公开(公告)号：US20190198410A1

公开(公告)日：2019-06-27

申请号：US16272484

申请日：2019-02-11

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Yong-Ho BAEK

IPC: H01L23/31 ,  H01L23/538 ,  H01L21/56

CPC classification number: H01L23/315 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/15153

Abstract: A semiconductor package and a method of manufacturing a semiconductor package are disclosed. The semiconductor package including a first substrate including a first cavity, a cavity mold configured to be inserted into the first cavity and including a second cavity, an electronic component inserted in the second cavity, and a second substrate formed on a surface of the first substrate, a surface of the cavity mold and a surface of the electronic component.

公开(公告)号：US20160143142A1

公开(公告)日：2016-05-19

申请号：US14943866

申请日：2015-11-17

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jung-Hyun CHO ,  Yong-Ho BAEK ,  Young-Gwan KO ,  Jae-Hoon CHOI ,  Jung-Hyun PARK

IPC: H05K1/11 ,  H05K1/18 ,  H05K3/34

CPC classification number: H05K3/007 ,  H01L2224/04105 ,  H01L2224/2518 ,  H01L2224/92144 ,  H05K1/187 ,  H05K3/42 ,  H05K2201/10015

Abstract: An element embedded printed circuit board includes: a substrate including an insulation layer, a first circuit layer formed on a first surface of the insulation layer, and a second circuit layer formed on a second surface of the insulation layer; and an element including an electrode part and embedded in the insulation layer, wherein the electrode part is in contact with the first circuit layer.

Abstract translation: 元件嵌入式印刷电路板包括：基板，包括绝缘层，形成在绝缘层的第一表面上的第一电路层和形成在绝缘层的第二表面上的第二电路层; 以及包括电极部分并且嵌入在所述绝缘层中的元件，其中所述电极部分与所述第一电路层接触。

公开(公告)号：US20200029435A1

公开(公告)日：2020-01-23

申请号：US16587169

申请日：2019-09-30

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Yong-Ho BAEK ,  Jung-Hyun CHO ,  Seung-Yeop KOOK

IPC: H05K1/14 ,  H01L23/495 ,  H05K3/46 ,  H05K1/11 ,  H01L23/498 ,  H01L21/48

Abstract: A printed circuit board includes: a core member including a through-hole; a sub-circuit board disposed in the through-hole; a first insulating layer disposed on opposing surfaces of the core member and opposing surfaces of the sub-circuit board; and an insulating material disposed between an inner wall of the through-hole and the sub-circuit board.

公开(公告)号：US20160374196A1

公开(公告)日：2016-12-22

申请号：US15133944

申请日：2016-04-20

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jae-Ean LEE ,  Jee-Soo MOK ,  Young-Gwan KO ,  Soon-Oh JUNG ,  Kyung-Hwan KO ,  Yong-Ho BAEK

IPC: H05K1/02 ,  H05K3/46 ,  H05K3/40 ,  H05K1/11

CPC classification number: H05K3/4697 ,  H05K3/282 ,  H05K3/4007 ,  H05K3/4644 ,  H05K3/4673

Abstract: A printed circuit board includes: a first insulating layer; a first circuit layer disposed above the first insulating layer; a second insulating layer disposed above the first insulating layer; a second circuit layer disposed above the second insulating layer and constructed of a photosensitive material; and a protective layer disposed above the second insulating layer and surrounding the second circuit layer, wherein the protective layer includes a tunnel type cavity and exposes a portion of the second circuit layer to an outside environment, and wherein the second insulating layer exposes a portion of the first circuit layer located below the cavity to an outside environment.

Abstract translation: 印刷电路板包括：第一绝缘层; 设置在所述第一绝缘层上方的第一电路层; 设置在所述第一绝缘层上方的第二绝缘层; 第二电路层，设置在所述第二绝缘层上并由感光材料构成; 以及保护层，其设置在所述第二绝缘层的上方并且围绕所述第二电路层，其中所述保护层包括隧道型腔，并将所述第二电路层的一部分暴露于外部环境，并且其中所述第二绝缘层暴露所述第二绝缘层的一部分 第一电路层位于空腔下面到外部环境。

公开(公告)号：US20160242277A1

公开(公告)日：2016-08-18

申请号：US15041925

申请日：2016-02-11

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jae-Ean LEE ,  Jee-Soo MOK ,  Young-Gwan KO ,  Soon-Oh JUNG ,  Kyung-Hwan KO ,  Yong-Ho BAEK

IPC: H05K1/02 ,  H05K3/46 ,  H05K3/16 ,  H05K1/11

CPC classification number: H05K3/4697 ,  H05K1/113 ,  H05K3/282 ,  H05K3/4007 ,  H05K3/4644 ,  H05K2201/09472

Abstract: A printed circuit board and method of manufacturing the same are provided. The printed circuit board includes a first substrate including a first insulation layer and a first circuit layer including a bonding pad, the bonding pad disposed on the first insulation layer, a second substrate disposed on the first substrate and having a cavity exposing the bonding pad to an outside, and a dam disposed between the bonding pad and an inner wall of the cavity.

