  H05K3/282 ,  H05K3/4007 ,  H05K3/4644 ,  H05K2201/09472

Abstract: A printed circuit board and method of manufacturing the same are provided. The printed circuit board includes a first substrate including a first insulation layer and a first circuit layer including a bonding pad, the bonding pad disposed on the first insulation layer, a second substrate disposed on the first substrate and having a cavity exposing the bonding pad to an outside, and a dam disposed between the bonding pad and an inner wall of the cavity.

Abstract translation: 提供一种印刷电路板及其制造方法。 印刷电路板包括：第一基板，包括第一绝缘层和第一电路层，第一电路层包括接合焊盘，所述接合焊盘设置在所述第一绝缘层上;第二基板，设置在所述第一基板上，并且具有将所述接合焊盘暴露于 外部和设置在接合焊盘和空腔的内壁之间的坝。