Abstract translation: 提供一种印刷电路板及其制造方法。 印刷电路板包括：第一基板，包括第一绝缘层和第一电路层，第一电路层包括接合焊盘，所述接合焊盘设置在所述第一绝缘层上;第二基板，设置在所述第一基板上，并且具有将所述接合焊盘暴露于 外部和设置在接合焊盘和空腔的内壁之间的坝。

公开(公告)号：US20160225706A1

公开(公告)日：2016-08-04

申请号：US15008247

申请日：2016-01-27

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jung-Hyun CHO ,  Young-Gwan KO ,  Il-Jong SEO ,  Yong-Ho BAEK

IPC: H01L23/498 ,  H01L21/48 ,  H01L21/683 ,  H01L23/00

CPC classification number: H01L23/49822 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2221/68345 ,  H01L2224/03828 ,  H01L2224/10175 ,  H01L2224/11334 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/131 ,  H01L2224/13294 ,  H01L2224/133 ,  H01L2224/16237 ,  H01L2224/81024 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81385 ,  H01L2224/81395 ,  H01L2224/814 ,  H01L2224/81411 ,  H01L2224/81424 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/8149 ,  H01L2224/81815 ,  H01L2224/92 ,  H01L2924/3512 ,  H01L2924/381 ,  H01L2924/3841 ,  H01L2924/014 ,  H01L2924/00014

Abstract: A printed circuit board, a semiconductor package and a method of manufacturing the same are provided. The printed circuit board includes a circuit layer including a buried pad embedded on an upper surface of an insulating layer, and a groove part disposed in the buried pad.

Abstract translation: 提供一种印刷电路板，半导体封装及其制造方法。 印刷电路板包括电路层，该电路层包括嵌入在绝缘层的上表面上的掩埋焊盘以及设置在掩埋焊盘中的槽部。

公开(公告)号：US20160081191A1

公开(公告)日：2016-03-17

申请号：US14733245

申请日：2015-06-08

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jee-Soo MOK ,  Yong-Ho BAEK ,  Young-Gwan KO

IPC: H05K1/11 ,  H05K1/18 ,  H05K3/30 ,  H05K3/40 ,  H05K3/02

CPC classification number: H05K3/4697 ,  H01L2224/16237 ,  H05K1/183 ,  H05K3/429 ,  H05K3/4623 ,  H05K3/4626 ,  H05K2201/0959 ,  H05K2203/063

Abstract: A printed circuit board and a manufacturing method thereof are disclosed. The printed circuit board in accordance with an aspect of the present invention includes: a base board having a pad formed on one surface thereof; a copper clad laminate laminated on the one surface of the base board and having a cavity formed therein such that the pad is placed within the cavity; and an insulating adhesive layer interposed between the base board and the copper clad laminate in such a way that the pad is exposed

Abstract translation: 公开了印刷电路板及其制造方法。 根据本发明的一个方面的印刷电路板包括：具有在其一个表面上形成的焊盘的基板; 层叠在基板的一个表面上并且具有形成在其中的腔的覆铜层压板，使得焊盘放置在腔内; 以及插入在基板和覆铜层压板之间的绝缘粘合剂层，使得该垫被暴露

公开(公告)号：US20170202083A1

公开(公告)日：2017-07-13

申请号：US15400606

申请日：2017-01-06

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Yong-Ho BAEK ,  Jung-Hyun CHO ,  Seung-Yeop KOOK

IPC: H05K1/14 ,  H05K1/11

CPC classification number: H05K1/14 ,  H01L21/4857 ,  H01L21/6835 ,  H01L23/49534 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/562 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H05K1/111 ,  H05K1/115 ,  H05K3/4694 ,  H05K2201/10674 ,  H01L2924/00

Abstract: A printed circuit board includes: a core member including a through-hole; a sub-circuit board disposed in the through-hole; a first insulating layer disposed on opposing surfaces of the core member and opposing surfaces of the sub-circuit board; and an insulating material disposed between an inner wall of the through-hole and the sub-circuit board.

公开(公告)号：US20170094797A1

公开(公告)日：2017-03-30

申请号：US15133586

申请日：2016-04-20

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yong-Ho BAEK ,  Kyung-Hwan KO ,  Jung-Hyun CHO ,  Jung-Hyun PARK

IPC: H05K1/18 ,  H05K3/32 ,  H05K3/46 ,  H05K3/00 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K3/4697 ,  H05K1/185 ,  H05K3/0011 ,  H05K3/0035 ,  H05K3/4682 ,  H05K2201/09127 ,  H05K2201/09563 ,  H05K2201/10636 ,  H05K2203/1469 ,  Y02P70/611

Abstract: A printed circuit board and a method of manufacturing the same is described herein. The printed circuit board includes a first insulating layer having a first circuit embedded in a first surface thereof, a second insulating layer disposed on a second surface of the first insulating layer, the second insulating layer having a cavity therein, an electronic component mounted inside the cavity with an adhesion member, and a third insulating layer disposed on the second insulating layer to embed the electronic component.

公开(公告)号：US20170079142A1

公开(公告)日：2017-03-16

申请号：US15078452

申请日：2016-03-23

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jae-Ean LEE ,  Jung-Han LEE ,  Jin-Ho PARK ,  Jung-Hyun CHO ,  Yong-Ho BAEK

IPC: H05K1/18 ,  H05K3/00 ,  H05K1/09 ,  H05K3/46 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/183 ,  H01L23/13 ,  H01L23/49822 ,  H01L23/49827 ,  H05K3/4644 ,  H05K3/4697 ,  H05K2201/10674 ,  H05K2203/308

Abstract: A printed circuit board and a manufacturing method thereof are provided. A printed circuit board may include a first insulating layer comprising a photosensitive material on a core layer, a second insulating layer comprising a material comprising a reinforcing material on the first insulating layer, and a cavity formed in the first insulating layer and the second insulating layer.

Abstract translation: 提供一种印刷电路板及其制造方法。 印刷电路板可以包括在芯层上包括感光材料的第一绝缘层，包括在第一绝缘层上包含增强材料的材料的第二绝缘层和形成在第一绝缘层和第二绝缘层中的空腔 。